2.00mm Box Header SMT H=5.75 -BHCM01

1、Product Description

Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 2.00mm Box Header SMT H=5.75. This ultra low profile shrouded surface mount header features a 2.00mm pitch, single or dual row configuration, and a compact overall height of just 5.75mm from PCB top to the top of the shroud. The 2.00mm pitch allows higher density than 2.54mm types, while the boxed shroud fully protects the pins from damage and prevents misinsertion with a polarization key. The housing is molded from high temperature UL94 V-0 LCP or PBT, capable of withstanding 260°C reflow soldering without warpage. Contacts are stamped from phosphor bronze with selective gold or tin plating on the mating area and pure tin on the SMT tails. Key specifications include current rating 2A per contact, contact resistance below 20 milliohms, insulation resistance above 1000 megohms, dielectric strength 500V AC, and operating temperature from -40 to +105 degrees Celsius. The 5.75mm height optimizes board stacking and fits into slim enclosures where standard 9.0mm headers are too tall. RoHS and REACH compliant, UL recognized under E472792.

 

Applications include portable medical devices, smart watches, wireless earbud charging cases, handheld test equipment, compact power modules, and any space constrained electronics requiring reliable board to board or wire to board connections. Usage method: the header is supplied on tape and reel for automatic pick and place. Solder the SMT tails using standard reflow soldering with peak 260°C and stencil thickness of 0.12mm. Mate with a 2.00mm female socket or IDC receptacle; the polarized shroud ensures correct orientation. Precautions: do not exceed 2A per contact, avoid excessive reflow cycles, ensure PCB land pattern matches recommended footprint. Advantages over competitors: Antenks 5.75mm height is 30 percent lower than standard 2.00mm box headers (typically 8.0mm), enabling thinner product designs. The high temperature LCP housing prevents solder wicking, and coplanarity is maintained within 0.05mm for reliable solder joints. Low MOQs of 1000 units with no tooling fees for standard pin counts.

 

Production process: in house mold design, injection molding on 10 Japanese and Taiwanese machines using LCP/PBT, high speed stamping of pins on 9 presses, selective gold or tin plating, automated pin insertion, SMT tail coining, 100 percent coplanarity and shroud dimension inspection, contact resistance and insulation tests, reflow simulation (260°C, 3 passes), 48 hour salt spray test, tape and reel packaging, and final QC with lot traceability. Free samples, 2D and 3D CAD drawings, and 24 hour technical support available. Contact Antenk for custom plating, pin counts, and tape and reel options.