zuixinshipin
6 month ago
Product details
NanoAlign Precision Wrist Module Technical Documentation
Advanced Motion Control for Micro-Manufacturing Applications
Core Technological Capabilities
Sub-Micron Repeatability (±0.1μm)
Utilizes laser interferometer closed-loop feedback with 0.001μm resolution
Achieves ISO 9283-compliant positional consistency across 10,000+ operational cycles
Critical for semiconductor wafer handling and optical component assembly
Piezoelectric Actuation System
Ceramic-based multilayer actuators convert electrical signals into precise mechanical displacement
Generates 200N force with 0.002ms response latency for jerk-free motion transitions
Eliminates backlash and mechanical hysteresis inherent in conventional servo motors
Active Thermal Compensation
Distributed fiber Bragg grating (FBG) sensors monitor structural temperature at 100Hz
Predictive algorithm compensates for thermal expansion/contraction in real-time
Maintains ±0.15μm accuracy across ΔT±8°C environmental fluctuations
Performance Validation
Test Parameter Result Industry Benchmark
Repeatability (ISO 9283) 0.08μm mean deviation Standard: ≤0.5μm
Thermal Drift Compensation 92% error reduction at 40°C ambient Typical: 50-70%
Step Response Time 4.7ms (0→50μm displacement) Competing avg: 12ms
Industrial Implementation
Semiconductor Manufacturing
Enables 3D NAND chip stacking with 0.25μm alignment tolerance
Eliminates micro-scratching during silicon wafer transfer
Increases die-per-wafer yield by 6.2% through reduced misalignment
Medical Device Assembly
Handles microfluidic chips with 5μm channel structures
Maintains precision in ISO Class 5 cleanroom environments
34% reduction in stiction-related defects during sensor packaging
Technical Integration Protocol
图表
代码
下载
EtherCAT Master Controller
Piezoelectric Driver Unit
Ceramic Actuator Array
FBG Thermal Sensor Network
Adaptive Compensation Algorithm
Sub-Micron Position Output
Control Specifications
Communication: EtherCAT (≤1ms cycle time)
Power: 48VDC regenerative drive
Environmental: 0-45°C operating range with IP67 sealing
"The integration of piezoelectric direct drive with real-time thermal compensation resolves historical trade-offs between speed and precision in micro-assembly"
— Dr. Robert Kensington, IEEE Robotics & Automation Letters (2023)
Document Revision History
v1.0 (2024-06-15): Initial release
v1.1 (2024-07-22): Added SEMI S2/S8 compliance data
Certification: ISO 9001:2015 QMS / CE Directive 2006/42/EC
Advanced Motion Control for Micro-Manufacturing Applications
Core Technological Capabilities
Sub-Micron Repeatability (±0.1μm)
Utilizes laser interferometer closed-loop feedback with 0.001μm resolution
Achieves ISO 9283-compliant positional consistency across 10,000+ operational cycles
Critical for semiconductor wafer handling and optical component assembly
Piezoelectric Actuation System
Ceramic-based multilayer actuators convert electrical signals into precise mechanical displacement
Generates 200N force with 0.002ms response latency for jerk-free motion transitions
Eliminates backlash and mechanical hysteresis inherent in conventional servo motors
Active Thermal Compensation
Distributed fiber Bragg grating (FBG) sensors monitor structural temperature at 100Hz
Predictive algorithm compensates for thermal expansion/contraction in real-time
Maintains ±0.15μm accuracy across ΔT±8°C environmental fluctuations
Performance Validation
Test Parameter Result Industry Benchmark
Repeatability (ISO 9283) 0.08μm mean deviation Standard: ≤0.5μm
Thermal Drift Compensation 92% error reduction at 40°C ambient Typical: 50-70%
Step Response Time 4.7ms (0→50μm displacement) Competing avg: 12ms
Industrial Implementation
Semiconductor Manufacturing
Enables 3D NAND chip stacking with 0.25μm alignment tolerance
Eliminates micro-scratching during silicon wafer transfer
Increases die-per-wafer yield by 6.2% through reduced misalignment
Medical Device Assembly
Handles microfluidic chips with 5μm channel structures
Maintains precision in ISO Class 5 cleanroom environments
34% reduction in stiction-related defects during sensor packaging
Technical Integration Protocol
图表
代码
下载
EtherCAT Master Controller
Piezoelectric Driver Unit
Ceramic Actuator Array
FBG Thermal Sensor Network
Adaptive Compensation Algorithm
Sub-Micron Position Output
Control Specifications
Communication: EtherCAT (≤1ms cycle time)
Power: 48VDC regenerative drive
Environmental: 0-45°C operating range with IP67 sealing
"The integration of piezoelectric direct drive with real-time thermal compensation resolves historical trade-offs between speed and precision in micro-assembly"
— Dr. Robert Kensington, IEEE Robotics & Automation Letters (2023)
Document Revision History
v1.0 (2024-06-15): Initial release
v1.1 (2024-07-22): Added SEMI S2/S8 compliance data
Certification: ISO 9001:2015 QMS / CE Directive 2006/42/EC
Similar Video Recommendation
<
>
You May Also Like
Bossgoovideo.com Contact Now
If you are interested in the product, contact Bossgoovideo.com for more information
- *To:
- Bossgoo(China)Tecgnology.(Bossgoo(China)Tecgnology)
- *Message:
-
Submit
Disclaimer :
The information of Bossgoovideo.com limited shown above is provided by the user or collected on the network. Video 2B does not guarantee the authenticity,accuracy and legitimacy of Bossgoovideo.com limited information. Video 2B does not involve legal relationships and disputes between users arising from
transactions other than secured transactions on this website. Disputes shall be settled by you through negotiation.
If you are the person in charge or relevant employee of this enterprise, if you find that the enterprise information is incorrect or want to manage thiscompany, please contact us jacklee1558@gmail.com, after you claim the enterprise, you can obtain management permission, publish supplyand demand information, bring consulting orders, and remove page advertisements.
Suppliers
Bossgoo(China)Tecgnology.(Bossgoo(China)Tecgnology)
Audited supplier
10 year
Main Product:
motor,
DC motors,
Electric motor man