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High Quality Fast Delivery Copper Skived Heat Sink Aluminum Customized Heat Sink1

3 year ago
2 0
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Copper skived heat sink and aluminum customized heat sink are two types of heat sinks used in electronic devices to dissipate heat generated by components such as processors, transistors, and power modules. Copper skived heat sink:- Copper skived heat sinks are made from a solid block of copper that is machined using a skiving process.- Skiving involves cutting thin fins into the copper block, Pin Fin Heat Sink creating a large surface area for heat dissipation.- Copper is an excellent conductor of heat, allowing for efficient heat transfer from the component to the heat sink.- The skived design provides a high level of thermal performance, making copper skived heat sinks suitable for high-power applications.- These heat sinks are typically used in devices that require a compact size and high thermal performance, such as servers, power supplies, and industrial equipment. Aluminum customized heat sink:- Aluminum customized heat sinks are made from extruded aluminum profiles that are customized according to the specific requirements of the application.- Aluminum is a lightweight material with good thermal conductivity, Liquid Cold Plate making it suitable for heat sink applications.- The extrusion process allows for the creation of complex shapes and designs, providing flexibility in heat sink design.- Aluminum heat sinks are cost-effective and widely used in various electronic devices, including computers, LED lights, audio amplifiers, and automotive electronics.- Customization options include different fin designs, sizes, and surface treatments to optimize thermal performance and meet specific requirements. Both copper skived heat sinks and aluminum customized heat sinks play a crucial role in preventing overheating and ensuring the reliable operation of electronic devices. The choice between the two depends on factors such as the power dissipation requirements, Water Cold Plate space limitations, cost considerations, and application-specific needs.


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