Multi Height PA6T SMT Insulator Housing provides diverse plastic height options to satisfy various thin PCB assembly space limits.
0.4SQ Square Brass SMT Pin maintains stable electrical conduction and consistent solderability for miniature SMT circuit connection.
Locating Peg Dual Row Header delivers accurate positioning during automated reflow soldering to improve PCB mounting precision.
1. Electrical Parameters
1.1 Rated Current: 1 Amp
1.2 Dielectric Withstand Voltage: AC 500V
1.3 Max Contact Resistance: 20 milliohms
1.4 Min Insulation Resistance: 1000 Megohms
2. Environmental Index
2.1 Operating Temperature: -65°C ~ +125°C
2.2 Compliance Standard: RoHS, HSF, Lead-free without Pb
3. Material Configuration
3.1 Standard Insulator: Black PA6T, UL94V-0 flame retardant
3.2 Optional High Temp Insulator: LCP, PA9T
3.3 Contact Raw Material: 0.4SQ square brass pin
4. Contact Plating Options
4.1 Full surface plating: Tin, gold flash, 3μ",5μ",10μ",15μ",30μ" gold
4.2 Selective plating: Selective gold flash, 3μ",5μ",10μ",15μ",30μ" gold
5. Dimension & Structural Specifications (Unit: mm)
5.1 Standard Pin Pitch: 1.27
5.2 Fixed Overall Width: 3.0
5.3 Optional Insulator Heights: 1.6, 2.0, 2.5
5.4 Available Pin Count: Dual row 02P to 100P
5.5 Two Structure Types: Type A without locating pegs, Type B with locating pegs
5.6 General Tolerance Rules: X.±0.35, X.X±0.25, X.XX±0.20, X.XXX±0.15
6. Available Packaging Modes
6.1 A: Tray packing
6.2 B: Bag packing
6.3 T: Tube packing
6.4 U: Tube with CAP packing
6.5 R: Tape & reel packing
6.6 W: Tape & reel with CAP packing
7. Main Application Scenarios
7.1 Liquid crystal display modules, digital cameras
7.2 Communication equipment, industrial control panels
7.3 Portable storage devices, digital household appliances
7.4 Electronic toys, computer peripheral products
7.5 Automotive electronics, precision measuring instruments
8. Operation & Storage Precautions
8.1 Match pin count, insulator height and locating peg type based on PCB circuit layout
8.2 Complete SMT reflow soldering strictly follow the official PCB layout drawing
8.3 Avoid strong squeezing force to prevent PA6T insulator deformation and pin bending
8.4 Choose suitable gold plating thickness according to plug frequency and service life demand
8.5 Store finished pin headers in dry sealed packages to prevent oxidation of nickel-gold plating layer
FAQ
Q: How many packaging do you have?
A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.
Q: Can you do our own packaging?
A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.
Q: How many different types of products your company manufactures?
A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.