High Precision Cutting Wire

6 month ago

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Jiangyin Baoneng Precision New Material Co.,Ltd.

2 year

Product details

Brass Plated Steel Core Wire for Silicon Wafer Slicing

Diamond Wire & Silicon Wafer Slicing

Our high-strength brass-coated core wire is the essential base material for manufacturing premium electroplated diamond wire.

With ultra-high tensile strength, stable dimensional consistency, uniform brass coating and excellent surface adhesion performance, the core wire provides a perfect foundation for fixing diamond abrasive grains during the electroplating process. It effectively guarantees the structural stability, cutting durability and overall performance of the finished diamond wire.

The finished diamond wire, processed from our brass-coated core wire, is widely applied in high-precision slicing of hard and brittle materials in photovoltaic and semiconductor industries, including monocrystalline silicon, polycrystalline silicon, silicon ingots and silicon boules.

Adopting fixed-abrasive diamond wire slicing technology, the processed wire achieves ultra-thin cutting thickness, minimal kerf loss, smooth wafer surface and high slicing efficiency. It greatly improves the yield rate of silicon wafers and reduces comprehensive production costs for solar cell and semiconductor wafer manufacturing enterprises.

Our brass-coated core wire supports customized wire diameters and mechanical parameters to match different generations of diamond wire production and multi-wire slicing equipment, delivering reliable and consistent performance for mass silicon wafer production.

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Suppliers

Jiangyin Baoneng Precision New Material Co.,Ltd.

Audited supplier

2 year

Main Product: Brass Plated Sawing Wire, Brass Plated Wire Rope, Diamond Wire, Brass Plated Core Wire, Galvanized Wire Rope, Diamond Wire Saw

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