Resin diamond parallel grinding wheel

Resin diamond resin binder, with good self-sharpening, sharp cutting, high grinding efficiency, processing workpiece surface roughness is low, less heating, not easy to burn workpiece and other characteristics, suitable for most of the workpiece material rough grinding, semi-fine grinding, grinding, polishing, etc..  Mainly used for hard alloy, ceramic material, magnetic material, silicon material, thermal spraying alloy processing. 

With diamond abrasive as raw material, using tree powder as binder, resin bond diamond grinding wheel generally consists of two parts, working layer and substrate, diamond grinding wheel used for glass, ceramics and ferrite, the appearance of semiconductor materials and other hard brittle materials processing, electrolytic grinding, and grinding machining center with grinding of diamond bit heavy load cutting, has the good grinding,  Features of long service life. 

Kemei produces different types of cut of wheels, including abrasive blade, diamond blade, saw blade,  CBN cutting disc. Which can meet with all your slicing and cut off aims. For different workpieces and applications. Contact us for professional suggestions.