Aluminum Nitride Ceramic Baseplate
13 month ago
Aluminum Nitride (AlN) Ceramic Substrate
Puwei's Aluminum Nitride Ceramic Substrates are advanced thermal management solutions engineered for high-performance electronic systems. Manufactured using precision casting technology, these substrates provide exceptional thermal conductivity (≥175 W/m·K) and superior electrical insulation, making them ideal for demanding applications in electronic packaging, power devices, and high-frequency modules. Our vertically integrated production ensures consistent quality from raw materials to finished ceramic components.
Technical Specifications
Material: High-purity Aluminum Nitride (AlN). Thermal Conductivity: Standard grade ≥175 W/m·K, Premium grade ≥200 W/m·K. Thickness Range: 0.10 mm to 1.5 mm (minimum 0.10 mm). Electrical Properties: Volume resistivity >10¹⁴ Ω·cm, Dielectric strength >15 kV/mm. Mechanical Properties: Flexural strength >300 MPa. Temperature Range: -50°C to 400°C. CTE: Matched to silicon (4.5×10⁻⁶/K). Surface Finish: Ra ≤ 0.4 μm (polished). These properties ensure reliable performance in integrated circuit and high-power microelectronic component applications.
Product Features & Competitive Advantages
Exceptional Thermal Management
With thermal conductivity up to 200 W/m·K, our AlN substrates efficiently dissipate heat from high-density power devices and microwave components, preventing thermal runaway and extending device lifespan.
Versatile Metallization Compatibility
Supports DPC, DBC, AMB, thick film, and thin film printing, offering design flexibility for RF circuits, thick film hybrid microcircuits, and thermoelectric cooling assemblies.
Precision Manufacturing & Customization
Advanced casting technology ensures dimensional accuracy and surface quality. We offer customized thickness (down to 0.10 mm), surface finishes, and sizes up to 150×200 mm for sensor packaging and optoelectronics applications.
Superior Electrical Insulation
High dielectric strength and volume resistivity make it an excellent insulation element, ensuring safety and performance in high-voltage environments and microelectronics packaging.
Implementation Guidelines
- Design Consultation: Work with our engineers to specify substrate parameters based on your thermal, electrical, and mechanical requirements.
- Metallization Selection: Choose the appropriate metallization technique (DPC, DBC, thick film, etc.) for your circuit design and assembly process.
- Surface Preparation: Select the required surface finish (as-fired, ground, or polished) to ensure optimal component attachment and performance.
- Thermal Integration: Incorporate the substrate's high thermal conductivity into your system's thermal management design.
- Quality Verification: Perform standard tests for thermal performance, electrical isolation, and mechanical integrity before full-scale production.
Application Scenarios
Power Electronics & Semiconductor Devices
Ideal for IGBT modules, power converters, and inverters as an insulation element and heat spreader, enhancing the reliability of high-power microelectronic components.
RF & Microwave Communication
Provides low dielectric loss and stable performance for high-frequency modules, microwave applications, and RF power amplifiers in communication infrastructure.
Advanced Electronics Packaging
Critical for microelectronics packaging, sensor packaging, and thermoelectric semiconductor module plates, enabling miniaturization with superior thermal management.
Optoelectronics & LED Systems
Used as a heat sink substrate for high-power LEDs, laser diodes, and other optoelectronics applications where efficient heat dissipation is crucial for performance and longevity.
Value Proposition for Business
- Extended Component Life: Superior heat dissipation reduces thermal stress, significantly increasing the lifespan of sensitive electronic components.
- Increased Power Density: Enables more compact designs by allowing higher power loads in smaller spaces.
- Reduced System Costs: Minimizes the need for complex external cooling systems, lowering overall assembly and maintenance costs.
- Enhanced Reliability: Excellent material stability ensures consistent performance in harsh environments, reducing failure rates.
- Design Flexibility: Comprehensive customization options allow for optimized solutions tailored to specific application needs.
Quality Assurance & Compliance
Manufactured in ISO 9001:2015 certified facilities. Our vertically integrated process includes rigorous quality control at every stage—from raw material inspection to final product testing—ensuring that every AlN substrate meets the highest standards for ceramic chips and advanced electronic applications.
Customization Options
Puwei provides extensive customization to meet your exact specifications:
- Dimensions: Custom sizes up to 150×200 mm and thickness from 0.10 mm.
- Surface Finish: As-fired, ground, or polished surfaces with controlled roughness.
- Metallization: DPC, DBC, AMB, thick film, or thin film printing with custom patterns.
- Material Properties: Tailored formulations for high bending strength or enhanced thermal conductivity.
- Special Features: Laser marking, through-holes, and specific edge treatments.
Production Process & Quality Control
Our manufacturing excellence is built on a controlled process: High-purity AlN powder formulation → Precision casting and forming → Controlled sintering at high temperatures → Precision grinding and surface finishing → Comprehensive inspection (dimensional, thermal, electrical) → Packaging. Statistical process control (SPC) ensures batch-to-batch consistency, making our substrates reliable ceramic components for your most critical applications.
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