Optoelectronic Packaging
2 year ago
10-Pin Butterfly Package for High-Performance Optoelectronic Applications
Product Overview
The 10-Pin Butterfly Package is an industry-standard housing solution engineered for the most demanding Optoelectronic Packaging applications. This hermetically sealed enclosure provides a robust, thermally efficient, and electrically stable environment for sensitive optical components such as pump lasers, modulators, and photodetectors. Constructed using advanced ceramic-to-metal sealing technology, our butterfly packages ensure the long-term reliability and performance required for high-speed telecommunications, data centers, and CATV infrastructure. The package's design facilitates precise optical fiber alignment and superior thermal management, making it the premier choice for creating reliable Transmitter Optical Sub-Assemblies (TOSA) and Receiver Optical Sub-Assemblies (ROSA).
Technical Specifications
| Parameter | Specification |
|---|---|
| Pin Count | 10 |
| Body Material | Kovar (Fe-Ni-Co Alloy) |
| Base Material | Tungsten Copper (WCu) for enhanced thermal conductivity |
| Feedthrough Insulator | High-purity Alumina ($Al_2O_3$) Ceramic |
| Plating | Electrolytic Nickel (Ni) and Gold (Au) for corrosion resistance and wire bondability |
| Hermeticity | ≤ 1x10⁻⁸ atm·cc/s (He), compliant with MIL-STD-883 |
| Typical Dimensions | Customizable, standard footprints available (e.g., 22mm x 12.7mm) |
| RF Configuration | Options for 50Ω impedance-matched RF leads (GSG configuration) |
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Features & Advantages
- Exceptional Reliability: Our packages are designed and tested to meet stringent GR-468 and MIL-STD-883 standards, ensuring device survival in harsh operating conditions.
- Superior Thermal Management: The use of high-conductivity materials like Tungsten Copper (WCu) in the base allows for efficient heat dissipation from high-power laser diodes, ensuring stable performance and long device lifetime.
- High-Speed Signal Integrity: Optimized design with options for impedance-controlled RF pins ensures clean signal transmission for data rates of 10Gbps, 25Gbps, and beyond.
- Robust Hermetic Sealing: Advanced brazing and welding techniques create a durable ceramic-to-metal seal, protecting sensitive internal components from moisture and contaminants.
- Precision Manufacturing: We maintain tight dimensional tolerances to facilitate automated fiber alignment and assembly processes, reducing manufacturing costs for our clients.
Application Scenarios
This versatile butterfly package is the cornerstone of numerous high-technology systems, including:
- Long-haul and metropolitan telecommunication networks
- High-speed data center interconnects
- CATV distribution nodes and head-ends
- Fiber optic sensing systems
- Aerospace and defense communication links
Benefits for Customers
- Accelerate Time-to-Market: Utilize a proven, industry-standard package to reduce your design and qualification cycle.
- Enhance Product Reliability: Improve the lifetime and performance of your optical modules with a package that offers superior environmental protection and thermal performance.
- Simplify Manufacturing: Our packages are designed for seamless integration into automated assembly lines.
- Future-Proof Designs: With support for high data rates, our electronic packages provide a platform for your next-generation products.
Certifications and Compliance
Our manufacturing processes adhere to the highest quality standards. Products are compliant with:
- GR-468-CORE: Reliability Assurance Requirements for Optoelectronic Devices
- MIL-STD-883: Test Method Standard for Microcircuits (for hermeticity and reliability testing)
- ISO 9001:2015: Certified Quality Management System
FAQ (Frequently Asked Questions)
Q1: Can the pin configuration be customized?
A1: Yes, we offer extensive customization options. While this is a 10-pin model, we can modify the pin count, pitch, and electrical characteristics (e.g., adding more RF or DC pins) to meet your specific application requirements.
Q2: What type of fiber attachment is supported?
A2: The package is designed with a precision-machined front port to accommodate the brazing or laser welding of a fiber optic ferrule or tube, ensuring stable and accurate fiber pigtail alignment.
Q3: Is a thermoelectric cooler (TEC) integrated into the package?
A3: This package is designed to accommodate an internal thermoelectric cooler (TEC). The high thermal conductivity of the base ensures efficient heat transfer from the hot side of the TEC to an external heat sink.
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Main Product:
Tungsten Heavy Alloys,
Heat Sink,
Electronic Packaging ,
Rhenium Alloys,
Tantalum Alloys,
Nickel Based Braze Alloy
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