Double-sided copper-clad alumina DBC substrate

Product Overview

Puwei's Double-Sided Direct Bonded Copper (DBC) Substrate is engineered for extreme reliability in advanced power and high-frequency electronics. By metallurgically bonding high-purity copper foil onto both sides of a high-thermal-conductivity ceramic core, we create the ultimate solution for electronic packaging that demands superior heat dissipation, exceptional electrical insulation, and robust mechanical stability. It is the substrate of choice for next-generation power devices and high-power microelectronic components.

Advanced Double-Sided DBC Substrate enabling high-density circuit design and efficient thermal management.

Why Choose Puwei DBC Substrates?

• Unmatched Thermal Management: AlN core offers 170-200 W/m·K conductivity, drastically reducing junction temperatures and boosting reliability.
• Superior Electrical Performance: Excellent dielectric strength (15-25 kV/mm) and insulation resistance (>10¹³ Ω) for safe, reliable operation.
• Double-Sided Advantage: Maximizes circuit density and design flexibility for complex integrated circuit and hybrid micro circuits layouts.
• Proven Mechanical Robustness: High peel strength (>8 N/mm) and dimensional stability withstand thermal cycling and harsh environments.

Technical Specifications

Detailed performance data of our DBC substrates, showcasing material properties and advantages.

Material & Electrical Properties

• Ceramic Core: Alumina (Al₂O₃, 24-28 W/m·K) or Aluminum Nitride (AlN, 170-200 W/m·K).
• Copper Foil: Oxygen-free copper, thickness 100μm - 600μm per side.
• Dielectric Strength: 15-25 kV/mm (Al₂O₃), 15-20 kV/mm (AlN).
• Operating Temperature: -55°C to 850°C.

Key Features & Application Advantages

Our DBC substrates solve critical challenges in microelectronics packaging and sensor packaging:

• Efficient Heat Spreading: Transforms point heat from dies into area heat, eliminating hotspots.
• High Current Capacity: Thick copper layers support high-power traces with minimal loss.
• CTE Matching: Ceramic CTE closely matches silicon, reducing solder joint stress.
• Excellent Solderability: Provides a reliable surface for mounting chips and components in RF circuits.

Implementation Guide for Engineers

1. Design & Material Selection: Choose Al₂O₃ for cost-effectiveness or AlN for ultimate thermal performance in high-frequency modules.
2. Circuit Patterning: Use standard photolithography and etching processes on the double-sided copper.
3. Component Assembly: Solder power semiconductors, microwave components, or passive devices directly onto the copper.
4. Thermal Interface: Attach the substrate base to a heatsink using thermal grease or solder for maximum heat extraction.
5. Testing & Validation: Verify electrical isolation, thermal resistance, and mechanical integrity.

Target Applications

Puwei DBC substrates are critical in industries where performance cannot be compromised:

Automotive & EV Power

IGBT and power module substrates for traction inverters, OBC, and DC-DC converters, enabling higher power density and reliability.

Renewable Energy & Industrial

Solar inverter power stacks, wind turbine converters, and motor drives, where long-term reliability under thermal cycling is paramount.

RF & Microwave Communications

High-power RF packages, 5G infrastructure, and radar systems requiring low loss and stable dielectric properties for microwave applications.

Advanced Packaging

Foundational substrate for optoelectronics applications, laser diodes, and specialized thick film hybrid microcircuits.

Manufacturing Excellence & Quality

Our state-of-the-art DBC process ensures every substrate meets the highest standards:

1. Precision Ceramic Preparation: Sintering high-purity Al₂O₃ or AlN to achieve optimal density.
2. Controlled Oxidation Bonding: Copper foil is oxidized and bonded to the ceramic under high temperature in a controlled atmosphere, creating a strong metallurgical bond.
3. Precision Machining: Laser cutting to exact dimensions, including complex contours and via holes.
4. Rigorous 100% Inspection: Testing for adhesion (peel strength), dielectric withstand voltage, and dimensional accuracy.

Quality is assured by our ISO 9001:2015 certified system, with full compliance to RoHS and REACH.

Customization & Technical Partnership

We partner with customers to develop tailored solutions:

• Custom Sizes & Shapes: From small chips to large panels up to 240mm x 280mm.
• Material & Thickness: Select ceramic type, thickness (0.2mm-2.0mm), and copper weight.
• Pre-Patterned Substrates: We deliver substrates with your custom circuit pattern etched and ready for assembly.
• Surface Finishes: Options including Ni/Au plating for enhanced solderability and wire bonding.