2.54mm Box Header SMT H=9.0 (with or without Post)

Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 2.54mm Box Header SMT H=9.0, available with or without locating posts. This surface mount shrouded header features a 2.54mm pitch, single or dual row configuration, and a closed box insulator that fully surrounds the pins, providing superior pin protection and polarization. The overall height of 9.0mm offers a low profile while maintaining compatibility with standard female socket connectors. The housing is molded from high temperature UL94 V-0 LCP or PBT, capable of withstanding 260°C reflow soldering without warpage. The optional locating posts (plastic pegs) on the bottom of the header ensure precise placement on the PCB, preventing shifting during reflow and increasing mechanical retention. Contacts are stamped from phosphor bronze with selective gold or tin plating on the mating area, and pure tin on the SMT tails. Key specifications include current rating 3A per contact, contact resistance below 20 milliohms, insulation resistance above 1000 megohms, dielectric strength 500V AC, and operating temperature from -40 to +105 degrees Celsius. The boxed design features a polarization key to prevent misinsertion. RoHS and REACH compliant, UL recognized under E472792.

Applications include industrial control panels, medical devices, automotive electronics, consumer appliances, and communication equipment where reliable SMT assembly and pin protection are required. Usage method: the header is supplied on tape and reel for automatic pick and place. Solder the SMT tails using standard reflow soldering with peak 260°C and stencil thickness of 0.12mm. If the version with posts is selected, ensure PCB has corresponding tooling holes (typically 1.5mm diameter) for proper alignment. Mate with a 2.54mm female socket or IDC receptacle. Precautions: do not exceed 3A per contact, avoid excessive reflow cycles, ensure PCB land pattern matches recommended footprint. Advantages over competitors: Antenks SMT box header with posts eliminates soldering shift, improving alignment accuracy by up to 50 percent compared to postless designs. The high temperature LCP housing prevents solder wicking into the box cavity. Coplanarity is controlled within 0.08mm to prevent tombstoning. Low MOQs of 1000 units with no tooling fees for both post and postless versions.

Production process: in house mold design with optional post cavity, injection molding on 10 Japanese and Taiwanese machines, high speed stamping of pins on 9 presses, selective gold or tin plating, automated pin insertion, SMT tail coining for flatness, 100 percent coplanarity and post position inspection (if applicable), contact resistance and insulation tests, reflow simulation test (260°C, 3 passes), 48 hour salt spray test, tape and reel packaging, and final QC with lot traceability. Free samples, 2D and 3D CAD drawings, and 24 hour technical support available. Contact Antenk for custom post heights, plating, and pin counts.