Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 2.54mm Box Header SMT H=9.0, available with or without integral locating posts. This shrouded surface mount header features a 2.54mm pitch, single or dual row configuration, and a closed box design that fully encloses the pins for superior protection against shorting and mechanical damage during handling. The overall height of 9.0mm provides a robust mating interface while maintaining compatibility with standard female socket connectors. The housing is molded from high temperature UL94 V-0 LCP or PBT, capable of withstanding 260°C reflow soldering without warpage. The optional locating posts (plastic pegs) on the bottom of the header ensure precise board placement, prevent shifting during reflow, and increase mechanical shear strength. Contacts are stamped from phosphor bronze with selective gold or tin plating on the mating area and pure tin on the SMT tails. Key specifications include current rating 3A per contact, contact resistance below 20 milliohms, insulation resistance above 1000 megohms, dielectric strength 500V AC, and operating temperature from -40 to +105 degrees Celsius. A polarization key in the shroud prevents misinsertion. RoHS and REACH compliant, UL recognized under E472792.
Applications include automotive ECUs, medical monitoring equipment, industrial control modules, consumer appliances, and communication devices requiring reliable SMT interconnect with pin protection. Usage method: the header is supplied on tape and reel for automatic pick and place. If the post version is selected, ensure PCB has corresponding tooling holes (typically 1.5mm diameter). Solder the SMT tails using standard reflow soldering (peak 260°C) with stencil thickness of 0.12mm. The posts align the component during placement, eliminating tombstoning. Mate with a 2.54mm female socket or IDC receptacle. Precautions: do not exceed 3A per contact, avoid excessive reflow cycles, ensure proper PCB land pattern. Advantages over competitors: Antenks post option increases shear force resistance by 40 percent compared to postless designs, and the high temperature LCP housing prevents solder wicking into the box cavity. Coplanarity is controlled within 0.08mm, ensuring reliable solder joints. Low MOQs of 1000 units with no tooling fees for both post and postless versions.
Production process: in house mold design with optional post cavity, injection molding on 10 Japanese and Taiwanese machines, high speed stamping of pins on 9 presses, selective gold or tin plating, automated pin insertion, SMT tail coining, 100 percent coplanarity and post position (if applicable) inspection, contact resistance and insulation tests, reflow simulation (260°C, 3 passes), 48 hour salt spray test, tape and reel packaging, and final QC with lot traceability. Free samples, 2D and 3D CAD drawings, and 24 hour technical support available. Contact Antenk for custom post heights, plating, and pin counts.
