The post-welding stage of pcba

High-speed placement capability: Utilizing high-speed pick-and-place machines (placement speed ≥ 50,000 points/hour), fully automatic solder paste printers (printing accuracy ±0.01mm), and reflow ovens (precise temperature control in 8-12 temperature zones), a fully automated production line is constructed. A single line can assemble 3,000-5,000 PCBs per day (based on smartphone motherboards), which is 50-100 times more efficient than manual assembly. For example, when assembling PCBs for laptop energy storage boards, the entire process of "solder paste printing → component placement → reflow soldering → inspection" can be automated, with a single board assembly time ≤ 3 minutes, matching the mass production rhythm of PCB processing. Continuous uninterrupted production: The production line supports 24-hour continuous operation. The MES system monitors equipment status and production progress in real time, automatically issuing early warnings for faults (such as pick-and-place machine nozzle blockage, abnormal reflow soldering temperature), reducing downtime maintenance time to ≤ 1 hour/day, and increasing the overall equipment efficiency (OEE) to ≥ 85%, ensuring on-time delivery of mass production orders.

 

Reduced labor costs: Automated production lines require only 2-3 people for monitoring and operation, replacing a traditional manual assembly team of 10-20 people. This increases per capita output by 10-15 times and reduces labor costs by 60%-80%. Improved material utilization: Solder paste printing uses stencils for precise dosage control (solder paste usage error per PCB ≤5%), achieving a component placement yield of ≥99.9% and reducing material waste. Simultaneously, large-scale procurement of placement consumables (such as solder paste and nozzles) can reduce material costs by 15%-20%, making the unit assembly cost of mass-produced products 40%-50% lower than small-batch manual assembly.