Hongke Mold Launches Precision 1+1 plastic injection Mold for Circuit Board Potting Boxes & Lids: Engineered for High-Performance PA66+30%GF
At Hongke Mold, we redefine excellence in plastic injection mould and plastic injection moulding solutions with our latest innovation: a 1+1 cavity plastic injection mould designed for circuit board potting boxes and lids. Crafted for PA66+30%GF (30% glass fiber-reinforced polyamide), this mold delivers unmatched precision, durability, and efficiency—perfect for industries demanding robust, heat-resistant enclosures.
Key Features of the Injection Mold for Potting Box & Lid
1+1 Cavity Design for Streamlined Production
The 1+1 cavity configuration enables simultaneous injection molding of a potting box and its matching lid, reducing assembly time and ensuring perfect dimensional alignment. Optimized for tight tolerance plastic molding, this design guarantees seamless fitment, critical for protecting sensitive electronic components.
Superior Material Performance with PA66+30%GF
PA66+30%GF offers exceptional thermal stability (up to 220°C), chemical resistance, and mechanical strength, making it ideal for electrical enclosures exposed to harsh environments. The 30% glass fiber reinforcement minimizes warpage and ensures dimensional accuracy, even with a low shrinkage rate of 1.004.
VDI24 Surface Finish for Aesthetic & Functional Excellence
The mold’s VDI24 surface finish (equivalent to SPI-C1) provides a uniform, low-texture appearance while enhancing wear resistance. This finish is critical for applications requiring both aesthetic appeal and long-term durability.
Rapid 35-Second Cycle Time
Leveraging high-volume production mold design principles, we integrated conformal cooling channels and an optimized ejection system to achieve a 35-second cycle time. This efficiency reduces energy costs and boosts output for mass production.
Technical Specifications
Material: PA66 + 30% Glass Fiber
Cavities: 1+1
Cycle Time: 35 seconds
Surface Finish: VDI24 (SPI-C1)
Shrinkage Rate: 1.004