electronic potting compound3

2 month ago

20 0 

Shenzhen Hong Ye Jie Technology Co., Ltd

2 month

Product details

HONG YE SILICONE Thermally Conductive Potting Silicone is a high-performance two-component addition curing organic silicone, featuring low viscosity, UL94-V0 flame retardancy and excellent thermal conductivity (≥0.8 W(m·K)). It cures at room or elevated temperature (faster at higher temperatures), adheres well to PC, PP, ABS, PVC and metals, and reaches IP65 waterproof level. As a core product matching our Liquid Silicone, RTV 2 Silicone Rubber, Industrial Mold Silicone Rubber, Pad Printing Silicone and Silicone Encapsulant, it’s ideal for potting electronic components, power modules and outdoor displays, with customizable parameters and multiple packaging options, fully complying with EU ROHS directives and international standards.

Product Overview

Our Thermally Conductive Potting Silicone is a professional two-component addition curing material engineered for heat dissipation and protection of electronic components, a key part of HONG YE SILICONE’s full silicone product matrix. Unlike ordinary potting silicone, it integrates high thermal conductivity, flame retardancy and insulation, designed to solve heat accumulation issues of electronic devices while providing comprehensive protection. Uncured it has low viscosity and good fluidity; cured it forms a flexible rubber layer with excellent impact resistance, suitable for various electronic components and matching mass production needs of electronic manufacturing industries.

Product Features & Advantages

1. Superior thermal conductivity: Thermal conductivity ≥0.8 W(m·K), effectively dissipates heat generated by electronic components, prevents overheating damage and extends product service life.

2. UL94-V0 flame retardancy & EU ROHS compliance: Meets strict flame retardant standards, reduces fire risks, and fully complies with EU environmental directives, suitable for global market sales.

3. IP65 waterproof & all-round protection: Achieves IP65 waterproof level, with excellent moisture-proof, dust-proof, heat-resistant and cold-resistant performance, operating stably from -60℃ to 220℃.

4. Flexible curing & easy operation: Cures at room temperature (4-5 hours) or heating (20 minutes at 80℃), with faster curing at higher temperatures; low viscosity and good fluidity, easy to pot complex components.

5. Strong adhesion & flexibility: Bonds firmly to PC, PP, ABS, PVC and metals; cured into a soft rubber layer with good impact resistance, avoiding component damage from vibration.

6. Excellent electrical insulation: Volume resistivity ≥1.0×10¹⁶ Ω·cm, dielectric strength ≥25 kV/mm, effectively preventing short circuits and ensuring electronic device safety.

Technical Specifications (HY-9315)

It is an addition curing silicone with Component A and B both being liquid, each with a viscosity of 500±100 cps, mixed at a 1:1 weight ratio. Mixed viscosity is 500±100 cps, operable time 0.5-2 hours, room-temperature curing time 4-5 hours, and 20 minutes at 80℃. Cured hardness is Shore A 15±5, thermal conductivity ≥0.8 W(m·K), dielectric constant 3.0～3.3 (1.2MHz), volume resistivity ≥1.0×10¹⁶ Ω·cm, linear expansion coefficient ≤2.2×10⁻⁴ m/(m·K), and UL94-V0 flame retardancy. These parameters are for HY-9315; other models and customizable parameters are available.

How to Use

1. Preparation: Fully stir Component A and B separately in their own containers to mix settled fillers evenly, avoiding stratification that affects curing effect.

2. Mixing: Blend Component A and B strictly at a 1:1 weight ratio, stir thoroughly to ensure uniform thermal conductivity and flame retardancy after curing.

3. Deaeration (Optional): Place the mixed silicone into a vacuum container, deaerate for 5 minutes under 0.08MPa to remove air bubbles, ensuring a smooth and bubble-free potting layer.

4. Potting & Curing: Pour the treated silicone onto target components; cure at room temperature or heat. For thick potting, extend curing time; in winter, heat to 80～100℃ for 15 minutes to accelerate curing.

Application Scenarios

Widely used for potting and protecting outdoor displays, electronic components, power modules and electronic modules, including washing machine control boards, pulse igniters, electric bicycle drive controllers and microcomputer control boards. It is also suitable for molding complex electronic accessories, ideal for electronic manufacturing, LED lighting, home appliances, new energy and industrial control industries, reducing component failure rate and after-sales costs.

Certifications and Compliance

HONG YE SILICONE holds ISO9001 quality management system certification, CE and UL certifications. Our Thermally Conductive Potting Silicone meets UL94-V0 flame retardant standards and EU ROHS directives, complying with global electronic material quality and environmental requirements, ensuring safe application in international projects and smooth market access worldwide.

Customization Options

We provide professional OEM customization services. According to customers’ application scenarios and production needs, we can customize key parameters such as thermal conductivity, hardness, viscosity, operable time and curing speed. Exclusive formulas for higher thermal conductivity or stricter flame retardant requirements are available to meet personalized bulk procurement needs.

Production Process

The product undergoes strict quality control: high-quality silicone raw materials inspection → precise formula mixing (ensuring thermal conductivity uniformity) → automated production and filling → pre-production sample performance testing → full inspection of finished products before shipment. Our professional QC team monitors the whole process, backed by 20+ years of silicone manufacturing experience, ensuring consistent performance of each batch.

FAQ

Q1: What packaging specifications are available? A1: 5kg, 20kg, 25kg and 200kg, suitable for small-batch testing and large-batch mass production.

Q2: What is the shelf life and storage method? A2: 1 year shelf life at below 25℃; store in sealed containers in a cool, dry place; it is non-hazardous and can be transported as general chemicals.

Q3: Why does curing time vary? A3: Curing speed is affected by temperature and potting thickness; lower temperature or thicker potting will extend curing time, which is normal.

Q4: Can it bond to different materials? A4: Yes, it adheres well to PC, PP, ABS, PVC and various metals, suitable for diverse electronic component potting needs.

Q5: Is the thermal conductivity customizable? A5: Yes, we can adjust thermal conductivity, viscosity and other parameters according to your specific heat dissipation requirements.