Double-sided Metallized DBC Substrate

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Shaanxi Puwei Electronic Technology Co., Ltd

7 month

Product details

AlN Coated Copper DBC Substrate For Thermoelectric Modules

The AlN coated copper DBC substrate for thermoelectric modules is a really important material in the thermoelectric technology field.

It's made up of an aluminum nitride (AlN) ceramic substrate as the main material. There's a copper layer that's directly bonded to the surface of this ceramic substrate by using the direct bonded copper (DBC) technology.

The AlN ceramic substrate is really good at providing electrical insulation and also has high thermal conductivity. And the copper layer has good electrical conductivity and thermal conductivity too. So, together they can make heat dissipation happen efficiently and also make sure there's a good electrical connection.

DBC Substrate For Thermoelectric Modules

Working Principle

In thermoelectric modules, when an electric current passes through the AlN coated copper DBC substrate, the Peltier effect occurs at the junction of different semiconductor materials. The copper layer on the substrate plays a role in conducting electricity and heat, facilitating the transfer of heat between the hot and cold ends of the thermoelectric module, thereby realizing the refrigeration or heating function.

Performance Advantages

High Thermal Conductivity: The AlN ceramic substrate has a high thermal conductivity, which can quickly transfer the heat generated by the thermoelectric module to the outside, improving the refrigeration or heating efficiency.

Good Electrical Insulation: The AlN layer effectively isolates the electrical circuits on the copper layer, preventing electrical leakage and short circuits, and ensuring the safe operation of the thermoelectric module.

Strong Bonding Strength: The DBC technology makes the bonding between the copper layer and the AlN substrate very firm, with good mechanical stability, able to withstand the stress changes during the operation of the thermoelectric module without delamination or cracking.

Excellent Chemical Stability: Both AlN and copper have good chemical stability and can resist the corrosion of various chemicals, ensuring the long-term reliability of the substrate in different working environments.

Direct Bonded Copper DBC Metallization Substrate Performance Table

Application Fields

Thermoelectric Refrigeration: It is widely used in small refrigeration equipment such as portable refrigerators, beverage coolers, and electronic device cooling systems, providing efficient and reliable refrigeration solutions.

Thermoelectric Power Generation: In some waste heat recovery and energy harvesting systems, AlN coated copper DBC substrates can be used to convert heat energy into electrical energy through the thermoelectric effect, improving energy utilization efficiency.

Optoelectronic Devices: For the packaging and heat dissipation of optoelectronic devices such as laser diodes and light-emitting diodes, it helps to maintain the normal operation and extend the service life of the devices.

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Shaanxi Puwei Electronic Technology Co., Ltd

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7 month

Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics , AlN Ceramics Disc, DPC Substrate, DBC Ceramic Substrate

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