Double-sided copper-clad alumina DBC substrate
2 year ago
High-Performance Double-Sided Copper Clad Laminate (DBC) Substrate – Engineered for Extreme Power & Reliability
Product Overview
Advanced Double-Sided DBC Substrate enabling high-density circuit design and efficient thermal management.
Puwei's Double-Sided Direct Bonded Copper (DBC) Substrate represents the pinnacle of thermal management and electrical interconnection for modern power electronics. By creating a metallurgical bond between high‑purity copper foils and a high‑thermal‑conductivity ceramic core (Al₂O₃ or AlN), we deliver the foundational platform for electronic packaging that demands superior heat dissipation, exceptional insulation, and mechanical ruggedness. This substrate is the preferred choice for power devices, high‑power microelectronic components, and next‑generation IGBT ceramic substrates.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate