Reliability testing

9 month ago

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Dongguan Jingling Communication Technology Co., Ltd.

10 month

Product details

Energy Storage Board PCBA

PCB&PCBA Capacity:

1.Material:FR4,( 64322716, 64122791,High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI

Material, BT Material, PPO, PPE etc.

2.Board thickness Mass production:394mil(10mm) Samples: 17.5mm.

3.Surface finish:HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger.

4.PCB Max panel size:1150mm × 560mm

5.Layer:Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers.

6.Min hole size:Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

7.PCBA QC:X-ray, AOI Test, Functional Test

8.Special Process:Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.

9.Our service:PCB, PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers.

10.Sanforized:Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.

11.SMT Capacity:7Million Points/Day

12.DIP Capacity:0.35Million Points/DayPlace of Origin:Guangdong, China

Brand Name:Wtt/Wsd

Copper Thickness:0.5-4OZ / 1 Oz / 2Oz or Custom

Min. Hole Size:T/2mm / 0.2 Mm / 0.15mm or Custom

Min. Line Width:0.15mm / 0.1mm or Custom

Min. Line Spacing:0.15mm / 0.1mm/4mil or Custom

Surface Finishing:HASL,Immersion gold,Flash gold, plated silver, OSP

Board Size:Customized

Processing technology:Electrolytic foil

Insulation thickness:Conventional board

Insulation material:organic resin

Supported Customization:Can be customized

Application:Electronics Device, Medical device, home appliance

Product layer number:Double layer

copper thickness:1 oz

Advantage:Support sample order, Free Function Test,integrates R & D, production, sales and service

Our Service:PCBA solution development or OEM/ODM

Solution Design

PCB&PCBA Capacity:

1.Material:FR4,( 64322717, 64122791,High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI

Material, BT Material, PPO, PPE etc.

2.Board thickness Mass production:394mil(10mm) Samples: 17.5mm.

3.Surface finish:HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger.

4.PCB Max panel size:1150mm × 560mm

5.Layer:Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers.

6.Min hole size:Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

7.PCBA QC:X-ray, AOI Test, Functional Test

8.Special Process:Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.

9.Our service:PCB, PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers.

10.Sanforized:Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.

11.SMT Capacity:7Million Points/Day

12.DIP Capacity:0.35Million Points/Day

PCBA Functional Testing

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Dongguan Jingling Communication Technology Co., Ltd.

Audited supplier

10 month

Main Product: PCB Assembly, PCB Layout, PCB Prototype, SMT Assembly, Motherboard processing , Electronic components

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