1. LCP GF UL94V 0 Type C Insulator provides excellent high temperature resistance and flame retardant performance for SMT USB‑C reflow soldering applications.
2. High Conductivity Copper Terminal ensures stable 5A current transmission and reliable signal contact under long‑term plug and pull operations.
3. SUS201 Nickel Plated Shell offers robust mechanical protection and anti‑corrosion property for daily repeated mating of the Type‑C receptacle.
Detailed Specifications:
1. Electrical Parameters
1.1 Rated Current: 5A
1.2 Working Voltage: 5V, Max 20V
1.3 Maximum Initial Contact Resistance: 40mΩ
1.4 Minimum Insulation Resistance: 100MΩ
1.5 Dielectric Withstanding Voltage: 100V AC R.M.S.
2. Material & Surface Finishing
2.1 Insulator Core: LCP +30% G.F, UL94V‑0 flame retardant grade
2.2 Terminal: High‑conductivity copper; nickel base minimum 50U", contact area gold plating 1u", soldering area gold flash
2.3 Outer Shell: SUS201, thickness 0.30mm, nickel plating minimum 50U"
2.4 Inner Clip Sheet: SUS301
3. Mechanical Performance
3.1 Insertion Force: 5‑20N; 5‑20N after durability test
3.2 Extraction Force: 8‑20N; 6‑20N after durability test
3.3 Durability Mating Cycles: 10000 cycles
3.4 SMT Reflow Resistance: Peak temperature 260℃±5℃, no blistering, melting or excessive warpage
3.5 Solder Requirement: Solder coverage over 95%
3.6 Minimum Salt Spray Test: 24 hours
4. Dimensional Standards (Unit: mm)
4.1 Unspecified dimensional tolerance: ±0.05mm
4.2 Special recommended dedicated PCB layout for SMT mounting
5. Environmental Performance
5.1 Operating Temperature Range: ‑30℃ ~ +85℃
6. Compliance Standard
6.1 Compliant with RoHS environmental requirements
7. Packaging Mode
7.1 Tape and reel packaging for automated SMT production
8. Application Scenarios
8.1 Liquid crystal display modules, digital cameras
8.2 Communication hardware, industrial control panels
8.3 Portable storage devices, digital household appliances
8.4 Electronic toys, computer peripherals
8.5 Automotive electronic assemblies, precision measuring instruments
9. Operation & Storage Precautions
9.1 Complete SMT reflow soldering strictly follow official recommended PCB layout drawings
9.2 Avoid excessive plug‑pull force to prevent shell deformation and terminal damage
9.3 Ensure sufficient soldering coverage to meet 95 percent solder area requirement
9.4 Store finished connectors in dry sealed packages to avoid plating layer corrosion
FAQ
Q: How many packaging do you have?
A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.
Q: Can you do our own packaging?
A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.
Q: How many different types of products your company manufactures?
A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.
Product Drawing: