metallized ceramics

11 month ago

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Shaanxi Puwei Electronic Technology Co., Ltd

2 year

Product details

DPC (Direct Plated Copper) Metallized Substrate for Advanced Thin Film Circuits

Puwei's DPC Metallized Substrate is a high-precision foundation engineered for superior performance in demanding thin film applications. Combining exceptional thermal management with fine-line circuitry capabilities, it is the ideal choice for microelectronics packaging, high-frequency modules, and RF circuits where precision, reliability, and signal integrity are non-negotiable.

Core Advantages for Thin Film Circuit Fabrication

Ultra-Fine Circuit Patterning: Achieves trace widths and spacing down to 25µm, enabling high-density designs for advanced integrated circuits.
Exceptional Surface Quality: Mirror-like surface finish (Ra < 0.1µm) ensures uniform and reliable deposition of subsequent thin film layers.
Superior Thermal Performance: Utilizes high thermal conductivity ceramics (AlN up to 230 W/mK) for efficient heat dissipation from high-power microelectronic components.
Robust Metallurgical Bond: Peel strength ≥8 N/mm provides a durable foundation for complex multi-layer thick film hybrid microcircuits.

Puwei DPC Metallized Substrate showcasing fine copper traces on ceramic

Precision-engineered DPC substrate ready for thin film deposition and component integration.

Technical Specifications & Material Properties

Material Options & Physical Properties

Base Ceramic: High-purity Aluminum Nitride (AlN) or Alumina (Al₂O₃). AlN offers superior thermal conductivity (170-230 W/mK) for high-power applications, while Al₂O₃ provides a cost-effective solution with good electrical insulation.

Surface Roughness: Optimized to Ra < 0.1 µm, critical for achieving flawless adhesion in thin film processes.

Dielectric Properties: AlN dielectric constant ~8.8; Al₂O₃ ~9.8 @ 1MHz. Low loss tangent ensures minimal signal attenuation for microwave applications.

Metallization & Electrical Performance

Copper Layer: Thickness from 10 to 100 µm, formed via a direct plating process for excellent adhesion and conductivity.

Circuit Resolution: Line width/spacing down to 25 µm with registration accuracy of ±5 µm.

Electrical Insulation: Dielectric strength >15 kV/mm (AlN), >10 kV/mm (Al₂O₃). Insulation resistance >10¹² Ω·cm.

Frequency Performance: Suitable for applications up to 40 GHz, making it ideal for microwave components.

Comparison of AlN vs Al2O3 ceramic material properties for DPC substrates

Select the optimal ceramic material based on your thermal, electrical, and budgetary requirements.

Key Features & Technological Superiority

Precision That Enables Miniaturization

Our DPC process achieves circuit resolutions unattainable with traditional Alumina Ceramic Substrates or DBC Ceramic Substrates. This enables the creation of complex, high-density interconnects essential for modern microelectronics and miniaturized sensor packaging.
Engineered Surface for Flawless Film Deposition

The ultra-smooth, contaminant-free surface provides an ideal canvas for sputtering, evaporation, or CVD processes. This ensures optimal adhesion and performance of subsequent resistive, conductive, or dielectric thin films, critical for film resistor elements and functional layers.
Thermal Management at the Core

By directly plating copper onto high thermal conductivity ceramics, we create an efficient thermal path that effectively draws heat away from sensitive active areas. This is vital for the longevity and reliability of power devices and laser diodes.
Signal Integrity for High-Frequency Designs

The combination of low-loss ceramic materials and precision-defined copper traces minimizes parasitic effects, preserving signal integrity in demanding RF circuits and optoelectronics applications.

Streamlined Integration into Your Thin Film Process

Integrating Puwei DPC substrates into your manufacturing flow is straightforward and reliable.

Surface Preparation: Begin with a light plasma clean or chemical activation of the substrate surface to maximize adhesion for your first thin film layer.
Thin Film Deposition: Proceed with your standard deposition processes (sputtering, evaporation, etc.) to build up conductive, resistive, or insulating layers as per your circuit design.
Patterning & Etching: Use photolithography to define your thin film circuit patterns, followed by precision etching to complete the multi-layer structure.
Component Attachment: Mount semiconductor dies, passive components, or bare ceramic plates using wire bonding, soldering, or epoxy attach techniques.
Final Test & Hermetic Sealing: Perform electrical validation and, if required, proceed with hermetic sealing for high-reliability applications.

Targeted Application Scenarios

RF & Microwave Modules

Core substrate for low-noise amplifiers, filters, and antenna modules operating up to 40 GHz. The excellent high-frequency characteristics ensure minimal signal loss.

Advanced MEMS & Sensor Packaging

Provides a stable, flat, and electrically isolated platform for micro-electromechanical systems (MEMS) and high-precision sensors, crucial in automotive and medical devices.

High-Power LED & Laser Diodes

Superior heat spreading capability makes it an excellent choice for packaging high-brightness LEDs and laser diodes, extending device lifespan and maintaining output stability.

Medical & Aerospace Electronics

Used in implantable medical devices and avionics where unmatched reliability, precision, and performance under extreme conditions are mandatory.

Why Partner with Puwei for Your DPC Substrates?

Boost Performance & Yield: Our superior surface quality and dimensional stability reduce thin film deposition defects, directly improving your manufacturing yield and end-product performance.
Enable Design Innovation: Fine-line patterning capability gives your R&D team the freedom to pursue more compact and higher-performing device architectures.
Reduce System Cost & Complexity: Excellent inherent thermal conductivity can simplify or eliminate secondary cooling solutions, reducing overall system cost and size.
Ensure Supply Chain Resilience: Vertical control over ceramic formation and metallization processes guarantees consistent quality, stable pricing, and dependable supply.
Access Expert Collaboration: Tap into our engineering team’s deep application knowledge for design support and process optimization.

Precision Manufacturing & Rigorous Quality Control

DPC substrate manufacturing process flow diagram

Our end-to-end controlled manufacturing process ensures every substrate meets the highest standards.

Our Quality Assurance Commitment

Incoming Material Certification: Verification of ceramic powder purity and copper foil quality.
In-Line Process Monitoring: Real-time control of plating thickness, adhesion strength, and surface morphology.
100% Electrical Testing: Every substrate undergoes continuity and high-potential insulation testing.
Dimensional & Visual Inspection: Automated optical inspection (AOI) for circuit integrity and precision metrology for critical dimensions.

Comprehensive Customization & OEM/ODM Services

We tailor our DPC substrates to fit your exact specifications, offering true design partnership.

Material Choice: Select from AlN, Al₂O₃, or inquire about specialized Aluminum Nitride Substrates for extreme thermal needs.
Dimensions & Form Factor: Custom sizes and shapes, including large formats (e.g., 240mm x 280mm) for panel-level processing.
Copper Thickness & Circuit Design: Copper thickness from 10-100µm per side, with full support for custom, complex circuit patterning.
Surface Finish: Options include bare copper, Electroless Nickel Immersion Gold (ENIG), or immersion silver for enhanced solderability and shelf life.
Advanced Features: Plated through holes (PTH), blind vias, and cavity structures to support multi-layer and 3D packaging architectures.

Certifications & Global Compliance

Puwei operates under an ISO 9001:2015 certified quality management system. Our materials and processes comply with RoHS and REACH environmental directives, and our substrates meet relevant UL safety standards. Full material traceability and batch consistency documentation are provided, ensuring your products are ready for global market entry.