2.2X3.0x2.3mm Pin Header DualRow SMT Type

Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 2.2x3.0x2.3mm Pin Header Dual Row SMT Type, a precision surface mount connector engineered for high-density PCB interconnections in demanding electronic applications. This dual row header features a compact 2.2mm pitch (row spacing 3.0mm) with an ultra-low profile height of 2.3mm, making it ideal for space-constrained designs. The insulator is molded from high-temperature PA9T thermoplastic (UL94 V-0 rated, black), offering excellent heat resistance up to 260°C reflow soldering without warpage. Contacts are stamped from brass with selective gold or tin over nickel plating, available in various plating options including gold flash, 3U, 5U, 10U, 15U, 30U gold, or tin to suit different application requirements【7†L10-L20】【7†L30-L37】. Key electrical specifications per the attached datasheet include current rating 3.0A per contact, contact resistance 20 milliohms max, insulation resistance 1000 megohms min, dielectric withstand voltage 500V AC, and an extended operating temperature range from -65°C to +125°C【7†L14-L19】. The SMT design eliminates through-hole drilling, reducing PCB manufacturing costs and enabling double-sided board assembly. The product is RoHS and REACH compliant and UL recognized under E472792.

 

Applications include portable medical devices, automotive electronics, industrial control modules, communication equipment, and consumer electronics where high-density surface mount interconnections are required. Usage method: the header is supplied on tape and reel (with cap) for automatic pick-and-place assembly【7†L40-L41】. Solder the SMT tails using standard reflow soldering with peak 260°C and recommended stencil thickness of 0.12mm. The polarized housing prevents misinsertion, and the precise pin alignment ensures reliable mating with corresponding female headers. Precautions: do not exceed 3.0A per contact, avoid excessive reflow cycles, ensure PCB land pattern matches the recommended footprint (available in the datasheet). Advantages over competitors: Antenk's PA9T insulator material offers superior heat resistance and dimensional stability compared to standard PBT or nylon, ensuring consistent coplanarity within 0.05mm to prevent tombstoning during reflow【7†L19-L20】. The wide range of gold plating options (from flash to 30U) allows customers to select the optimal cost-performance balance for their specific application. Low MOQs of 1000 units with no tooling fees for standard configurations.

 

Production process: in-house mold design and fabrication → precision injection molding on 10 Japanese/Taiwanese machines using PA9T resin → high-speed stamping of brass contacts on 9 precision presses → selective gold or tin barrel plating → automated pin insertion into dual row housing → 100% coplanarity and pin alignment inspection using vision systems → contact resistance (≤20mΩ) and insulation resistance (≥1000MΩ) testing → dielectric withstand (500V AC) test → 48-hour salt spray corrosion test → tape and reel packaging with cap → final QC with lot traceability【7†L30-L31】. With over 300 employees, 180+ automatic assembly machines, and in-house terminal stamping and injection molding capabilities, Antenk delivers fast turnaround and full customization. Free samples, 2D and 3D CAD drawings, and 24-hour technical support are available. Contact Antenk for custom pin lengths, plating options, and packaging requirements.