Injection Molding plastic panel frame
8 month ago
Core Mold Design Requirements for Electronic Boxes
- Dimensional Compensation of the Mold to Address Material Shrinkage: Based on the shrinkage rate (0.5%-0.8% ABS; 0.6%-0.9% PC), make sure that the dimensional compensation is made to fit the electronic box and its internal parts such as PCB boards and connectors.
- Waterproof and Sealing Structure Design:
- Make grooves for rubber seals (the width of 2-3 mm, the depth of 1-1.5 mm) in order to make it IP65/IP67 waterproof.
- Use interlocking buckles as well as screw fixing in order to improve sealing and facilitate the process of assembling.
- Draft Angle and De-Molding Optimization: Make the draft angle of 1°-3° for both inner and outer walls in order to prevent demolding marks; for complex-shaped electronic boxes, use the core-pulling mechanism to make sure of the easy demolding of deep cavities (threaded holes, ribs, etc.).
- Gating System Design: Use submarine or edge gates in order to avoid the marks left by the gates on the surface; for large electronic boxes use multi-gating system in order to provide uniform filling and reduce internal stresses.
- Cooling System Design: Evenly arrange the channels for cooling water around the mold cavity (10-15 mm from the surface of the cavity).
Application Scenarios
- Consumer Electronics: Router enclosures, power adapter shells, smart home control boxes.
- Industrial Control: PLC enclosures, sensor junction boxes, industrial instrument housings.
- Outdoor Electronics: Monitoring camera enclosures, solar controller boxes, communication base station signal boxes.
- Automotive Electronics: Vehicle-mounted control unit enclosures, battery management system (BMS) boxes.
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