Electronic Metallized Ceramic Substrate
11 month ago
AlN Coated Copper DBC Substrate For Thermoelectric Modules
Product Overview
Puwei Ceramic's AlN Coated Copper DBC Substrate represents a breakthrough in thermoelectric module technology, combining superior thermal management with exceptional electrical performance. This advanced substrate utilizes high-purity aluminum nitride ceramic with direct bonded copper layers to deliver unmatched reliability in demanding thermal applications. As leading specialists in Aluminum Nitride Substrates and DBC Ceramic Substrate manufacturing, we provide solutions that significantly enhance thermoelectric conversion efficiency and device longevity.
Core Benefits for Thermoelectric Applications
- Enhanced Thermal Conductivity: 170-200 W/(m·K) for superior heat transfer
- Reliable Electrical Isolation: Dielectric strength >2.5 kV prevents current leakage
- Robust Mechanical Bonding: Peel strength ≥5.0 N/mm ensures long-term durability
- Wide Temperature Range: Operational from -50°C to +350°C
- Optimized for Peltier Effect: Ideal for both cooling and power generation applications
Product Visual Documentation
High-performance AlN coated copper DBC substrate optimized for thermoelectric module applications
Specialized DBC substrate design for thermoelectric cooling (TEC) systems
Comprehensive performance specifications for DBC metallization substrates
Technical Specifications
Material Properties
- Ceramic Material: High-purity Aluminum Nitride (AlN)
- Copper Layer: Oxygen-free high conductivity copper
- Bonding Technology: Direct Bonded Copper (DBC)
- Thermal Conductivity: 170-200 W/(m·K)
Electrical Characteristics
- Dielectric Strength: >2.5 kV
- Surface Resistance: Micro-ohm to milli-ohm range
- Insulation Resistance: High resistance between circuits
Mechanical Properties
- Peel Strength: ≥5.0 N/mm
- Bending Strength: High resistance to mechanical stress
- Thermal Expansion Coefficient: 4.5-5.5 ppm/K
Thermal Performance
- Operating Temperature Range: -50°C to +350°C
- Thermal Cycling Performance: Excellent stability
- Heat Dissipation Capacity: Superior thermal transfer
Working Principle
In thermoelectric modules utilizing our AlN Coated Copper DBC Substrate, the Peltier effect creates precise temperature control when electric current passes through semiconductor junctions. The substrate's copper layers efficiently conduct both electricity and heat, facilitating rapid heat transfer between the hot and cold sides of thermoelectric elements. This enables highly efficient cooling or heating functions while maintaining electrical isolation through the AlN ceramic layer.
The direct bonded copper technology ensures minimal thermal resistance at the interface, maximizing the thermoelectric module's coefficient of performance (COP). This makes our substrates ideal for applications requiring precise temperature management in Thermoelectric Semiconductor Module Plates and advanced power electronics.
Product Features and Advantages
Exceptional Thermal Management
The aluminum nitride ceramic core provides thermal conductivity of 170-200 W/(m·K), significantly higher than conventional alumina substrates. This enables rapid heat transfer from thermoelectric elements, improving both cooling efficiency and power generation performance in Thermoelectric Modules for Electric Power Generation.
Superior Electrical Insulation
With dielectric strength exceeding 2.5 kV, the AlN layer provides reliable electrical isolation between circuit elements. This prevents current leakage and short circuits, ensuring safe operation in high-voltage thermoelectric applications and protecting sensitive Integrated Circuits.
Robust Mechanical Bonding
Our advanced DBC technology creates an exceptionally strong bond between copper and AlN ceramic, with peel strength ≥5.0 N/mm. This mechanical stability withstands thermal cycling stresses and mechanical vibration, preventing delamination and ensuring long-term reliability in demanding environments for Power Devices.
Excellent Chemical Stability
Both aluminum nitride and copper demonstrate outstanding resistance to chemical corrosion, maintaining performance in harsh operating conditions. The substrate remains stable when exposed to moisture, oxidation, and various chemical environments, extending service life in challenging Microelectronics Packaging applications.
Integration and Assembly Guidelines
- Design Preparation
Analyze thermal and electrical requirements. Ensure substrate dimensions match your thermoelectric element layout and heat sink configuration for optimal Electronic Packaging.
- Surface Preparation
Clean copper surfaces with isopropyl alcohol to remove contaminants. Apply flux if required for soldering operations to ensure proper bonding.
- Thermoelectric Element Attachment
Use solder paste or conductive epoxy to mount P-type and N-type thermoelectric elements onto the copper pads with precise alignment.
- Electrical Connection
Connect thermoelectric elements in series using wire bonding or soldering techniques appropriate for the specific application requirements.
- Heat Sink Integration
Attach appropriate heat sinks to both sides of the assembly, ensuring good thermal contact through thermal interface materials for maximum heat dissipation.
- Performance Testing
Verify thermoelectric performance under operating conditions, monitoring temperature differentials and electrical parameters to ensure specification compliance.
- System Integration
Install the completed thermoelectric module into the final application, ensuring proper mechanical support and environmental protection for long-term reliability.
Application Scenarios
Thermoelectric Refrigeration Systems
Ideal for precision cooling in medical equipment, laboratory instruments, and portable refrigerators. The substrates provide efficient heat pumping for temperature-sensitive applications where reliability and precise temperature control are critical in Sensor Packaging.
Thermoelectric Power Generation
Essential for waste heat recovery in automotive exhaust systems and industrial processes. The substrates efficiently convert thermal energy into electrical power through the Seebeck effect, improving overall energy utilization efficiency for sustainable power solutions.
Optoelectronic Device Thermal Management
Critical for temperature stabilization in laser diodes and high-power LEDs. The substrates maintain optimal operating temperatures, enhancing device performance and extending service life in demanding Optoelectronics Applications.
Automotive Climate Control
Used in advanced seat heating/cooling systems and battery thermal management for electric vehicles. The substrates provide reliable thermal control in automotive environments where vibration and temperature extremes are common.
Aerospace and Defense Systems
Applied in thermal management for avionics and satellite systems where weight savings, reliability, and performance under extreme conditions are paramount requirements for mission-critical operations.
Customer Benefits and Value Proposition
- Enhanced Efficiency: Superior thermal conductivity improves thermoelectric module performance and energy efficiency
- Increased Reliability: Robust construction withstands thermal cycling and mechanical stress, reducing failure rates
- Design Flexibility: Customizable dimensions and configurations support innovative thermoelectric designs
- Cost Reduction: Improved thermal management reduces cooling system requirements and operational costs
- Longer Service Life: Excellent chemical and thermal stability extends product lifespan in demanding applications
- Technical Support: Access to Puwei's expertise in Electronic Ceramic Products and thermoelectric applications
Production Process and Quality Assurance
- Material Selection
High-purity aluminum nitride powder and oxygen-free copper are selected and tested for quality compliance with international standards.
- Ceramic Formation
AlN ceramic is pressed and sintered under controlled conditions to achieve optimal density and thermal properties for consistent performance.
- Surface Preparation
Copper foil and ceramic surfaces are meticulously cleaned and prepared for bonding to ensure perfect interface quality.
- Direct Bonding
Copper and AlN ceramic are bonded using DBC technology under high temperature and controlled atmosphere for maximum bond strength.
- Precision Machining
Substrates are cut to exact specifications using laser or diamond saw cutting with micron-level accuracy.
- Quality Assurance
Each substrate undergoes comprehensive testing for thermal, electrical, and mechanical properties to guarantee performance.
- Packaging
Substrates are carefully packaged in anti-static materials with moisture protection for safe shipping and storage.
Quality Certifications and Compliance
Puwei Ceramic maintains the highest quality standards through comprehensive international certifications for global market acceptance:
- ISO 9001 Quality Management System certification
- Ceramic Heat Sink Surface Copyright Certificate
- Copyright Certificate for Ceramic Material Production System
- RoHS and REACH environmental compliance
- Industry-specific quality assurance for automotive, medical, and aerospace applications
Customization Options and OEM/ODM Services
We offer comprehensive customization services to meet your specific thermoelectric requirements with flexible manufacturing capabilities:
Large Format Expertise
Our specialization in large dimension ceramic substrates, including formats up to 240mm × 280mm × 1mm and 95mm × 400mm × 1mm, makes us preferred suppliers for applications requiring substantial substrate areas for complex thermoelectric systems and Hybrid Micro Circuits.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc ,
DPC Substrate,
DBC Ceramic Substrate