Aluminum Nitride Ceramic Molybdenum Manganese Metalized Substrate

2 year ago

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Shaanxi Puwei Electronic Technology Co., Ltd

2 year

Product details

AlN Ceramic Mo-Mn Metalized Substrate: High-Performance Platform for Advanced Electronics

Puwei's AlN Ceramic Mo-Mn Metalized Substrate is a state-of-the-art solution that merges the exceptional thermal conductivity of Aluminum Nitride with the robust reliability of molybdenum-manganese (Mo-Mn) metallization. This substrate is specifically engineered for applications where efficient heat dissipation, superior electrical insulation, and long-term reliability are non-negotiable. It serves as an ideal foundation for demanding electronic packaging, enabling the next generation of compact, high-power, and high-frequency electronic systems.

AlN Ceramic Substrate with Mo-Mn Metallization for Power and RF Applications - Puwei

Why Choose Mo-Mn Metalized AlN for Your Critical Applications?

Unmatched Thermal Management (170-200 W/m·K): 5-7 times more thermally conductive than standard alumina. Actively pulls heat away from high-power microelectronic components, preventing overheating and enabling higher power density in designs.
Reliable, High-Strength Bonding (Adhesion >70 MPa): The Mo-Mn metallization process creates a robust, hermetically sealed, and mechanically strong interface between the ceramic and metal, crucial for surviving extreme thermal cycling in power devices.
Superior Electrical Insulation & High-Frequency Performance: Exceptional volume resistivity (>10¹⁴ Ω·cm) and stable dielectric properties make it an excellent insulation element for RF circuits and microwave applications with minimal signal loss.
Perfect CTE Match for Semiconductors: Coefficient of Thermal Expansion (4.5×10⁻⁶/°C) closely matches silicon (Si) and gallium arsenide (GaAs), minimizing thermal stress on mounted dies and increasing reliability in integrated circuit and sensor packaging.
Proven Technology for Demanding Environments: Mo-Mn metallization offers excellent resistance to oxidation and corrosion, ensuring long-term stability in harsh operating conditions, outperforming many thin-film alternatives in durability.

Technical Specifications

Our AlN Mo-Mn substrates are manufactured to precise specifications to ensure consistent, reliable performance in your application.

Base Substrate Properties (Aluminum Nitride)

Material: High Purity Aluminum Nitride (AlN) Ceramic
Thermal Conductivity: 170 - 200 W/(m·K)
Coefficient of Thermal Expansion (CTE): 4.5 × 10⁻⁶/°C (RT-400°C)
Dielectric Constant (εr): 8.5 - 9.0 @ 1 MHz
Volume Resistivity: > 10¹⁴ Ω·cm
Breakdown Voltage: > 15 kV/mm
Flexural Strength: > 300 MPa

Metallization Layer Properties (Mo-Mn)

Metallization Type: Molybdenum-Manganese (Mo-Mn) alloy, fired-in
Typical Layer Thickness: 10 - 25 μm (Post-firing)
Adhesion Strength (Brazing): > 70 MPa (Standard Pull Test)
Solderability: Excellent. Can be directly brazed or soldered with active solder alloys.
Surface Finish: Can be plated with Nickel (Ni) and/or Gold (Au) for enhanced solderability and wire bonding.
Operating Temperature Range: -55°C to +850°C (Short term to +1000°C in inert atmosphere).

Mo-Mn Metallization Technology: The Robust Choice

Mo-Mn metallization is a time-tested, thick-film process ideal for applications requiring hermetic sealing and exceptional bond strength. Unlike thin-film techniques, the Mo-Mn layer is fired at high temperatures, forming a durable, chemically bonded interface that penetrates the ceramic surface. This makes it the preferred choice over Direct Plated Copper (DPC) or thin-film metallization for:

High-Power Modules: Where strong, reliable metal-ceramic bonds are critical for heat spreader attachment.
Hermetic Packaging: For sensor packaging and military/aerospace electronics requiring absolute reliability.
Applications with Severe Thermal Cycling: The robust interface resists delamination caused by repeated heating and cooling.
Brazing Applications: Provides an excellent surface for high-temperature active metal brazing (e.g., using Ag-Cu-Ti alloys) of metal lids or heat sinks.

Primary Application Scenarios

1. High-Power & RF/Microwave Electronics

Ideal substrate for microwave components such as RF power amplifiers (LDMOS, GaN), filters, and antenna modules in radar and 5G infrastructure. Its low dielectric loss and excellent thermal management are critical for high-frequency modules and RF circuits. Also serves as a baseplate for high-power laser diodes.

2. Advanced Power Modules (IGBT, SiC, GaN)

Used as the insulating, heat-spreading substrate in Insulated Gate Bipolar Transistor (IGBT) modules and next-generation Silicon Carbide (SiC) / Gallium Nitride (GaN) power devices. The Mo-Mn layer provides a reliable surface for brazing or soldering power dies and attaching copper baseplates or heat sinks.

3. Hybrid Microelectronics & Multi-Chip Modules (MCM)

A cornerstone technology for thick film hybrid microcircuits and hybrid micro circuits. The metallized surface allows for the screen-printing of thick-film resistor and conductor pastes, creating complex, high-reliability circuits for aerospace, medical, and industrial controls. Also used in the assembly of thermoelectric cooling assemblies.

4. Hermetic & High-Reliability Packaging

Critical for microelectronics packaging that requires hermetic sealing, such as in military, aerospace, down-hole oil & gas, and high-end sensor packaging. The Mo-Mn metallization provides a perfect seal ring area for welding or brazing a metal lid, protecting sensitive chips from moisture and contaminants.

5. Automotive & Industrial Electronics

Increasingly used in electric vehicle (EV) traction inverters, onboard chargers, and industrial motor drives. Withstands the high temperatures, vibration, and harsh environments typical in these applications, providing a reliable platform for high-power microelectronic components.

Integration & Design for Manufacturing (DFM) Guidance

To ensure optimal performance and reliability of your assembly, follow these guidelines when designing with and integrating our Mo-Mn metalized AlN substrates.

Design & Layout: Provide clear CAD drawings specifying substrate dimensions, tolerance (±0.05mm typical), and the exact metallization pattern (pad shapes, seal ring geometry). Consider thermal expansion mismatches when designing large metalized areas.
Material Handling & Storage: Handle substrates with clean gloves or vacuum tools. Store in a dry, clean environment. The metallized surface can be sensitive to fingerprints and contamination, which may affect subsequent bonding.
Surface Preparation: Prior to assembly, clean the substrate using standard industry solvents (e.g., isopropyl alcohol) in an ultrasonic cleaner. For high-reliability applications, plasma cleaning is recommended to ensure perfect surface energy for bonding.
Attachment Methods:
- Brazing: For the strongest, most reliable thermal/mechanical bond (e.g., attaching a copper heat spreader). Use active brazing alloys (e.g., Ag-Cu-Ti) in a controlled atmosphere (vacuum or inert gas) furnace.
- Soldering: High-temperature lead-based (Pb-Sn-Ag) or lead-free solders can be used with appropriate flux. Reflow profiles must be carefully controlled.
- Epoxy Adhesive: For less thermally demanding applications, high-thermal-conductivity epoxies can be used, though thermal performance will be lower.
Post-Assembly Inspection: Conduct visual inspection under magnification for solder/braze fillets and potential voids. Perform electrical tests (insulation resistance, continuity) and thermal imaging to validate heat spreading.

Customization & OEM/ODM Engineering Services

Puwei specializes in co-engineering metalized ceramic substrates to meet your exact electrical, thermal, and mechanical specifications, from prototyping to volume production.

Customizable Parameters

Substrate Dimensions & Geometry: Custom sizes, shapes, and thicknesses. Holes, slots, and intricate contours can be precision-machined.
Metallization Pattern: Full custom design of conductor traces, bonding pads, ground planes, and hermetic seal ring geometries.
Metallization Thickness & Composition: Adjustment of Mo-Mn layer thickness and optional post-metallization plating (Ni, Ni/Au, Ni/Pd/Au) for specific solderability or wire-bonding requirements.
Surface Finish: As-fired, ground, or polished AlN surface on the non-metalized side.
Marking & Traceability: Laser marking for part numbers, logos, or batch codes.
Multi-Layer & Hybrid Constructions: Can be combined with other Puwei products like Alumina Ceramic Substrate (Al2O3) or DBC AlN to create complex, multi-functional assemblies.

Manufacturing Process & Quality Assurance

Our vertically integrated manufacturing ensures stringent control over every step, delivering substrates with exceptional consistency and reliability.

Raw Material QC: Incoming high-purity AlN powder is tested for composition and particle size distribution.
Ceramic Forming & Sintering: Powder is pressed and sintered at high temperature in a controlled atmosphere to form a dense, high-thermal-conductivity AlN ceramic blank.
Precision Machining: The sintered blank is laser-cut or diced to approximate size, then ground to final dimensions with tight tolerances.
Surface Preparation for Metallization: Substrates undergo thorough cleaning and surface activation.
Mo-Mn Paste Application & Firing: The Mo-Mn metallization paste is precisely applied via screen printing. The assembly is then fired in a high-temperature hydrogen atmosphere furnace, where the paste sinters and forms a chemical bond with the AlN.
Optional Plating: If specified, a Nickel (Ni) barrier layer and/or Gold (Au) finish are plated onto the fired Mo-Mn layer.
Final Inspection & Testing: 100% visual inspection, dimensional verification, adhesion testing (pull test), and electrical testing (insulation resistance). Advanced techniques like X-ray and ultrasonic scanning are available for critical applications.

Certifications, Compliance & Reliability

Puwei Ceramic is committed to the highest standards of quality and reliability, essential for serving global markets in demanding industries.

Quality Management System: ISO 9001:2015 Certified manufacturing facility.
Material Compliance: Fully compliant with RoHS and REACH directives. Materials are non-toxic (unlike BeO).
Traceability: Full batch traceability from raw material to finished substrate.
Reliability Data: We provide or support application-specific reliability testing, including thermal shock, thermal cycling, high-temperature storage, and mechanical vibration testing to qualify the substrate for your system.