Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 2.50mm Pitch 180° Wafer With Boss Connector Series. This vertical wire to board header is designed for applications requiring secure PCB alignment and high vibration resistance. The 2.50mm pitch offers a compact footprint while maintaining adequate creepage distance. The housing is molded from high temperature UL94 V-0 PBT or nylon 66, featuring integrated positioning bosses (plastic pegs) on the mounting interface. These bosses ensure precise alignment during PCB insertion, preventing shifting during wave soldering and improving assembly yield. Contacts are stamped from phosphor bronze with selective tin or gold plating, rated up to 5A per circuit. Key specifications include contact resistance below 15 milliohms, insulation resistance above 1000 megohms, dielectric strength 1000V AC, and operating temperature from -40 to +105 degrees Celsius. The 180° straight orientation allows vertical cable exit, ideal for stacked board configurations. RoHS and REACH compliant, UL recognized under E472792.
Applications include automotive ECU modules, industrial power supplies, battery management systems, home appliances, and LED lighting drivers where PCB alignment and retention are critical. Usage method: insert the header into the PCB, with the bosses fitting into corresponding tooling holes (typically 1.5mm diameter). Solder the through hole pins using wave or hand soldering. The bosses prevent movement during soldering and provide additional mechanical retention. Mate with a corresponding 2.50mm crimp style female housing. Precautions: do not exceed 5A per circuit, ensure PCB tooling holes are accurately drilled, verify boss engagement before soldering. Advantages over competitors: Antenks wafer with boss eliminates the need for separate mounting brackets, reducing component count. The bosses increase pullout force by approximately 30 percent compared to bossless designs. Dual beam contacts maintain stable normal force over 1500 mating cycles. Tight coplanarity within 0.08mm and precise boss positioning (tolerance ±0.05mm) ensure reliable automated assembly. Low MOQs of 1000 units with no tooling fees for standard pin counts.
Production process: in house mold design with integrated boss cavity, injection molding on 10 Japanese and Taiwanese machines, high speed stamping of dual beam contacts on 9 presses, selective plating (tin or gold), automated pin insertion, 100 percent coplanarity and boss position inspection, contact resistance and insulation tests, thermal shock test (100 cycles), 48 hour salt spray test, and final QC with lot traceability. Free samples, 2D and 3D CAD drawings with PCB layout recommendations, and 24 hour technical support available. Contact Antenk for custom boss height, plating, and pin counts.