Aluminum Nitride Ceramic DBC Substrate

9 month ago

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Shaanxi Puwei Electronic Technology Co., Ltd

12 month

Product details

Electronic Metallized Ceramic Substrate

Puwei's Electronic Metallized Ceramic Substrates combine the exceptional insulating properties of advanced ceramics with the superior electrical and thermal conductivity of metals. Through specialized metallization processes, we create robust substrates that provide mechanical support, electrical connectivity, and efficient heat dissipation for demanding electronic packaging and microelectronics packaging applications.

Core Advantages

Dual Material Benefits: Ceramic insulation with metal conductivity
Superior Thermal Management: Efficient heat dissipation for high-power applications
Excellent Electrical Performance: Reliable electrical connections and insulation
Mechanical Stability: Robust support for electronic components
Process Versatility: Compatible with various metallization techniques

Metallized Ceramic Encapsulation Substrate

Technical Specifications

Available Ceramic Materials

Alumina Ceramic Components: 94%, 96%, 99%, 99.6% purity grades
Aluminum Nitride (AlN) Ceramic Substrate: High thermal conductivity
Beryllium Oxide (BeO) Ceramic Substrate: Exceptional thermal performance
Custom Material Formulations: Tailored to specific application requirements

Metallization Properties

Metallization Processes: Mo/Mn and W paste metallization
Brazing Compatibility: Excellent for joining with metal components
Adhesion Strength: High bond strength for reliable performance
Surface Quality: Optimized for various assembly processes

Performance Characteristics

Thermal Conductivity: Varies by material (AlN: 170-230 W/m·K)
Electrical Insulation: High dielectric strength and volume resistivity
Thermal Expansion: Matched to semiconductor materials
Mechanical Strength: High flexural and compressive strength

Product Features & Advantages

Performance Characteristics

Advanced Metallization Technology
Our specialized Mo/Mn and W paste metallization processes create strong, reliable bonds between ceramic and metal layers, ensuring optimal performance in demanding power devices and high-power microelectronic components.
Superior Thermal Management
Combining ceramic insulation with metal thermal pathways, our substrates efficiently dissipate heat from high-power components, making them ideal for thermoelectric cooling assemblies and power conversion systems.
Excellent Electrical Performance
The ceramic base provides outstanding electrical insulation while the metallized layers ensure reliable electrical connections, perfect for high-frequency modules and RF applications in microwave components.
Mechanical Reliability
Robust ceramic substrates with strong metallized layers provide durable mechanical support for electronic components, ensuring long-term reliability in vibration-prone applications and harsh environments.

Production Process

Manufacturing Workflow

Material Selection
Careful selection of ceramic materials including high-purity alumina (94%-99.6%), aluminum nitride, or beryllium oxide based on application requirements for electronic packaging and thermal management needs.
Substrate Formation
Precision shaping and sintering of ceramic substrates under controlled conditions to achieve optimal density, surface quality, and mechanical properties.
Surface Preparation
Advanced surface treatment and cleaning processes to ensure optimal adhesion and performance of metallization layers for reliable brazing and assembly.
Metallization Application
Specialized application of Mo/Mn and W paste metallization using controlled processes to create strong, reliable bonds between ceramic and metal layers.
Quality Verification
Comprehensive testing including adhesion strength measurement, electrical performance validation, thermal cycling tests, and dimensional accuracy verification.
Final Inspection
Rigorous final inspection to ensure all substrates meet specified quality standards and performance requirements for microelectronics applications.

Integration Guidelines

Design Evaluation
Assess thermal management requirements, electrical specifications, and mechanical constraints to select the appropriate ceramic material and metallization pattern for your integrated circuit or power electronics application.
Substrate Preparation
Ensure clean, contamination-free substrate surfaces before component assembly. Verify metallization quality and adhesion strength for reliable performance.
Component Assembly
Utilize appropriate brazing or soldering techniques compatible with the metallized surfaces. Follow recommended temperature profiles and assembly procedures.
Thermal Management Integration
Integrate with heat sinks or cooling systems as needed, leveraging the substrate's thermal management capabilities for optimal performance in high-power applications.
Performance Validation
Conduct electrical, thermal, and mechanical testing to verify system performance meets design specifications and reliability requirements.

Application Scenarios

Power Electronic Devices

Essential for IGBT modules, Power MOSFET modules, and power conversion systems. Our metallized ceramic substrates provide reliable electrical insulation and efficient heat dissipation for power devices in industrial drives, renewable energy systems, and electric vehicle power trains.

High-Frequency Circuits

Ideal for high-frequency modules, RF circuits, and microwave applications in telecommunications, radar systems, and satellite communication equipment. The low loss characteristics and high stability ensure efficient signal transmission and processing in demanding RF environments.

Optoelectronic Devices

Perfect for LED packaging, laser diodes, and optoelectronics applications where efficient heat dissipation is crucial for maintaining luminous efficiency and extending device lifespan in high-power lighting and optical communication systems.

Advanced Sensor Systems

Excellent for sensor packaging applications including temperature sensors, pressure sensors, and gas sensors. The stability of ceramic substrates combined with reliable metallization helps improve sensor accuracy and long-term reliability in industrial and automotive applications.

Hybrid Microelectronics

Superior platform for thick film hybrid microcircuits and advanced microelectronics packaging, providing the thermal management, electrical performance, and mechanical stability required for sophisticated electronic systems in aerospace, medical, and industrial applications.

Customer Benefits

Enhanced Thermal Performance: Efficient heat dissipation extends component lifespan and improves system reliability
Improved Electrical Reliability: Excellent insulation and conductivity ensure stable electrical performance
Design Flexibility: Multiple ceramic materials and metallization options support diverse application requirements
Cost Efficiency: Reduced cooling requirements and improved reliability lower total system costs
Manufacturing Consistency: Rigorous quality control ensures consistent performance across production batches

Certifications & Compliance

Puwei Ceramic maintains the highest quality standards with comprehensive certification and quality management systems ensuring consistent product quality and performance for global customers.

ISO 9001:2015 Quality Management System Certified
RoHS & REACH Compliance for environmental safety
Comprehensive material traceability and batch control
Industry-standard testing and performance validation protocols
Regular quality audits and continuous improvement processes

Customization Options

Puwei offers comprehensive customization services for Electronic Metallized Ceramic Substrates, providing tailored solutions for specific application requirements in advanced electronic systems.

Customization Features

Material Selection: Alumina (94%-99.6%), Aluminum Nitride, Beryllium Oxide, or custom formulations
Metallization Patterns: Custom circuit patterns, bonding pads, and connection layouts
Surface Finishes: Various surface treatments for specific assembly requirements
Dimensional Customization: Custom sizes, thicknesses, and geometric configurations
Special Features: Holes, cutouts, and specific mechanical features

Technical Expertise

Our specialized knowledge in Mo/Mn and W paste metallization, combined with expertise in various ceramic materials, enables us to develop optimal solutions for bare ceramic plates used in manufacturing assemblies of electronic integrated circuits and other advanced applications.