2.54mm Pin Header DualRow Angle SMT Type

2 month ago

7 0 

5 year

Product details

Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 2.54mm Pin Header Dual Row Angle SMT Type. This right angle surface mount male header features a 2.54mm pitch, dual row configuration, and 90° bent pins, designed for parallel PCB mounting with perpendicular cable or card insertion. The SMT termination eliminates through holes, reducing PCB cost and enabling double sided assembly. The insulator is molded from high temperature UL94 V-0 LCP or PBT, capable of withstanding 260°C reflow soldering without warpage. Contacts are stamped from phosphor bronze with selective gold or tin plating on the mating area, and pure tin on the SMT tails. The right angle design includes molded polarization posts to ensure correct orientation during pick and place. Key specifications include current rating 3A per contact, contact resistance below 20 milliohms, insulation resistance above 1000 megohms, dielectric strength 500V AC, and operating temperature from -40 to +105 degrees Celsius. The dual row layout doubles connection density without increasing PCB length. RoHS and REACH compliant, UL recognized under E472792.

Applications include compact power supplies, LED lighting modules, industrial control boards, medical devices, and consumer electronics where board space is constrained and automated assembly is required. Usage method: the header is supplied on tape and reel for automatic pick and place. Solder the SMT tails using standard reflow soldering with peak 260°C and stencil thickness of 0.12mm. Ensure PCB land pattern matches recommended footprint. Mate with a 2.54mm dual row female header or IDC socket. Precautions: do not exceed 3A per contact, avoid excessive reflow cycles, ensure proper alignment before soldering. Advantages over competitors: Antenks right angle SMT header maintains pin coplanarity within 0.05mm, preventing tombstoning. The LCP housing resists solder wicking, and the polarized design eliminates orientation errors. Low MOQs of 1000 units with no tooling fees for standard pin counts.

Production process: in house mold design, injection molding on 10 Japanese and Taiwanese machines, high speed stamping of pins on 9 presses, selective gold or tin plating, automated pin insertion and right angle forming, SMT tail coining for flatness, 100 percent coplanarity and pin alignment inspection, contact resistance and insulation tests, reflow simulation (260°C, 3 passes), 48 hour salt spray test, tape and reel packaging, and final QC with lot traceability. Free samples, 2D and 3D CAD drawings, and 24 hour technical support available. Contact Antenk for custom plating, pin counts, and packaging.

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HuiZhou Antenk Electronics Co., LTD

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5 year

Main Product: Connectors , Wire harness , Board to board connector , Wire to board connector , Battery holders , Industrial connector

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