Double-sided Metallized DBC Substrate
9 month ago
Double-sided Copper Clad Laminate DBC Substrate
Puwei Ceramic's Double-sided Copper Clad Laminate DBC Substrate represents the pinnacle of electronic packaging technology. This high-performance substrate combines exceptional thermal management with superior electrical insulation, making it ideal for demanding applications in power electronics, automotive systems, and high-frequency circuits.
Core Technology Advantages
- Advanced Thermal Management: Efficient heat dissipation for high-power applications
- Superior Electrical Insulation: Excellent dielectric strength for reliable operation
- Double-sided Design: Enhanced circuit density and design flexibility
- Robust Mechanical Properties: High strength and dimensional stability
Advanced Double-sided DBC Substrate - Optimized for High-Performance Electronic Packaging
DBC Substrate Performance Specifications - Engineered for Reliability and Efficiency
Technical Specifications
Material Composition
- Ceramic Substrate: Alumina (Al₂O₃) or Aluminum Nitride (AlN)
- Copper Foil: High-purity oxygen-free copper (both sides)
- Bonding Technology: Direct Bonded Copper (DBC)
- Standard Thickness: 0.2mm - 2.00mm
Electrical Properties
- Dielectric Strength: 15-25 kV/mm (Al₂O₃), 15-20 kV/mm (AlN)
- Surface Resistivity: <0.1 mΩ·cm (copper layer)
- Insulation Resistance: >10¹³ Ω
- Dielectric Constant: 9.8 (Al₂O₃), 8.8 (AlN)
Thermal Performance
- Thermal Conductivity: 24-28 W/m·K (Al₂O₃), 170-200 W/m·K (AlN)
- Thermal Expansion: 6.5-7.5 ppm/°C (Al₂O₃), 4.5-5.5 ppm/°C (AlN)
- Operating Temperature: -55°C to 850°C
- Peel Strength: >8 N/mm
Advanced Features & Technical Advantages
Superior Thermal Management
The ceramic substrate's high thermal conductivity efficiently transfers heat from components to the entire substrate surface. Double-sided copper cladding further enhances heat dissipation, significantly reducing operating temperatures of electronic components. This thermal efficiency directly improves device reliability and extends service life in high-power microelectronic components and power devices.
Excellent Electrical Insulation
Ceramic materials provide outstanding insulating properties, effectively isolating different circuit layers and preventing short circuits and signal interference. This ensures stable operation of electronic equipment even in demanding electrical environments, making it ideal for electronic packaging and microelectronics packaging applications.
Enhanced Mechanical Stability
The ceramic substrate imparts exceptional hardness and mechanical strength, enabling the substrate to withstand external impacts, vibrations, and mechanical stress. It maintains dimensional stability across various operating conditions without warping or deformation, ensuring reliable performance in sensor packaging and precision applications.
Optimal Solderability and Conductivity
The copper foil surfaces offer excellent solderability, facilitating reliable connections with chips and electronic components. This ensures low-resistance electrical connections and efficient signal transmission, comparable to premium Aluminum Nitride Substrates for high-frequency applications.
Implementation & Integration Guide
- Design Preparation & Requirements Analysis
Review your circuit layout and thermal requirements. Ensure compatibility with substrate dimensions, copper thickness, and material selection based on application needs for integrated circuit and microelectronics applications.
- Surface Preparation & Cleaning
Thoroughly clean the copper surfaces using appropriate solvents to remove contaminants and oxidation, ensuring optimal adhesion and electrical performance.
- Circuit Patterning & Design Transfer
Apply photoresist and use photolithography to create your circuit pattern on both sides, leveraging the double-sided design for complex hybrid micro circuits and thick film hybrid microcircuits.
- Precision Etching Process
Use chemical etching to remove unwanted copper, creating the desired circuit traces with high precision and accuracy.
- Component Assembly & Mounting
Mount electronic components using soldering techniques suitable for the copper surface, ensuring reliable connections for microwave components and high-frequency modules.
- Thermal Management Integration
Ensure proper heat sinking if required, leveraging the substrate's excellent thermal conductivity for optimal performance in microwave applications and optoelectronics applications.
- Performance Testing & Validation
Perform comprehensive electrical and thermal testing to verify performance under operating conditions, ensuring reliability and compliance with specifications.
Industry Applications
Power Electronics & Energy Systems
- Insulated Gate Bipolar Transistors (IGBTs)
- Power MOSFETs and high-power semiconductor devices
- Solar inverters and wind turbine controllers
- Energy storage systems and power converters
High-Frequency & RF Applications
- Microwave communication systems
- Radar equipment and RF circuits
- 5G base stations and wireless infrastructure
- Satellite communication systems
Automotive & Transportation
- Electric vehicle power systems
- Autonomous driving modules
- Advanced driver assistance systems
- Charging infrastructure and power management
Industrial & Medical Electronics
- Industrial motor drives and controls
- Medical imaging equipment
- Laser systems and optoelectronic devices
- Test and measurement instrumentation
Business Value & ROI
Operational Benefits
- Enhanced Reliability: Superior thermal management extends component lifespan by 30-50% and reduces failure rates in critical applications
- Improved Performance: Excellent electrical properties ensure signal integrity and reduce power losses by up to 25% compared to conventional substrates
- Space Optimization: Double-sided design enables 40-60% higher circuit density and more compact device designs
- Cost Efficiency: Reduced cooling requirements and longer service life lower total cost of ownership by 20-35%
- Design Flexibility: Compatible with various assembly processes and component types, supporting rapid prototyping and customization
Advanced Manufacturing Process
- Ceramic Substrate Preparation
High-purity ceramic materials are formed and sintered to achieve optimal density and properties, ensuring consistent thermal and electrical performance.
- Copper Foil Treatment
Oxygen-free copper foil undergoes precise surface preparation and oxidation control to ensure optimal bonding strength and electrical conductivity.
- Direct Bonding Process
Copper and ceramic are bonded under high temperature and controlled atmosphere using advanced DBC technology, creating a strong metallurgical bond without intermediate layers.
- Precision Machining
Substrates are cut to exact dimensions using laser or diamond saw cutting, achieving tight tolerances and smooth edges for optimal performance.
- Quality Inspection & Testing
Each substrate undergoes comprehensive testing for electrical, thermal, and mechanical properties, ensuring compliance with industry standards and customer specifications.
- Surface Finishing & Packaging
Optional surface treatments and protective packaging ensure optimal solderability and prevent contamination during shipping and storage.
Quality Assurance & Certifications
Quality Standards
- ISO 9001:2015 Quality Management System Certified Manufacturing
- RoHS and REACH Environmental Compliance
- Industry-specific certifications for automotive and aerospace applications
- Comprehensive material traceability and documentation
- Statistical process control and continuous improvement protocols
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