Electric Ceramic Packaging

Advanced Ceramic Substrates: The Foundation for High-Performance Electronics

Product Overview

In an era where electronic devices are becoming more powerful and compact, effective thermal management is paramount. We provide elite Ceramic Substrates, including high-purity Alumina (Al₂O₃) and Aluminium Nitride (AlN), that serve as the bedrock for cutting-edge Electronics Packaging. Our substrates are meticulously engineered to dissipate heat, ensure electrical integrity, and provide a stable mechanical foundation for sensitive semiconductor components. Whether you are developing high-power RF amplifiers, industrial laser modules, or next-generation automotive electronics, our ceramic solutions empower you to push the boundaries of performance and reliability.

Technical Specifications

Our substrates are manufactured to the highest quality standards, with material properties tailored for demanding applications.

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Product Features & Advantages

Unmatched Thermal Performance

With a thermal conductivity up to 170 W/m·K, our AlN substrates provide a highly efficient pathway to draw heat away from critical components like GaN and SiC dies, ensuring stable operation and extending device lifetime.

Superior Electrical Properties

Both Alumina and AlN offer high dielectric strength and low dielectric loss, making them ideal for high-frequency Wireless RF Packaging where signal integrity is crucial.

Exceptional Mechanical Stability

Our ceramic substrates exhibit high flexural strength and a low CTE that can be closely matched to semiconductor materials, minimizing thermo-mechanical stress during operation and enhancing overall reliability.

Advanced Metallization Capabilities

We employ state-of-the-art thin-film processes (Ti/Pt/Au) to create high-precision, high-adhesion circuitry. We can also integrate passive components like high-stability TaN resistors and pre-deposit AuSn solder for simplified assembly.

How to Use Our Substrates: A 4-Step Integration Guide

1. Collaborative Design: Share your design files (DXF/Gerber) and performance requirements with our engineering team for a comprehensive design-for-manufacturability (DFM) review.
2. Rapid Prototyping: We leverage our flexible manufacturing line to produce high-quality prototypes for your initial validation and system-level testing.
3. Seamless Assembly: Our substrates, with optional pre-deposited AuSn solder, are compatible with standard die-attach, wire bonding, and reflow soldering processes.
4. Volume Production: Upon successful qualification, we scale production to meet your volume demands, backed by rigorous statistical process control (SPC) to ensure consistent quality.

Application Scenarios

• High-Power Laser Systems: Submounts for laser diodes in industrial cutting, medical devices, and optical communications.
• RF & Microwave: Substrates for power amplifiers, filters, and mixers in 5G infrastructure and aerospace radar systems.
• Power Electronics: Insulating baseplates for IGBT and MOSFET modules in electric vehicles and renewable energy systems.
• Automotive Electronics: Platforms for sensors, LiDAR, and power management ICs requiring high reliability.

Benefits for Customers

Partnering with us provides tangible advantages for your business:

• Enhance Product Performance: Enable higher power densities and operating frequencies in your designs.
• Improve Reliability: Reduce field failures by using thermally and mechanically superior materials.
• Accelerate Time-to-Market: Simplify your assembly process and reduce design cycles with our integrated solutions and expert support.
• Reduce Total Cost of Ownership: A more reliable end-product with a streamlined manufacturing process leads to lower long-term costs.

Certifications and Compliance

Our manufacturing processes and products are designed to meet the most stringent industry standards for high-reliability applications, including the principles outlined in MIL-STD-883 for microelectronics.

Customization Options

We don't just sell standard products; we create custom solutions. Our capabilities include:

• Complex Shapes: Precision laser cutting and machining for unique form factors, including steps, slots, and cavities.
• Integrated Features: Metallized through-holes (vias) and castellated edges for 3D integration.
• Multi-layer Designs: Combining thin-film and thick-film (HTCC) technologies for complex, high-density interconnects.
• Material Selection: Expert guidance on choosing the optimal ceramic and metallization scheme for your application.

FAQ (Frequently Asked Questions)