2.54mm Female Header Dual Row SMT Type With Bump

1、Product Description

Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 2.54mm Female Header Dual Row SMT Type With Bump. This surface mount dual row socket features an innovative design with molded positioning bumps on the bottom of the insulator. These bumps provide several key benefits: they ensure precise alignment with PCB locating holes, prevent component shifting during reflow soldering, and enhance mechanical retention after assembly. The header uses a 2.54mm pitch, dual row configuration, and straight vertical orientation. The housing is molded from high temperature UL94 V-0 LCP or PBT, capable of withstanding 260°C reflow soldering without warpage. Contacts are stamped from phosphor bronze with selective gold or tin plating on the mating area and pure tin on the SMT tails, featuring a dual leaf spring design for reliable gas tight connection. Key specifications include current rating 3A per contact, contact resistance below 20 milliohms, insulation resistance above 1000 megohms, dielectric strength 500V AC, and operating temperature from -40 to +105 degrees Celsius. The bumps also act as standoffs, allowing flux cleaning underneath the component. RoHS and REACH compliant, UL recognized under E472792.

 

Applications include automotive control modules, medical devices, industrial automation, communication equipment, and consumer electronics where high volume SMT assembly and precise alignment are critical. Usage method: the header is supplied on tape and reel for automatic pick and place. The positioning bumps fit into corresponding tooling holes on the PCB (typically 1.0mm diameter). Solder the SMT tails using standard reflow soldering with peak 260°C and stencil thickness of 0.12mm. The bumps prevent lateral movement during reflow. Mate with a 2.54mm dual row pin header. Precautions: do not exceed 3A per contact, ensure PCB tooling holes are accurately drilled, avoid excessive reflow cycles. Advantages over competitors: Antenks bump design increases placement accuracy by up to 40 percent compared to bump less SMT headers, eliminating tombstoning and misalignment. The dual leaf spring contacts provide stable normal force over 1500 mating cycles. Coplanarity is controlled within 0.05mm for uniform soldering. Low MOQs of 1000 units with no tooling fees.

 

Production process: in house mold design with integrated bump cavities, injection molding on 10 Japanese and Taiwanese machines, high speed stamping of dual leaf contacts on 9 presses, selective gold or tin plating, automated contact insertion, 100 percent coplanarity and bump position inspection, contact resistance and insulation tests, reflow simulation (260°C, 3 passes), 48 hour salt spray test, tape and reel packaging, and final QC with lot traceability. Free samples, 2D and 3D CAD drawings, and 24 hour technical support available. Contact Antenk for custom plating, bump height, and pin counts.