Aluminum Nitride Ceramic Molybdenum Manganese Metalized Substrate

2 year ago

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Shaanxi Puwei Electronic Technology Co., Ltd

2 year

Product details

AlN Ceramic Mo-Mn Metalized Substrate for Advanced Power & RF Electronics

Product Overview

Puwei's AlN Ceramic Mo-Mn Metalized Substrate represents the pinnacle of reliability in high-performance electronics packaging. Engineered by fusing high-purity Aluminum Nitride (Thermal Conductivity: 170-200 W/m·K) with a robust Molybdenum-Manganese (Mo-Mn) metallization layer, this substrate delivers unmatched thermal management, superior electrical insulation, and exceptional mechanical stability. It is the cornerstone for next-generation high-power microelectronic components, RF circuits, and demanding microelectronics packaging applications where failure is not an option.

Puwei AlN Ceramic Substrate with precise Mo-Mn metallization pattern for power electronics

Precision-engineered AlN substrate with Mo-Mn metallization, ready for high-reliability assembly.

Core Value Proposition for B2B Buyers

Solve Overheating & Enable Miniaturization: Exceptional thermal conductivity actively draws heat away from dense power devices, allowing for higher power density and more compact designs without compromising reliability.
Eliminate Delamination Risk: The fired Mo-Mn layer creates a chemical bond with the AlN, achieving adhesion strength >70 MPa. This ensures long-term integrity under extreme thermal cycling, a critical factor for automotive and aerospace sensor packaging.
Ensure Signal Integrity in RF Designs: With stable dielectric properties and low loss, this substrate is an ideal insulation element for microwave applications and high-frequency modules, preserving signal purity.
Reduce System-Level Thermal Stress: The CTE (4.5 ppm/°C) closely matches semiconductor materials like Si and GaAs, minimizing stress on bonded dies in integrated circuit packages and increasing overall module lifespan.
Future-Proof Your Product with Proven Tech: Mo-Mn metallization offers superior oxidation resistance and durability in harsh environments compared to many thin-film alternatives, ensuring product longevity and reducing field failure rates.

Technical Specifications

AlN Ceramic Base Properties

The foundation is high-purity Aluminum Nitride. Key properties include a thermal conductivity range of 170 to 200 W/(m·K), a coefficient of thermal expansion of 4.5 × 10⁻⁶/°C, and a dielectric constant between 8.5 and 9.0 at 1 MHz. It boasts exceptional electrical insulation with volume resistivity exceeding 10¹⁴ Ω·cm and a breakdown voltage greater than 15 kV/mm. The material also offers robust mechanical strength with flexural strength over 300 MPa.

Mo-Mn Metallization Layer Properties

The metallization is a fired Molybdenum-Manganese alloy with a typical post-firing thickness of 10 to 25 micrometers. It delivers excellent adhesion strength, tested to be greater than 70 MPa in standard pull tests. The surface exhibits outstanding solderability for direct brazing or soldering and can be further plated with Nickel (Ni) or Gold (Au) for enhanced wire bonding. The layer supports an extreme operating temperature range from -55°C to +850°C.

Technology Deep Dive: Why Mo-Mn Metallization?

Mo-Mn is a thick-film, high-temperature firing process that forms a durable, chemically bonded, and hermetic interface with the AlN ceramic. This makes it fundamentally more robust than thin-film techniques for applications involving severe thermal stress, hermetic sealing, or high-temperature brazing. It is the preferred choice for creating reliable thick film hybrid microcircuits and hermetic microelectronics packaging.

Primary Application Scenarios

Power Electronics & Modules

The primary substrate for Insulated Gate Bipolar Transistor (IGBT) and next-generation Silicon Carbide (SiC) / Gallium Nitride (GaN) power devices. Its superior heat spreading is critical for electric vehicle inverters and industrial motor drives.

RF & Microwave Communications

Essential for microwave components such as RF power amplifiers, filters, and antenna modules in 5G/6G infrastructure and radar systems, where thermal management and signal integrity are paramount.

Aerospace & Military Electronics

Used in hermetic packages for sensor packaging and mission-critical avionics, providing a reliable seal-ring surface for welding metal lids to protect sensitive chips.

Hybrid Microelectronics

Serves as the base platform for hybrid micro circuits and Multi-Chip Modules (MCM), where the metallized surface allows for the printing of resistor and conductor pastes to build complex, high-reliability circuits.

Integration & Assembly Guidelines

Design Consultation: Share your CAD requirements for substrate dimensions, tolerance (±0.05mm), and metallization pattern. Our engineers can advise on DFM for optimal thermal and mechanical performance.
Cleaning & Preparation: Always handle with clean gloves. Prior to assembly, clean substrates with isopropyl alcohol or plasma clean for high-reliability bonds.
Choosing Attachment Method:
- For Maximum Strength & Thermal Performance: Use active metal brazing (e.g., Ag-Cu-Ti) in a vacuum furnace.
- For Standard Assembly: High-temperature soldering with controlled reflow profiles is suitable.
Quality Validation: Perform post-assembly inspections including visual check for fillets, electrical tests for insulation/continuity, and thermal imaging to verify heat spreading efficiency.

Certifications & Quality Assurance

Puwei Ceramic operates under an ISO 9001:2015 certified quality management system. Our materials are fully compliant with RoHS and REACH directives, and we maintain full batch traceability. We support application-specific reliability testing, including thermal shock and cycling, to qualify our substrates for your most demanding systems, ensuring they meet the standards required for global electronic packaging markets.

Customization & OEM/ODM Services

We partner with you to deliver tailored solutions. Our extensive customization capabilities include:

Full Custom Design: Any size, shape, thickness, and complex metallization pattern (pads, traces, seal rings).
Flexible Finishes: Options include as-fired Mo-Mn, or plated finishes like Ni or Ni/Au for specific solderability and wire-bonding needs.
Value-Added Processing: Precision machining of holes/contours, laser marking, and integration into multi-layer or hybrid assemblies with other Puwei products like Alumina Ceramic Substrate (Al2O3).

Manufacturing Excellence

Our vertically controlled process guarantees consistency: from raw material QC of AlN powder, through precision sintering and machining, to meticulous screen-printing and high-temperature firing of the Mo-Mn paste. Every substrate undergoes 100% final inspection, including dimensional checks, adhesion pull tests, and electrical verification, ensuring you receive a bare ceramic plate of the highest reliability for your electronic integrated circuit assembly.