1. Compact Wire To Board Wafer provides stable power and signal interconnection for space constrained electronic device assemblies.
2. Surface Mount Wafer Header supports automated reflow soldering to boost production efficiency for high volume PCB manufacturing.
3. 180 Degree SMT Wafer delivers flat horizontal mounting performance to fit narrow internal space inside compact electronic products.
Detailed Specifications:
1. Mechanical Specifications
1.1 Product type: 180 degree single row SMT wafer wire to board connector
1.2 Measurement unit: millimeter
1.3 Key feature: 1.00 millimeter contact pitch, horizontal 180 degree mounting orientation for surface mount application
1.4 Assembly method: Surface mount device for PCB reflow soldering
1.5 CTA: Contact our engineering team to obtain full dimension drawings and PCB land pattern files for your hardware design validation.
2. Material Construction
2.1 Note: Full housing and terminal material information are shown in the official product datasheet. Please refer to released technical documents for exact material grade and plating specifications.
3. Electrical & Performance Parameters
3.1 Note: Rated voltage current and contact resistance data are documented in complete datasheet. Request technical files to get full electrical performance parameters.
4. Usage Method
4.1 Assembly mode: Mount onto printed circuit board by standard reflow soldering process
4.2 Operation tip: Align mating wire harness connector accurately before plugging in to achieve proper locking and electrical contact
5. Application Scenarios
5.1 Digital household appliance internal connection modules
5.2 Industrial control and intelligent hardware equipment
5.3 Communication device internal signal and power interconnection
5.4 Compact consumer electronic product assemblies
6. Operation & Storage Precautions
6.1 Follow drawing dimensional tolerance requirements strictly for PCB layout and mechanical enclosure design
6.2 Do not apply excessive force during mating and unmating to avoid terminal bending or plastic housing damage
6.3 Keep products in dry storage environment to prevent oxidation of metal contact surfaces
6.4 Comply with suggested reflow temperature profile to avoid thermal damage of plastic components during soldering
6.5 Confirm pitch row orientation and pin quantity before mechanical and circuit design
6.6 CTA: Submit your pin number and application project requirements, we can provide free sample evaluation and professional technical consultation.
FAQ
Q: How many packaging do you have?
A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.
Q: Can you do our own packaging?
A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.
Q: How many different types of products your company manufactures?
A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.
Product Drawing: