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Professional Electronic PCB Circuit Board, PCBA and PCB Assembly

3 year ago
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What is solder mask PCB?

PCB is basically composed of pads, vias, solder mask, silk screen layer, copper wire, etc. This article will analyze solder mask. What is solder mask? What is the role of solder mask?
The solder mask refers to the part of the PCB that is covered by ink. Since most PCBs use green ink, the part of the green ink that can be seen is the solder mask. The role of the solder mask during PCBA Manufacturing's control of the reflow soldering process is very important. important.
In terms of solder mask material, it must be used through liquid wet process or dry film lamination. The dry film solder mask material is supplied in a thickness of 0.07-0.1mm (0.03-0.04″), which can be suitable for some Surface-Mount (SMT) &BGA Assembly products, but this material is not suitable for the denser pitch PCB.
Solder mask is divided into 3 types:
Spot welding: The weldment is pressed between two cylindrical electrodes, energized and heated, so that the weldment melts at the contact point to form a nugget, then the power is cut off, and solidifies and crystallizes under pressure to form a dense welded joint. Spot welding is suitable for welding thin plates (lap joints) and steel bars below 4 mm, and is widely used in the production of automobiles, airplanes, electronics, instruments and daily necessities.

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Seam welding: Seam welding is similar to spot welding, the difference is that a rotating disk electrode is used instead of a cylindrical electrode. The superimposed workpiece is pressurized and energized between the discs, and fed along with the rotation of the discs to form a continuous weld.
Seam welding is suitable for welding thin plates with a thickness of less than 3 mm, and is mainly used in the production of airtight containers and pipes.
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Butt welding: According to different welding processes, butt welding can be divided into resistance butt welding and flash butt welding.
If it is not handled properly, the solder mask will have defects such as uneven solder mask, false copper exposure, base material bumps, and broken wires. Therefore, pay attention to the operation points when handling solder mask.

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