Large-sized Aluminum Nitride Ceramic Substrate
11 month ago
Aluminum Nitride Ceramic Substrate for IGBT Power Modules: Premium Thermal Management Solution
Product Overview
Puwei's Aluminum Nitride (AlN) Ceramic Substrate is engineered specifically for high-reliability IGBT Power Modules and advanced power electronics. As a cornerstone of modern Electronic Packaging, this substrate delivers unparalleled thermal conductivity (170-230 W/m·K) to efficiently dissipate heat from High-Power Microelectronic Components. Its exceptional electrical insulation, matched coefficient of thermal expansion (CTE) to silicon, and robust mechanical properties make it the optimal choice for demanding applications in electric vehicles, renewable energy, and industrial drives, ensuring system longevity and reliability.
Why Choose Puwei AlN Substrates?
- Industry-Leading Thermal Conductivity: 170-230 W/(m·K) for maximum heat dissipation.
- Superior Reliability: Excellent CTE match to Si/SiC reduces thermal stress and failure.
- Comprehensive Metallization: Full range of DBC, DPC, AMB, and thick/thin film options.
- Proven Quality: Manufactured under IATF 16949 and ISO 9001 certified systems.
Product Visual Documentation
High-performance aluminum nitride substrate optimized for IGBT modules.
Detailed performance parameters for engineering selection.
Standard and custom dimensional capabilities.
Key Features & Competitive Advantages
Unmatched Thermal Management
With thermal conductivity up to 230 W/(m·K), our AlN substrates rapidly transfer heat away from IGBT dies, preventing hotspot formation and enabling higher power density and reliability. This is essential for next-generation High-Frequency Modules and compact designs.
Superior Electrical & Mechanical Performance
Combines excellent dielectric strength with high flexural strength (>300 MPa), providing robust insulation and structural integrity under mechanical vibration and thermal cycling stresses common in automotive and industrial environments.
Optimal CTE Matching
The CTE of AlN closely matches that of silicon (Si) and silicon carbide (SiC) semiconductors, significantly reducing thermal stress at critical die-attach interfaces and enhancing module lifetime in power cycling tests.
Versatile Metallization Platform
Supports all major interconnection technologies: DBC (Direct Bonded Copper) for high power, DPC (Direct Plated Copper) for fine features, AMB (Active Metal Brazing) for extreme reliability, and Thick Film Printing for Thick Film Hybrid Microcircuits.
Design & Integration Guidelines
- Thermal Analysis & Specification: Determine required thermal conductivity, substrate thickness, and size based on IGBT power loss and system cooling design.
- Metallization Selection: Choose DBC for high-current capacity, DPC for complex fine-line circuits, or AMB for highest reliability in harsh conditions.
- Circuit Layout Design: Provide Gerber files for circuit patterns, considering current density, creepage/clearance distances, and thermal via placement.
- Prototyping & Validation: Puwei can produce functional prototypes for thermal, power cycling, and electrical isolation testing under simulated operating conditions.
- Assembly Process Compatibility: Our substrates are compatible with standard die-attach (solder, sinter-silver) and wire bonding/welding processes.
Primary Application Scenarios
Electric & Hybrid Vehicle Powertrains
Used in traction inverters, OBC (On-Board Chargers), and DC-DC converters. AlN's high thermal conductivity and reliability under vibration are critical for automotive Power Devices.
Renewable Energy Inverters
Essential for solar and wind power inverters, where efficient heat dissipation maximizes energy conversion efficiency and system uptime.
Industrial Motor Drives & UPS
Provides reliable thermal management in high-power AC drives, servo drives, and Uninterruptible Power Supplies (UPS) for manufacturing and data centers.
Advanced RF & Microwave Power
Suitable for high-power Microwave Components and RF amplifiers where low dielectric loss and good thermal properties are required.
Value Proposition for B2B Buyers
- Increased Power Density & Efficiency: Enables smaller, more powerful modules by improving heat dissipation, reducing cooling system size and cost.
- Enhanced Reliability & Lifetime: Superior material properties and CTE matching reduce thermal fatigue, leading to lower field failure rates and extended product life.
- Reduced Total Cost of Ownership (TCO): Higher upfront cost is offset by improved system efficiency, reduced cooling needs, and lower warranty costs.
- Technical Partnership: Access to engineering expertise in Microelectronics Packaging and ceramic substrate design for optimized solutions.
Certifications & Quality Assurance
Our manufacturing meets the highest international standards, ensuring products suitable for automotive, industrial, and aerospace markets:
- IATF 16949:2016 certified for automotive quality management.
- ISO 9001:2015 certified quality management system.
- Fully compliant with RoHS and REACH environmental directives.
- UL recognized components available.
- Rigorous in-process and final inspection, including 100% dimensional checks and sample-based property testing.
Customization & OEM/ODM Services
We provide complete customization to meet your specific module design and performance requirements.
Advanced Manufacturing Process
- Powder Synthesis & Forming: High-purity AlN powder is tape-cast or dry-pressed into precise green bodies.
- Pressureless Sintering: Fired in nitrogen atmosphere at high temperature to achieve >99% density and optimal thermal properties.
- Precision Machining: CNC grinding and lapping achieve exact thickness, flatness, and surface finish.
- Metallization: Selected process (DBC/DPC/AMB) is applied under controlled conditions to form robust, reliable circuit layers.
- Comprehensive QC: Each batch undergoes thermal conductivity measurement, electrical testing, visual inspection, and dimensional verification.
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Main Product:
Alumina Ceramic Substrates ,
Aluminum Nitride Substrates,
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DPC Substrate,
DBC Ceramic Substrate