180 degree SMT wire to board header

The 180 degree SMT wire to board header by yztech is an ideal choice for optimizing circuit board layout and connection efficiency. As an innovative product in the Wire-to-Board Connectors series, its 180-degree vertical design seamlessly connects with Wire-to-Board Header, enhancing circuit board integration, especially suitable for high-density wiring in smart devices and industrial control systems. The Connector Housing is made of high-temperature-resistant LCP material (UL94 V0 certified), withstanding 260℃ reflow soldering and offering excellent mechanical strength and chemical stability.

 

Equipped with high-precision Crimp Terminals gold-plated to <8mΩ contact resistance, it supports 5A high-current transmission and high-speed data signal interaction, with a 12,000-cycle plugging lifespan. The unique anti-pin-tipping design ensures precise positioning during soldering, with a tolerance of ±0.03mm, suitable for fully automated SMT production lines and reducing production defects. The anti-oxidation coating maintains stable performance in harsh environments such as humidity and high temperatures, and the IP54 rating protects against dust and water splashes. Ideal for automotive electronics, medical devices, 5G communication equipment, etc., whether for complex multi-board interconnection systems or wiring in miniaturized smart terminals, this 180-degree SMT wire to board header stands out as an excellent solution in the Wire-to-Board Connectors field with its stable and reliable performance.