UL94V0 LCP USB Housing Shell features high temperature resistance and flame retardancy to withstand DIP soldering thermal impact effectively.
Nickel Gold Plated Copper Alloy Contact offers low contact resistance and superior anti-corrosion performance for stable USB signal and power transmission.
Three Peg Vertical DIP USB Socket equips three positioning pegs to enhance fixing stability after through-hole soldering on PCBs.
1. Electrical Performance Parameters
1.1 Rated Current: 1.5A Max
1.2 Dielectric Withstanding Voltage: 100V AC
1.3 Max Contact Resistance: 30 milliohms
1.4 Min Insulation Resistance: 100 Megohms
1.5 Max Mating Force: 3.57kgf
1.6 Min Unmating Force: 1.0gf
2. Environmental Performance
2.1 Operating Temperature Range: -55°C ~ +85°C
2.2 Compliance Standards: HSF, Pb-free, RoHS
3. Material Composition
3.1 Housing Material: Black glass filled LCP, UL94V-0 flame retardant thermoplastic
3.2 Contact Material: 0.30mm thick copper alloy / ferroalloy alloy
3.3 Shell Material Options: Brass, Iron, Stainless Steel, 0.30mm thickness, full nickel plating
3.4 Contact Plating Structure: Full nickel underlayer, gold plating on contact area, tin plating on solder feet
4. Customizable Gold Plating Thickness
4.1 G0: Gold flash
4.2 G1: 3μ" Gold
4.3 G2: 5μ" Gold
4.4 G3: 10μ" Gold
4.5 G4: 15μ" Gold
4.6 G5: 30μ" Gold
5. Dimensional & Structural Info (Unit: mm)
5.1 Body Height: Short body 10.5
5.2 Mounting Structure: Vertical DIP type with 3 positioning pegs
5.3 General Tolerance Rules: X.±0.35, X.X±0.25, X.XX±0.20, X.XXX±0.15
5.4 PCB board recommended thickness: 1.6
6. Packaging Options
6.1 A: Tray packing
6.2 B: Bag packing
6.3 C: Tube packing
6.4 D: Tape & reel packing
7. Application Scenarios
7.1 Liquid crystal display modules, digital cameras
7.2 Communication equipment, industrial control panels
7.3 Portable storage devices, digital household appliances
7.4 Electronic toys, computer peripheral hardware
7.5 Automotive electronics, precision measuring instruments
8. Operation & Storage Precautions
8.1 Complete vertical through-hole DIP soldering strictly follow official PCB layout drawing
8.2 Avoid heavy impact or extrusion to prevent LCP housing crack and alloy contact deformation
8.3 Select appropriate gold plating thickness based on plugging cycles and service life requirements
8.4 Choose shell material according to anti-interference and cost demands
8.5 Store finished USB sockets in dry sealed packages to prevent oxidation of nickel gold plating layers
FAQ
Q: How many packaging do you have?
A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.
Q: Can you do our own packaging?
A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.
Q: How many different types of products your company manufactures?
A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.