Alumina DBC substrates

9 month ago

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Shaanxi Puwei Electronic Technology Co., Ltd

12 month

Product details

Direct Bonded Copper (DBC) Metallization on Aluminum Nitride Substrate

Puwei's Direct Bonded Copper (DBC) Aluminum Nitride Substrates represent the pinnacle of advanced ceramic circuit technology, combining exceptional thermal management with superior electrical performance. These substrates are engineered for demanding applications in power devices, high-frequency modules, and advanced electronic packaging systems.

Core Advantages

Exceptional Thermal Conductivity: 170-230 W/(m·K) for superior heat dissipation
High Electrical Insulation: Excellent breakdown voltage and low dielectric loss
Matched Thermal Expansion: Compatible with semiconductor materials
Strong Copper Bonding: Reliable circuit connections without peeling
Chemical Resistance: Stable in harsh environments

Technical Specifications

Material Properties

Base Material: High-purity Aluminum Nitride (AlN)
Thermal Conductivity: 170-230 W/(m·K)
Dielectric Constant: 8.5-9.0 (stable across frequency ranges)
Breakdown Voltage: >15 kV/mm
Copper Thickness: 0.1-0.6 mm (customizable)
Surface Roughness: Ra ≤ 0.4 μm (polished finish)

Standard Dimensions

Substrate Thickness: 0.25-1.5 mm
Maximum Size: 150 × 150 mm
Copper Purity: ≥99.9% oxygen-free copper
Peel Strength: >8 N/mm
Operating Temperature: -55°C to 850°C

DBC Ceramic Substrate Performance Specifications

Product Features & Advantages

Performance Characteristics

Superior Thermal Management
With thermal conductivity of 170-230 W/(m·K) - significantly higher than alumina substrates - our DBC AlN substrates effectively dissipate heat from high-power microelectronic components, ensuring stable operation even in demanding thermal environments.
Excellent Electrical Properties
High breakdown voltage and low dielectric loss make these substrates ideal for high-frequency modules and microwave applications, ensuring minimal signal distortion and reliable performance in RF circuits.
Mechanical Reliability
The strong bonding between copper and AlN ceramic provides exceptional mechanical strength, preventing delamination and ensuring long-term reliability for integrated circuit applications.
Chemical Stability
Resistant to most acids, alkalis, and salts, these substrates maintain performance in harsh chemical environments, making them suitable for industrial and automotive applications.

Manufacturing Excellence

Material Preparation
High-purity AlN ceramic green sheets are prepared with precise dimensional control and surface quality.
Copper Foil Pretreatment
Oxygen-free copper foil undergoes surface treatment to ensure optimal bonding characteristics.
Direct Bonding Process
Controlled high-temperature bonding under specific pressure conditions creates a permanent, reliable bond between copper and ceramic.
Precision Patterning
Advanced photolithography and etching techniques create precise circuit patterns for microelectronics packaging applications.
Quality Verification
Comprehensive testing ensures dimensional accuracy, bond strength, and electrical performance meet specifications.

Application Scenarios

Power Electronics

Our DBC AlN substrates are essential for power devices including IGBT modules, power converters, and motor drives. The exceptional thermal management capabilities prevent overheating and ensure reliable operation in high-current applications.

High-Frequency Electronics

Ideal for microwave components and RF power amplifiers, these substrates provide stable dielectric properties across frequency ranges, making them perfect for telecommunications and radar systems.

Advanced Packaging Solutions

In electronic packaging and sensor packaging, DBC AlN substrates offer superior thermal performance and reliability for bare ceramic plates used in manufacturing assemblies of electronic integrated circuits.

Optoelectronics & Microelectronics

Supporting optoelectronics applications and microelectronics, these substrates provide the thermal stability and electrical insulation required for laser diodes, LED arrays, and advanced semiconductor devices.

Customer Benefits

Enhanced Thermal Performance: Superior heat dissipation extends component lifespan and improves reliability
Increased Power Density: Enables compact designs for high-power applications
Improved Signal Integrity: Stable dielectric properties ensure consistent high-frequency performance
Reduced System Costs: Eliminates need for complex cooling systems in many applications
Design Flexibility: Custom patterns and configurations support innovative product designs

Certifications & Compliance

Puwei Ceramic maintains the highest quality standards with comprehensive certification and compliance programs:

ISO 9001:2015 Quality Management System Certified
RoHS & REACH Compliance for environmental safety
Material purity certification for each production batch
UL 94 V-0 flame rating available
Industry-standard testing protocols for reliability verification

Customization Options

Puwei offers comprehensive customization services to meet specific application requirements for thick film hybrid microcircuits and advanced electronic systems:

Custom Sizes: Substrate dimensions tailored to your design requirements
Circuit Patterns: Precision copper patterning for specific circuit layouts
Thickness Options: Custom ceramic and copper thickness combinations
Surface Finishes: Various surface treatments including Ni/Au plating
Special Shapes: Non-standard geometries and cutouts
Multi-layer Designs: Complex multi-layer DBC structures

Production Process

Raw Material Quality Control
High-purity Aluminum Nitride powder is verified for composition and particle size distribution to ensure optimal thermal and electrical properties.
Ceramic Substrate Formation
Advanced forming techniques create precise AlN ceramic substrates with controlled density and surface characteristics.
Copper Foil Preparation
Oxygen-free copper foil undergoes surface oxidation control to optimize bonding characteristics.
Direct Bonding Operation
Controlled high-temperature process creates a permanent chemical bond between copper and ceramic under specific atmospheric conditions.
Circuit Pattern Definition
Photolithography and chemical etching create precise copper circuit patterns for thick film printed circuits and hybrid applications.
Final Inspection & Testing
Comprehensive quality control including visual inspection, dimensional verification, peel strength testing, and electrical performance validation.

Technical Advantages

Why Choose DBC AlN Over Alternative Materials?

vs. Alumina DBC: 8-10x higher thermal conductivity for better heat dissipation
vs. Direct Plated Copper: Superior bond strength and thermal cycling performance
vs. Insulated Metal Substrates: Higher operating temperatures and better high-frequency characteristics
vs. BeO Ceramics: Non-toxic alternative with comparable thermal performance

Integration with Other Puwei Products

Our DBC AlN substrates work seamlessly with other Puwei ceramic components including alumina ceramic substrates and specialized ceramic components for comprehensive electronic solutions in thermoelectric cooling assemblies and power conversion systems.