metallized ceramics
9 month ago
DPC Metallized Substrate for Thin Film Circuits
Product Overview
The DPC Metallized Substrate for Thin Film Circuits represents precision engineering at its finest, specifically designed for high-performance thin film applications requiring exceptional electrical characteristics and thermal management. As specialists in Metallized Ceramics, Puwei Ceramic delivers substrates that enable superior performance in advanced electronic systems.
Key Advantages for Thin Film Applications
- Ultra-Precise Patterning: Sub-micron resolution for intricate thin film circuits
- Exceptional Surface Finish: Ra < 0.1 μm for uniform thin film deposition
- Superior Thermal Management: Efficient heat dissipation for high-density circuits
- Excellent Adhesion: Strong copper-to-ceramic bond for reliable thin film layers
Product Visualization
Premium DPC Metallized Substrate optimized for thin film circuit fabrication
Technical Specifications
Material Properties
- Base Materials: Aluminum Nitride (AlN) or Aluminum Oxide (Al₂O₃)
- Surface Roughness: Ra < 0.1 μm (critical for thin film deposition)
- Thermal Conductivity: AlN: 170-230 W/mK, Al₂O₃: 20-30 W/mK
- Dielectric Constant: AlN: ~8.8, Al₂O₃: ~9.8 (at 1MHz)
Metallization Specifications
- Copper Thickness: 10-100 μm (optimized for thin film processes)
- Line Width/Spacing: Down to 25 μm resolution
- Registration Accuracy: ±5 μm for precise alignment
- Peel Strength: ≥8 N/mm for reliable thin film adhesion
Electrical Characteristics
- Insulation Resistance: >10¹² Ω·cm
- Dielectric Strength: >15 kV/mm (AlN), >10 kV/mm (Al₂O₃)
- Surface Resistivity: <1.8 μΩ·cm for copper layers
- Frequency Range: Suitable up to 40 GHz applications
Dimensional Tolerances
- Substrate Thickness: 0.15mm - 1.0mm (thin film optimized)
- Thickness Tolerance: ±0.01 mm
- Flatness: <0.02 mm/25 mm
- Via Diameter: 50-200 μm (plated through holes available)
Available Ceramic Types and Properties
Comprehensive material selection guide for optimal thin film performance
Material Selection Guidance
- Aluminum Nitride (AlN): Ideal for high-power thin film circuits requiring superior thermal conductivity
- Alumina (Al₂O₃): Cost-effective solution for standard thin film applications with good electrical properties
- Specialized Options: Si3N4 Ceramic AMB Copper-clad Substrate available for applications requiring extreme mechanical strength
Product Features & Competitive Advantages
Ultra-Precision Patterning Capability
Our DPC technology enables circuit patterns with resolutions down to 25 μm, supporting the most demanding thin film applications. This precision surpasses traditional Alumina Ceramic Substrates and enables higher circuit density and performance in compact designs.
Exceptional Surface Quality
With surface roughness maintained below 0.1 μm Ra, our substrates provide the ideal foundation for subsequent thin film deposition processes. The mirror-like finish ensures uniform layer deposition and optimal adhesion for additional thin film materials.
Superior Thermal Management
The combination of high thermal conductivity ceramics and precision copper metallization provides efficient heat spreading, crucial for thin film circuits where localized heating can affect performance and reliability.
Enhanced Signal Integrity
Low dielectric constant and loss tangent ensure minimal signal distortion at high frequencies, making our substrates ideal for RF and microwave thin film circuits where signal integrity is paramount.
Three-Step Manufacturing Excellence
- Substrate Preparation and Surface Optimization
Begin with high-purity ceramic substrates that undergo precision polishing to achieve sub-micron surface finish. Rigorous cleaning eliminates contaminants that could compromise thin film adhesion and electrical performance.
- Seed Layer Deposition and Copper Metallization
Advanced sputtering technology deposits uniform seed layers, followed by controlled electroplating to build copper thickness with exceptional consistency. Process parameters are meticulously controlled to ensure optimal conductivity and adhesion.
- Precision Patterning and Circuit Definition
State-of-the-art photolithography and etching techniques create intricate circuit patterns with micron-level accuracy. This final step transforms the copper layer into precise conductive pathways tailored to specific thin film circuit requirements.
Thin Film Circuit Integration Guidelines
- Surface Activation and Preparation
Begin with plasma treatment or chemical activation to enhance surface energy, ensuring optimal adhesion for subsequent thin film layers.
- Thin Film Deposition
Utilize sputtering, evaporation, or chemical vapor deposition to apply additional conductive, resistive, or dielectric layers as required by your specific thin film circuit design.
- Pattern Transfer and Etching
Apply photoresist and use photolithography to define additional circuit elements, followed by precise etching to create the complete thin film circuit structure.
- Component Integration
Mount active and passive components using appropriate bonding techniques, leveraging the excellent thermal and electrical properties of the DPC substrate.
- Testing and Validation
Perform comprehensive electrical, thermal, and reliability testing to ensure the integrated thin film circuit meets all performance specifications.
Production and Quality Assurance Process
Comprehensive manufacturing workflow ensuring highest quality standards for thin film circuits
Quality Control Measures
- Incoming Material Inspection: Verification of ceramic material properties and purity
- In-Process Monitoring: Real-time monitoring of thickness, roughness, and adhesion
- Electrical Testing: 100% continuity and insulation resistance verification
- Dimensional Verification: Precision measurement of critical dimensions and tolerances
- Surface Analysis: Microscopic examination and profilometry for surface quality
Application Scenarios
Advanced Integrated Circuits
Critical for high-density integrated circuits requiring precise interconnects, bonding pads, and conductive structures. The sub-micron precision of our DPC substrates enables complex circuit designs with high component density, outperforming conventional DBC Ceramic Substrate solutions in fine-pitch applications.
Microelectromechanical Systems (MEMS)
Essential for MEMS devices where stable platforms integrate mechanical and electrical components. The exceptional thermal and electrical properties ensure reliable operation of MEMS sensors, actuators, and microsystems in demanding environments.
High-Performance Optoelectronics
Ideal for advanced optoelectronic devices including high-power LEDs, laser diodes, and photodetectors. The superior heat dissipation and electrical conductivity significantly enhance device performance, reliability, and lifespan in optical communication systems.
RF and Microwave Circuits
Perfect for high-frequency applications including RF modules, microwave circuits, and millimeter-wave systems. The low dielectric loss and high conductivity enable excellent signal integrity with minimal attenuation up to 40 GHz frequencies.
Medical and Aerospace Electronics
Increasingly adopted in medical imaging systems, implantable devices, and aerospace electronics where reliability, precision, and thermal stability are critical requirements in challenging operating environments.
Customer Benefits and Value Proposition
Enhanced Circuit Performance
Our precision DPC substrates enable thinner traces, closer spacing, and higher circuit densities, directly translating to improved electrical performance and miniaturization capabilities for your thin film applications.
Improved Manufacturing Yield
The exceptional surface quality and dimensional stability of our substrates reduce defects in subsequent thin film processes, improving overall manufacturing yield and reducing production costs.
Extended Product Lifespan
Superior thermal management and mechanical stability ensure reliable operation under thermal cycling and mechanical stress, extending the operational lifespan of your thin film devices.
Design Flexibility
The combination of precision patterning and excellent material properties provides engineers with greater design freedom for innovative thin film circuit architectures.
Quality Certifications and Compliance
Puwei Ceramic maintains the highest quality standards with comprehensive international certifications:
- ISO 9001:2015 Quality Management System Certification
- RoHS Compliance for environmental safety
- REACH Certification for chemical substance management
- UL Recognition for safety standards
- Industry-specific quality certifications (Certificate: GXLH41023Q10642R0S)
- Material traceability and batch consistency documentation
Customization Options and OEM/ODM Services
As experts in Electronic Ceramic Products, we offer comprehensive customization services tailored to your specific thin film application requirements:
Large Format Specialization
Our expertise in large dimension ceramic substrates, including sizes such as 240 × 280 × 1 mm and 95 × 400 × 1 mm, has earned consistent praise from clients in the thin film industry. These capabilities position us as preferred suppliers for applications requiring substantial substrate areas for multi-device integration.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates ,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate