Large-sized Aluminum Nitride Ceramic Substrate

Product Overview

Puwei's Aluminum Nitride (AlN) Ceramic Substrate is engineered to meet the extreme thermal and electrical demands of modern IGBT陶瓷基板 (IGBT Ceramic Substrate) and high-density power modules. As a premier 高热导率陶瓷基板 (High Thermal Conductivity Ceramic Substrate), it efficiently channels heat away from silicon and SiC dies, enabling higher power density, improved efficiency, and unparalleled reliability in sectors like electric vehicles and renewable energy. It is a cornerstone technology in advanced Electronic Packaging and Power Devices.

Technical Specifications

Core Material Properties:

• Material: High-Purity Aluminum Nitride (AlN).
• Thermal Conductivity: 170 - 230 W/(m·K).
• Dielectric Strength: >15 kV/mm.
• Flexural Strength: >300 MPa.
• Coefficient of Thermal Expansion (CTE): ~4.5 ppm/K (excellent match to Si/SiC).
• Dielectric Constant: ~8.9 @ 1 MHz.

Available Metallization Technologies: DBC (Direct Bonded Copper), DPC (Direct Plated Copper), AMB (Active Metal Brazing), Thick Film Printing.

Standard Thickness: 0.25mm - 2.0mm (Custom from 0.1mm).

Max. Substrate Size: Up to 240mm x 280mm.

Product Visual Documentation

High-performance AlN substrate with precision metallization, ready for IGBT die attach.

Comprehensive performance data for engineering evaluation and selection.

Our flexible production capabilities for standard and custom dimensions.

Core Features & Competitive Advantages

• Industry-Leading Thermal Management: With thermal conductivity up to 230 W/mK, our AlN substrates rapidly dissipate heat, preventing hot spots and enabling smaller, more powerful modules. This outperforms traditional Alumina Ceramic Substrate (Al2O3) solutions.
• Unmatched Reliability via CTE Matching: The CTE of AlN closely matches silicon and silicon carbide, drastically reducing thermal stress at solder joints during power cycling, which is critical for the longevity of High power microelectronic components.
• Versatile & Robust Metallization Platform: We support all key technologies—DBC for high current, DPC for fine features, AMB for extreme environments—making our substrate adaptable for everything from Thick Film Hybrid Microcircuits to high-power IGBTs.
• Superior Electrical Insulation: High dielectric strength and volume resistivity ensure safe isolation even in high-voltage applications, functioning as excellent Insulation elements.

Design & Integration Guidelines

1. Define Requirements: Analyze power dissipation, operating voltage, and footprint constraints to determine substrate size, thickness, and required thermal conductivity.
2. Select Metallization: Choose DBC for maximum power handling, DPC for complex control circuits, or AMB for automotive-grade reliability.
3. Finalize Circuit Layout: Provide Gerber files. Our engineering team can review for optimal thermal via placement and creepage/clearance.
4. Prototype & Test: We produce and deliver functional prototypes for validation under your thermal and power cycling tests.
5. Volume Assembly: Our substrates are compatible with standard solder die-attach, silver sintering, and wire bonding processes.

Key Application Scenarios

• Electric Vehicle Powertrains: Traction inverters, on-board chargers (OBC), and DC-DC converters where high power density and reliability under vibration are mandatory.
• Renewable Energy & Industrial Drives: Solar/wind inverters, motor drives, and UPS systems, where efficient heat dissipation maximizes energy yield and system uptime.
• High-Frequency Power Conversion: Used in High-Frequency Modules and Microwave Applications for telecommunications and radar power supplies.
• Aerospace & Defense Power Systems: For avionics and military-grade power supplies demanding ultimate reliability and performance in harsh conditions.

Value Proposition for Industrial Buyers

• Increase Power Density & Efficiency: Enables up to 30% higher power density in the same footprint by improving heat spreading, potentially reducing heatsink size and cost.
• Extend Product Lifetime & Reduce Warranty Cost: Superior CTE matching and material properties reduce thermal fatigue, leading to fewer field failures.
• Reduce Total System Cost: While AlN has a higher unit cost, it lowers total ownership cost by enabling simpler cooling solutions and improving system efficiency.
• Accelerate Time-to-Market: Access to our integrated expertise in ceramic substrate and Microelectronics Packaging streamlines design and validation.

Certifications & Quality Assurance

Our production adheres to the highest international standards, ensuring suitability for the most demanding markets:

• IATF 16949:2016 certified for automotive applications.
• ISO 9001:2015 certified Quality Management System.
• Full compliance with RoHS and REACH environmental directives.
• Rigorous batch testing including thermal conductivity measurement, high-potential testing, and dimensional inspection.

Customization & OEM/ODM Services

We provide complete, tailored solutions to fit your exact module architecture:

• Dimensions & Geometry: Any custom size up to 240x280mm. Precision laser cutting for complex shapes, holes, and contours.
• Metallization Technology & Layout: Expert guidance on choosing and implementing DBC, DPC, or AMB for your circuit pattern.
• Surface Finish & Coating: Options include as-fired, lapped, or polished surfaces, with final coatings like Ni/Au or Ag.
• Material Grade: Selection of AlN grades optimized for ultra-high thermal conductivity or enhanced mechanical strength.

Advanced Manufacturing Process

1. Powder Processing & Forming: High-purity AlN powder is tape-cast or dry-pressed into precise "green" sheets.
2. Pressureless Sintering: Fired in a controlled nitrogen atmosphere to achieve >99% theoretical density and optimal thermal properties.
3. Precision Machining: CNC grinding and lapping ensure exact thickness, exceptional flatness, and required surface roughness.
4. Metallization Application: The selected metallization process (DBC/DPC/AMB) is applied under stringent controls to ensure adhesion and integrity.
5. Final Quality Control: Every production batch undergoes a battery of tests—thermal conductivity verification, electrical isolation testing, and 100% dimensional inspection—guaranteeing performance as a critical CERAMIC COMPONENT in your power system.