AlN Ceramic Baseplate
13 month ago
Aluminum Nitride Ceramic Substrate for Thick Film Circuits
Puwei's Aluminum Nitride Ceramic Substrates are engineered as the superior foundation for advanced thick film hybrid microcircuits. By combining exceptional thermal conductivity with outstanding electrical insulation, they solve critical thermal management challenges in high-performance electronic packaging and microelectronics packaging.
Core Advantages
- Superior Heat Dissipation: Thermal conductivity of 170-230 W/(m·K) for reliable power devices operation.
- Excellent Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm, ideal for high-frequency modules.
- Robust & Stable: High chemical resistance and thermal expansion matching with thick film materials.
- Optimized for Manufacturing: Surface finishes tailored for precise thick film printing and sintering.
Technical Specifications
Material Properties
Our AlN substrates guarantee performance with the following key properties: Thermal Conductivity ranging 170-230 W/(m·K), Volume Resistivity >10¹⁴ Ω·cm, Dielectric Constant of 8.5-9.0 @ 1MHz, Dielectric Strength of 15-20 kV/mm, and Flexural Strength of 300-400 MPa. Surface roughness is customizable for optimal thick film adhesion.
Manufacturing Capabilities
We offer standard grade (≥175W/m·K) and ultra-high thermal conductivity (≥200W/m·K) options. Minimum achievable thickness is 0.10mm with various surface finishes (as-fired, ground, polished). Our substrates are compatible with multiple metallization techniques including DBC, DPC, AMB, and are specifically optimized for thick film printing processes.
Key Features & Performance Benefits
-
Unmatched Thermal Management
Directly dissipates heat from high-power microelectronic components, preventing thermal runaway and extending component lifespan in power devices and integrated circuit packages.
-
Reliable High-Frequency Performance
Low dielectric loss and consistent dielectric properties ensure signal integrity, making it a prime choice for microwave applications and RF circuits.
-
Exceptional Mechanical & Chemical Stability
High flexural strength and resistance to corrosive environments ensure long-term durability and reliability in harsh operating conditions.
-
Optimized for Thick Film Processing
The meticulously controlled surface provides an ideal platform for uniform paste deposition, ensuring high yield and performance in your thick film hybrid microcircuits.
Simplified Integration Process
Follow these general guidelines for optimal results with Puwei AlN substrates in your microelectronics production:
- Selection: Choose thickness and surface finish based on thermal and electrical design requirements.
- Preparation: Ensure the substrate is clean and free of contaminants before printing.
- Printing: Apply thick film pastes using standard screen printing techniques.
- Firing: Follow the recommended sintering profile for the paste system used.
- Assembly: Integrate the fired circuit into the final package or system.
Application Scenarios
Power Electronics & Control Systems
Essential for IGBTs, power converters, and motor drives where efficient heat dissipation from power devices is critical for system reliability.
High-Frequency & RF Communications
Used in RF power amplifiers, base station components, and microwave components requiring stable electrical properties at high frequencies.
Advanced Sensing & Packaging
Ideal for high-precision sensor packaging where thermal stability ensures measurement accuracy and long-term stability.
Hybrid & Integrated Microelectronics
The substrate of choice for demanding thick film hybrid microcircuits and high-density electronic packaging solutions.
Production Capabilities & Quality Assurance
Our vertical integration ensures full control from high-purity powder to finished substrate.
- Material Science: Proprietary AlN powder formulation for optimal properties.
- Precision Forming: Advanced processes to achieve precise dimensions and density.
- Controlled Sintering: State-of-the-art firing for superior thermal and mechanical performance.
- Rigorous Inspection: 100% critical parameter testing ensures every batch meets specifications.
Customization Options
Puwei tailors AlN substrates to your specific design needs for microelectronics packaging:
- Thickness: From 0.10mm upward with tight tolerances.
- Surface Finish: As-fired, ground, polished, or laser marked.
- Thermal Conductivity: Standard (≥175 W/m·K) or Ultra-High Grade (≥200 W/m·K).
- Geometry: Custom shapes, sizes, and hole patterns available.
- Metallization Ready: Optimized surfaces for subsequent DBC, DPC, AMB, or thick film processes.
Certifications & Compliance
Puwei is committed to quality and environmental responsibility, demonstrated by our ISO 9001:2015 certification and compliance with RoHS and REACH regulations. Our stringent quality management system ensures full traceability and consistent performance.
Why Choose Puwei AlN Substrates?
- Enhance Reliability: Superior thermal management reduces failure rates in critical applications.
- Improve Performance: Enable higher power density and faster switching speeds in your designs.
- Reduce System Cost: Minimize or eliminate complex cooling solutions, lowering overall assembly cost.
- Simplify Supply Chain: Vertical integration guarantees consistent quality, competitive pricing, and reliable supply.
- Accelerate Development: Leverage our engineering expertise for custom solutions that fit your application perfectly.
Similar Video Recommendation
If you are interested in the product, contact Bossgoovideo.com for more information
- *To:
- Shaanxi Puwei Electronic Technology Co., Ltd
- *Message:
-
Submit
Main Product:
Alumina Ceramic Substrates ,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate