Aluminum Nitride Ceramic Molybdenum Manganese Metalized Substrate
12 month ago
AlN Ceramic Mo-Mn Metalized Substrate
Product Overview
Puwei's AlN Ceramic Mo-Mn Metalized Substrate represents advanced electronic packaging technology, combining the exceptional thermal conductivity of aluminum nitride with reliable molybdenum-manganese metallization. This engineered substrate delivers superior performance for demanding high power microelectronic components and electronic packaging applications.
Precision-engineered AlN substrate with Mo-Mn metallization for superior thermal management
Technical Specifications
Core Material Properties
- Base Material: High-purity Aluminum Nitride (AlN) Ceramic
- Metallization: Molybdenum-Manganese (Mo-Mn) alloy layer
- Thermal Conductivity: 170-200 W/m·K (5-7x higher than alumina)
- Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm
- Thermal Expansion: 4.5×10⁻⁶/°C (matches silicon)
- Operating Temperature: -55°C to 850°C
- Metal Layer Adhesion: Excellent bond strength >70 MPa
Key Features & Advantages
- Exceptional Thermal Management: Ideal for power devices requiring efficient heat dissipation
- Superior Electrical Performance: Excellent insulation elements for high-frequency applications
- Robust Metallization: Strong Mo-Mn adhesion withstands thermal cycling and mechanical stress
- Chemical Stability: Resists corrosion and oxidation in harsh environments
- Dimensional Stability: Minimal thermal expansion ensures reliability in microelectronics packaging
- High Frequency Compatibility: Optimal for microwave components and RF circuits
Manufacturing Process
- Material Preparation: High-purity AlN powder formulation and quality verification
- Substrate Formation: Precision shaping and high-temperature sintering for dense ceramic structure
- Surface Preparation: Critical surface treatment to ensure optimal metallization bonding
- Mo-Mn Application: Controlled screen-printing or spraying of metallization paste
- High-Temperature Firing: Precise thermal processing to form uniform, bonded metal layer
- Quality Validation: Comprehensive testing of thermal, electrical, and mechanical properties
Integration Guidelines
- Design Verification: Confirm substrate dimensions and metallization pattern compatibility
- Surface Inspection: Verify metallization quality and surface cleanliness
- Component Placement: Precisely position electronic components using appropriate soldering techniques
- Thermal Management: Implement heat sinking solutions for optimal thermal performance
- Electrical Testing: Validate insulation resistance and circuit integrity
- Environmental Validation: Test performance under expected operating conditions
Application Scenarios
Power Electronics & Energy Systems
Essential for power amplifiers, IGBT modules, and high-power LED systems where efficient heat dissipation is critical. The substrate's thermal management capabilities enable higher power density and reliability in thick film hybrid microcircuits and power conversion systems.
RF & Microwave Applications
Ideal for microwave substrates, RF filters, and antenna systems requiring stable high-frequency performance. The combination of excellent thermal conductivity and electrical insulation makes it perfect for microwave applications and communication equipment.
Automotive Electronics
Increasingly used in automotive power electronics, engine control units, and electric vehicle power systems where reliability under extreme conditions is paramount. Supports the miniaturization trend while maintaining thermal performance.
Semiconductor & Microelectronics Packaging
Critical for integrated circuit packaging and sensor packaging applications where thermal management and electrical isolation determine device reliability and lifespan in demanding operational environments.
Business Value & ROI
- Enhanced Reliability: Superior thermal management extends component lifespan and reduces failure rates
- Increased Power Density: Enables compact designs with higher power handling capabilities
- Reduced System Costs: Eliminates need for complex cooling systems through efficient heat dissipation
- Improved Performance: Stable electrical properties ensure consistent operation in high-frequency modules
- Manufacturing Efficiency: Reliable metallization supports automated assembly processes
Quality Assurance & Compliance
Puwei maintains rigorous quality control standards throughout the manufacturing process. Our AlN Ceramic Mo-Mn Metalized Substrates undergo comprehensive testing to ensure consistent performance, with material traceability and batch-to-batch consistency guaranteed for critical applications in hybrid micro circuits and power electronics.
Customization Services
We offer extensive customization options including substrate dimensions, metallization patterns, thickness specifications, and specialized surface finishes. Our engineering team collaborates with clients to develop optimized solutions for specific application requirements, from prototype development to volume production.
Technical Expertise
With deep expertise in advanced ceramics and metallization technologies, Puwei provides comprehensive solutions for demanding electronic applications. Our AlN Ceramic Mo-Mn Metalized Substrates represent the culmination of material science innovation and precision manufacturing, delivering reliable performance in the most challenging environments.
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