Low Viscosity Electronic Potting Liquid Silicone
2 month ago
Product details
Ultra Shield Electronic Encapsulant is a two-part addition cure silicone encapsulant, also known as electronic potting compound, moisture proof electronic sealant and thermally conductive potting compound. This silicone encapsulant offers high voltage insulation, thermal dissipation, waterproof & shock resistance. It firmly bonds PCB, PC, PMMA, CPU and multiple metals, protecting electronics from harsh environments. HONG YE SILICONE supports customized parameters for global buyers.
Product Overview
Ultra Shield Electronic Encapsulant is a high-performance silicone encapsulant, categorized as electronic potting compound and electronic encapsulation adhesive. As a moisture proof electronic sealant and impact resistant protective coating, this two-component silicone potting material cures after mixing A and B parts. It delivers waterproof, moisture-proof, dust-proof, insulating and thermal conductive protection for electronic assemblies. It has strong adhesion to PCB, PC, PMMA and CPU substrates, and works well alongside our mold making silicone rubber, pad printing silicone, liquid silicone foam and medical grade silicone.
Product Features
- Wide operating temperature range: -60℃ to 220℃. It absorbs thermal cycling stress and protects chips and bonding wires.
- Great moisture & corrosion resistance, ozone resistance, high voltage insulation and shock absorption.
- Low volatile content, high mechanical strength, reliable adhesion to aluminum, copper and stainless steel.
- Two options: addition curing RTV silicone and condensation curing silicone rubber.
- Flexible curing: room temperature curing or heat accelerated curing; full cure takes 24 hours.
Application Scenarios
This thermally conductive potting compound is used for encapsulation, sealing, filling and pressure buffer of electronic components. It fits LED displays, power modules, circuit boards and CPU assemblies. It maintains stable sealing and thermal performance on PC, PMMA and PCB materials. It reduces field failure rates and extends service life of electronics for manufacturers.
How to Use
- Stir component A fully to re-disperse settled fillers, shake component B well.
- Mix A and B strictly following the required weight ratio.
- Vacuum degas the mixed silicone encapsulant at 0.01MPa for 3 minutes before pouring.
- Pour the mixture, cure at room temperature or elevated temperature. Full curing needs 24 hours. Ambient temperature and humidity affect curing speed.
Certifications and Compliance
Ultra Shield Electronic Encapsulant complies with ISO9001, CE and UL standards. All raw materials are inspected before production. Finished products pass final inspection before shipment, consistent with our factory quality control system.
Customization Options
HONG YE SILICONE offers custom formulations. Hardness, viscosity and working time of this electronic potting compound can be adjusted according to buyer’s technical requirements.
Production Process
Raw silicone materials are tested at incoming inspection. We mix, degas and package the silicone encapsulant under controlled workshop conditions. QC staff perform batch testing to guarantee stable performance. OEM service is available.
FAQ
Q1: Is this silicone encapsulant hazardous?
A: It is non-hazardous. Avoid contact with eyes and mouth. Rinse with clean water immediately
if contact occurs.
Q2: What if liquid separates after storage?
A: Slight layer separation is normal. Stir thoroughly before use, and properties remain unchanged.
Q3: Can leftover mixed glue be stored?
A: Mixed electronic potting compound must be used up once blended, as it will cure gradually.
Store A/B components in sealed containers.
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Suppliers
Shenzhen Hong Ye Jie Technology Co., Ltd
Audited supplier
10 month
Main Product:
Liquid silicone rubber,
Silicone raw materials,
Electronic Potting Compound,
Human Body Silicone ,
Tin cure silicone rubber,
Platinum silicone rubber