DBC Substrate

11 month ago

45 0 

Shaanxi Puwei Electronic Technology Co., Ltd

2 year

Product details

Direct Bonded Copper (DBC) Alumina Ceramic Substrates

Puwei's Direct Bonded Copper (DBC) Alumina Substrates are the cornerstone of reliable, high-performance electronic packaging. Engineered for critical applications, they provide an unparalleled combination of thermal dissipation and electrical isolation for power devices, integrated circuits, and advanced microelectronics packaging.

Engineered for Demanding Applications

As a leading Alumina Ceramic DBC Substrate Manufacturer, we fuse high-purity Al₂O₃ ceramic with oxygen-free copper through a direct bonding process. This creates a robust, monolithic structure ideal for managing the extreme demands of modern high-power microelectronic components.

Core Advantages at a Glance

Superior Thermal Management: High thermal conductivity (~24W/(m·K)) effectively removes heat, preventing device failure.
Exceptional Electrical Isolation: Withstands voltages >2.5kV, ensuring safety and reliability in high-power circuits.
Unmatched Bond Strength: Peel strength ≥5.0 N/mm guarantees long-term integrity under thermal and mechanical stress.
Reduced Thermal Stress: CTE (~7.1ppm/K) closely matches silicon, crucial for durable sensor packaging and semiconductor attachments.

Puwei DBC Alumina Substrate showing precision copper circuit on ceramic

Technical Specifications & Performance Data

Material & Thermal Properties

Our substrates feature a consistent thermal conductivity of approximately 24W/(m·K) and operate reliably across a wide temperature range (-55°C to 850°C). The coefficient of thermal expansion (CTE) is approximately 7.1ppm/K, designed to minimize interfacial stress with silicon and other semiconductor materials in microelectronics assemblies.

Electrical & Mechanical Reliability

Electrical safety is paramount. Our DBC substrates offer a dielectric withstand voltage exceeding 2.5kV and high insulation resistance. The copper-ceramic bond, with a peel strength ≥5.0 N/mm, provides exceptional mechanical durability for rugged applications, including microwave components and automotive systems.

Quality & Compliance Assurance

All substrates exhibit excellent chemical stability and superior solderability (wettability ≥95%). They are non-hygroscopic and fully comply with RoHS and REACH environmental standards, making them suitable for global markets.

Technical performance chart for DBC Alumina Substrate

Key Features & Technological Edge

Optimized for Heat Dissipation

The direct copper bond creates a highly efficient thermal path, critical for cooling power devices like IGBTs and MOSFETs. Matched CTE extends component lifespan by reducing thermal cycling fatigue.
Built-in High-Voltage Barrier

High-purity alumina provides outstanding dielectric properties, preventing current leakage and ensuring safe operation in high-voltage power electronics, serving as reliable insulation elements.
Robust Mechanical Foundation

The metallurgical bond formed at high temperature ensures the copper layer remains intact during assembly, operation, and extreme thermal cycling, providing a stable platform for your circuits.
Manufacturing-Ready Surface

The oxygen-free copper surface offers excellent solderability and can be easily patterned using standard photolithography and etching processes, enabling custom and high-density circuit designs for high-frequency modules.

Target Application Scenarios

Puwei DBC Alumina substrates are essential in industries where thermal and electrical performance cannot be compromised.

Power Electronics & IGBT Modules

The core substrate for Insulated Gate Bipolar Transistors (IGBTs), power converters, and motor drives, where efficient heat dissipation from high-power microelectronic components is critical for reliability.

Automotive Electronics (EV/HEV)

Used in electric vehicle power control units (PCUs), onboard chargers, and battery management systems that demand unwavering reliability under harsh conditions and wide temperature swings.

Renewable Energy & Industrial Systems

Critical for solar inverters, wind power converters, industrial motor drives, and UPS systems, where long-term reliability and efficient thermal management directly impact system efficiency and lifetime.

Advanced Communications & Microwave Applications

Provides stable performance for RF circuits and microwave components where consistent dielectric properties and thermal management are required for signal integrity.

Simplified Integration Process

Follow these key steps to integrate Puwei DBC substrates into your electronic packaging design:

Design & Simulation: Define thermal and electrical requirements. Our engineering team can support your integrated circuit and power module layout.
Circuit Patterning: Apply photoresist and use photolithography to transfer your circuit design onto the copper layer.
Etching & Cleaning: Chemically etch exposed copper to create precise traces, then thoroughly clean the substrate.
Component Assembly: Solder or attach semiconductor dies and other components using the excellent wettability of the copper surface.
Validation: Perform electrical, thermal, and mechanical tests to ensure performance meets specifications.

Tailored Customization for Your Design

We provide tailored DBC solutions to meet your specific application needs, enabling innovative microelectronics packaging.

Dimensions & Thickness: Custom sizes, ceramic thickness from 0.2mm to 2.0mm.
Copper Thickness: Copper foil from 0.1mm to 0.6mm per side to match current-carrying capacity.
Circuit Patterns: Full custom copper patterning service for optimal component layout and thermal design.
Surface Finishes: Optional nickel, gold, or silver plating for enhanced solderability and corrosion resistance.
Material Alternatives: For extreme thermal performance, inquire about our Aluminum Nitride (AlN) DBC substrates.

Why Choose Puwei DBC Alumina Substrates?

Enhanced System Reliability: Superior thermal management extends the operational life of your power modules and power devices.
Design Freedom & Innovation: Custom patterns and sizes enable higher density and more efficient packaging solutions.
Total Cost Reduction: Excellent inherent thermal performance can reduce the need for complex and costly external cooling systems.
Supply Chain Security: Vertical manufacturing control ensures consistent quality, competitive pricing, and reliable on-time delivery.
Direct Engineering Support: Partner with our technical experts for design-in support and application optimization.

Production Excellence & Quality Assurance

Our vertically integrated manufacturing process ensures traceability and consistency at every stage:

Material Sourcing & Inspection: Rigorous testing of high-purity alumina and oxygen-free copper.
Precision Ceramic Formation: Controlled sintering to achieve optimal density and properties.
Direct Bonding Process: High-temperature bonding in a controlled atmosphere for a flawless interface.
Precision Machining: Laser or diamond cutting to exact dimensional tolerances.
Comprehensive Batch Testing: Every batch undergoes electrical, thermal, mechanical, and visual inspection.

Certifications & Compliance

Our commitment to quality is systemically enforced through our ISO 9001:2015 certified quality management system. All products comply with RoHS and REACH standards, ensuring suitability for global markets.