AlN Ceramic Baseplate

11 month ago

55 0 

Shaanxi Puwei Electronic Technology Co., Ltd

12 month

Product details

Aluminum Nitride Ceramic Substrate for Thick Film Circuits

Puwei's specialized Aluminum Nitride Ceramic Substrates provide the ideal foundation for advanced thick film circuits, combining exceptional thermal management with superior electrical performance. Engineered specifically for demanding electronic packaging and microelectronics packaging applications, these substrates deliver reliable performance in high-power and high-frequency environments.

Core Advantages

Exceptional Thermal Conductivity: 170-230 W/(m·K) for superior heat dissipation
Superior Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm
Chemical Stability: Resistant to acids, alkalis, and corrosive environments
Thermal Expansion Matching: Compatible with thick film materials
Surface Optimization: Ideal platform for thick film printing and sintering

Aluminum Nitride Ceramic Substrate for Thick Film Circuits

Technical Specifications

Material Properties

Thermal Conductivity: 170-230 W/(m·K)
Volume Resistivity: >10¹⁴ Ω·cm
Dielectric Constant: 8.5-9.0 @ 1MHz
Dielectric Strength: 15-20 kV/mm
Flexural Strength: 300-400 MPa
Surface Roughness: Customizable for optimal adhesion

Manufacturing Capabilities

Standard Thermal Conductivity: ≥ 175W/m·K
Ultra-High Thermal Conductivity: ≥ 200W/m·K available
Minimum Thickness: 0.10mm
Surface Finishes: As-fired, ground, or polished
Metallization Compatibility: DPC, DBC, TPC, AMB, thick film printing

Aluminum Nitride Ceramic Substrate Performance Parameters

Product Features & Advantages

Performance Characteristics

Advanced Thermal Management
With thermal conductivity of 170-230 W/(m·K), our AlN substrates efficiently dissipate heat from high-power microelectronic components, preventing overheating and ensuring reliable operation in demanding power devices applications.
Superior Electrical Performance
Excellent dielectric strength and volume resistivity exceeding 10¹⁴ Ω·cm provide reliable electrical isolation, making these substrates ideal for high-frequency modules and RF circuits in microwave applications.
Chemical and Environmental Stability
Resistant to acids, alkalis, and corrosive environments, ensuring long-term durability and performance consistency in harsh industrial conditions.
Optimized Surface Properties
Smooth, flat surfaces provide ideal platforms for thick film printing and sintering, ensuring uniform circuit layers and reliable performance in thick film hybrid microcircuits.

Production Capabilities

Manufacturing Excellence

Vertical Integration
Complete control from raw material R&D to finished ceramic products, ensuring consistent quality and performance across all production batches.
Advanced Material Processing
High-purity aluminum nitride powder processing and formulation to achieve optimal thermal and electrical properties for specific application requirements.
Precision Manufacturing
State-of-the-art forming and sintering processes to create substrates with precise dimensions and superior material properties.
Quality Assurance
Comprehensive testing and inspection at every production stage to ensure dimensional accuracy, thermal performance, and electrical properties.

Aluminum Nitride Ceramic Substrate Production Dimensions

Integration Guidelines

Substrate Selection
Choose appropriate substrate thickness and surface finish based on your thick film circuit requirements and thermal management needs for microelectronics applications.
Surface Preparation
Ensure clean, contamination-free substrate surfaces before thick film printing to achieve optimal adhesion and circuit performance.
Thick Film Printing
Apply thick film pastes using standard printing techniques, taking advantage of the substrate's optimized surface properties for uniform deposition.
Sintering Process
Follow recommended sintering profiles to achieve proper adhesion and electrical properties while maintaining substrate integrity.
Final Assembly
Integrate completed thick film circuits into final assemblies, leveraging the substrate's thermal management capabilities for optimal performance.

Application Scenarios

Power Electronics and Control Systems

Ideal for power converters, motor drives, and industrial control systems where efficient heat dissipation from power devices is critical for reliability and performance in demanding industrial environments.

High-Frequency Communication Equipment

Essential for RF power amplifiers, base station components, and microwave components requiring stable dielectric properties and minimal signal loss in high-frequency applications.

Advanced Sensor Systems

Perfect for sensor packaging applications where thermal stability and electrical insulation are crucial for accurate sensing and long-term reliability in harsh operating conditions.

Hybrid Microcircuits

Superior platform for thick film hybrid microcircuits and integrated circuit packaging, providing the thermal management and electrical performance needed for advanced electronic systems.

Customer Benefits

Enhanced Thermal Performance: Superior heat dissipation extends component lifespan and improves system reliability
Improved Circuit Performance: Excellent electrical insulation reduces signal interference and improves accuracy
Design Flexibility: Custom thickness, surface finishes, and metallization options support innovative designs
Cost Efficiency: Reduced cooling requirements and improved reliability lower total system costs
Manufacturing Consistency: Vertical integration ensures consistent quality and reliable supply

Certifications & Compliance

Puwei Ceramic maintains the highest quality standards with comprehensive certification and quality management systems ensuring consistent product quality and performance.

ISO 9001:2015 Quality Management System Certified
RoHS & REACH Compliance for environmental safety
Comprehensive material traceability and batch control
Rigorous incoming and outgoing quality inspection protocols
Industry-standard testing and performance validation

Customization Options

Puwei offers comprehensive customization services for Aluminum Nitride Ceramic Substrates tailored to specific thick film circuit requirements and application needs.

Customization Features

Thickness Options: From 0.10mm to standard thicknesses with precise control
Surface Finishes: Grinding type, as-fired, high bending resistance, high thermal conductivity, polishing type, laser marking
Thermal Conductivity Grades: Standard (≥175W/m·K) and ultra-high (≥200W/m·K)
Metallization Compatibility: DPC, DBC, TPC, AMB, thick film printing, thin film printing
Special Features: Custom shapes, holes, and specific dimensional requirements

Vertical Integration Advantage

Complete control from raw material research and development to finished ceramic products ensures consistent quality, competitive pricing, and reliable supply for all customization requirements in electronic packaging and advanced microelectronics applications.