2.00mm Pitch Vertical SMT Wafer Connector

Product Description:

Huizhou Antenk Electronics Co., Ltd. manufactures AW2013V M X XP series 2.00 millimeter pitch 180 degree vertical SMT wafer connector to deliver stable wire to board signal and power interconnection via surface mount soldering on printed circuit boards. This vertical SMT wafer header mates with AH2013 series housing and supports pole options ranging from 2 poles up to 15 poles, insulator housing adopts PA9T material with UL94V 0 flame retardant grade, brass pins apply tin over nickel plating and built with mylar protection structure. It is rated for 3A AC DC current and 125V AC DC voltage, reaches 500V AC one minute dielectric strength and minimum 1000 megaohm insulation resistance, contact resistance stays under 10 milliohm and remains within 20 milliohm after environmental testing, operating temperature ranges from minus 40 degree Celsius to plus 105 degree Celsius. Different pole numbers create different outline dimensions to meet compact PCB layout demands. This product satisfies RoHS and REACH standards and works for consumer electronics smart home appliances and industrial control modules. Operators must adopt official PCB layout for SMT soldering assembly and store products under dry surroundings to avoid brass pin oxidation. Unlike competitors outsourcing stamping molding and plating Antenk carries out full in house production including independent mold development brass terminal stamping plastic injection molding multi grade electroplating and comprehensive laboratory reliability testing. We obtain ISO9001 ISO14001 IATF16949 and UL certifications, provide custom configuration solutions and round the clock engineering support, more than seventy percent of connector goods are exported worldwide. Feel free to share your project specifications for sample quotation and full datasheet resources.