Direct Bonded Copper DBC Metallization of AlN Ceramic Substrate
9 month ago
Direct Bonded Copper (DBC) Substrate for High-Performance Thick Film Circuits
Puwei Ceramic specializes in high-performance Direct Bonded Copper (DBC) Substrates, engineered for demanding thick film circuit applications. Our DBC substrates combine exceptional electrical insulation, superior thermal management, and robust mechanical strength, making them ideal for Power Devices, automotive systems, and industrial equipment.
With decades of expertise in Alumina Ceramic Substrates and advanced materials, we deliver reliable solutions that enhance circuit efficiency and longevity. Key advantages include high dielectric strength, low thermal resistance, and customizable dimensions, ensuring compatibility with various electronic designs.
Technical Specifications
Electrical Properties
- Dielectric Withstand Voltage: Exceeds 2.5 kV, providing effective isolation against leakage and short circuits
- Surface Resistance: Ranges from micro-ohms to milli-ohms, ensuring minimal signal attenuation
- Dielectric Constant: Approximately 9.4 at 25°C/1MHz, supporting high-speed signal integrity
- Dielectric Loss Tangent: ≤ 3×10⁻⁴ at 25°C/1MHz, reducing energy loss in high-frequency operations
Thermal Properties
- Thermal Conductivity: Ceramic portion reaches ~170 W/(m·K), copper layer ~385 W/(m·K)
- Coefficient of Thermal Expansion: Around 7 ppm/K, matching silicon chips to minimize thermal stress
- Maximum Operating Temperature: Suitable for high-temperature applications up to 260°C
Mechanical Properties
- Peel Strength: ≥ 5.0 N/mm, ensuring durable bonding between copper and ceramic layers
- Bending Strength: High resistance to external forces and vibrations
- Hardness: Enhanced by ceramic base, offering excellent wear and scratch resistance
Product Visualization
High-quality DBC substrate for reliable performance in thick film circuits
Performance overview of DBC metallization substrates highlighting key parameters
Product Features & Advantages
Superior Thermal Management
High thermal conductivity efficiently dissipates heat, extending device lifespan in high-power applications. Ideal for Electronic Packaging where thermal performance is critical.
Enhanced Electrical Insulation
High dielectric strength prevents failures in demanding environments, ensuring reliable operation in high-voltage applications and RF circuits.
Robust Mechanical Integrity
Strong peel and bending strength resist physical stresses, making these substrates ideal for automotive and aerospace applications requiring durability.
Chemical and Moisture Resilience
Unaffected by harsh environmental conditions, reducing maintenance costs and ensuring long-term reliability in industrial settings.
Precision Solderability
Excellent welding wettability (≥ 95% with Sn/0.7Cu) ensures reliable bonding in multi-step assembly processes for Thick Film Printed Circuit applications.
Dimensional Accuracy
Tight thickness tolerance control and excellent flatness ensure seamless integration with electronic components and systems.
Installation & Integration Guidelines
- Design Preparation
Review circuit layout and ensure compatibility with substrate dimensions and thermal requirements
- Surface Preparation
Clean substrate surface with lint-free cloth and isopropyl alcohol to remove contaminants
- Soldering Process
Apply solder paste and use reflow ovens at temperatures up to 260°C for reliable connections
- Component Mounting
Attach electronic parts onto the copper layer, leveraging high weldability characteristics
- Performance Testing
Conduct electrical and thermal tests to verify insulation, conductivity, and heat dissipation
- System Integration
Install assembled substrate into end device, ensuring proper fit and thermal management
Application Scenarios
Power Electronics Systems
Used in inverters, converters, and IGBT modules for efficient heat management in high-power applications, including renewable energy systems and industrial drives.
Automotive Electronics
Applied in electric vehicle powertrains, battery management systems, and onboard chargers where reliability under thermal cycling is critical for safety and performance.
Industrial Control Systems
Supports high-frequency circuits in machinery controls and automation equipment, reducing downtime with robust performance in demanding industrial environments.
Renewable Energy Applications
Ideal for solar inverters and wind turbine power conversion systems, enhancing energy conversion efficiency and system reliability.
Advanced Communications
Integrated into High frequency module and RF communication equipment where stable thermal performance and signal integrity are essential.
Consumer Electronics
Used in high-power LED drivers, power supplies, and advanced consumer devices requiring efficient thermal management and electrical isolation.
Benefits for Industrial Customers
- Enhanced System Reliability
Superior thermal management and electrical insulation extend device lifespan and reduce failure rates in critical applications
- Improved Power Density
Excellent thermal conductivity enables higher power densities and improved system performance in compact designs
- Cost Efficiency
Reduced energy loss and longer service life lower total ownership costs through improved efficiency and reduced maintenance
- Design Flexibility
Customizable options allow adaptation to specific project requirements, speeding up time-to-market for new products
- Risk Reduction
Compliance with international standards and rigorous quality control minimizes failure risks in critical applications
- Technical Support
Comprehensive technical assistance from material selection through application optimization ensures successful integration
Certifications & Quality Assurance
Puwei Ceramic adheres to global quality benchmarks, ensuring product safety and reliability for international customers.
Quality Management
- ISO 9001 Certified Quality Management System
- RoHS and REACH Compliance for environmental safety
- Comprehensive material traceability and batch control
- Statistical process control for dimensional consistency
- Advanced metrology for precision verification
Manufacturing Process
- Material Selection
Source high-purity ceramics and copper materials, tested for consistency and performance characteristics
- Direct Bonding Process
Use advanced bonding technology to fuse copper and ceramic layers under controlled temperature and atmosphere conditions
- Precision Machining
Cut and shape substrates to specified tolerances using CNC equipment for dimensional accuracy
- Surface Treatment
Apply specialized surface finishes and treatments to optimize performance for specific application requirements
- Quality Verification
Conduct comprehensive electrical, thermal, and mechanical tests to verify all performance parameters
- Final Inspection
Rigorous final quality control ensures compliance with international standards and customer specifications
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate