Silicon Nitride Double-Sided AMB Copper-Clad Substrate

9 month ago

37 0 

Shaanxi Puwei Electronic Technology Co., Ltd

12 month

Product details

AMB Ceramic Copper-clad Substrates for New Energy Applications

Puwei's AMB (Active Metal Brazing) ceramic copper-clad substrates represent a significant advancement in power electronics packaging technology. Specifically engineered for the demanding requirements of new energy applications, these substrates deliver superior thermal management, exceptional reliability, and enhanced power density for next-generation energy systems.

Core Technology Advantages

Superior Thermal Performance: Thermal conductivity up to 200 W/mK for efficient heat dissipation
Exceptional Bonding Strength: Peel strength exceeding 80 MPa prevents delamination
Optimized CTE Matching: Closely matches semiconductor materials to reduce thermal stress
High Current Capacity: Supports currents exceeding 500A for heavy-duty applications

Technical Specifications

Material Options

Ceramic Materials: Alumina (Al₂O₃), Aluminum Nitride (AlN), Silicon Nitride (Si₃N₄)
Copper Thickness: 0.3mm - 0.8mm (custom up to 2.00mm)
Ceramic Thickness: 0.25mm - 1.0mm
Standard Sizes: Up to 240mm × 280mm

Thermal Properties

Thermal Conductivity:
- Si₃N₄-AMB: >90 W/mK
- AlN-AMB: 180-200 W/mK
- Al₂O₃-AMB: 24-28 W/mK
Operating Temperature: -55°C to 400°C
CTE Matching: Silicon Nitride CTE ~3.2 ppm/K

Electrical & Mechanical Properties

Dielectric Strength: >20 kV/mm
Bonding Strength: >80 MPa
Thermal Cycling: >5,000 cycles (-55°C to 150°C)
Current Capacity: >500A continuous

AMB Substrate used in new energy power module

AMB Substrate in High-Power New Energy Module - Compact Design with Superior Thermal Performance

Precision AMB Substrate Surface - Uniform Copper Layer on Advanced Ceramic Base

Advanced Features & Technical Advantages

High Thermal Conductivity

With thermal conductivity exceeding 90 W/mK for Si₃N₄-AMB variants and up to 200 W/mK for AlN-AMB, these substrates efficiently dissipate heat from high-power devices. This critical feature prevents overheating in EV inverters and solar inverters, enhancing system longevity and reliability in power devices and high-power microelectronic components.

Exceptional Bonding Strength

The active metal brazing process creates a robust chemical bond at the ceramic-metal interface, achieving peel strengths over 80 MPa. This advanced bonding technology prevents copper delamination during thermal cycling, addressing a common failure mode in conventional substrates used in electronic packaging applications.

Optimized Thermal Expansion Matching

Silicon nitride's CTE (3.2 ppm/K) closely aligns with semiconductor materials like SiC (4.0 ppm/K), significantly reducing thermal stress and preventing cracking. This optimal CTE matching makes AMB substrates ideal for direct chip attachment in advanced microelectronics packaging without requiring intermediate layers.

High Current-Carrying Capacity

Supporting copper thicknesses up to 0.8 mm, these substrates can handle currents exceeding 500A, making them suitable for heavy-duty applications in wind turbines, rail systems, and industrial power converters where high reliability is essential for integrated circuit protection.

Superior Thermal Shock Resistance

Rigorous testing under -55°C to 150°C thermal cycles demonstrates a lifespan exceeding 5,000 cycles, significantly outperforming conventional substrates. This exceptional reliability is vital for automotive and outdoor energy storage systems exposed to extreme environmental conditions.

Advanced Technology Comparison

AMB technology offers distinct advantages over traditional approaches: higher bonding strength than DBC substrates, better high-power capability compared to DPC substrates, and enhanced reliability through active metal bonding versus standard metallized ceramics for sensor packaging and precision applications.

Implementation & Integration Process

Substrate Selection & Material Optimization
Choose the optimal material configuration (Si₃N₄ for high reliability, AlN for maximum thermal conductivity) based on your specific power density, thermal management requirements, and compatibility with microelectronics and high-frequency modules.
Circuit Pattern Design & Optimization
Collaborate with our engineering team to design and optimize circuit layouts. We provide comprehensive etching services to create precise traces on the copper layer, ensuring optimal current distribution and thermal performance.
Semiconductor Component Assembly
Mount semiconductor chips (SiC MOSFETs, IGBTs) directly onto the AMB substrate using standard die-attach processes. The substrate's excellent CTE matching minimizes mechanical stress and enhances long-term reliability.
Thermal Management Integration
Attach the substrate to heat sinks or cooling systems using advanced thermal interface materials. The high thermal conductivity ensures efficient heat transfer and maintains optimal operating temperatures.
Performance Validation & Reliability Testing
Conduct comprehensive electrical, thermal, and mechanical testing to verify performance under actual operating conditions. Our substrates are pre-validated for dielectric strength, thermal cycling, and long-term reliability.

Industry Applications & Use Cases

New Energy Vehicles

AMB substrates are critical components in traction inverters and onboard chargers for electric and hybrid vehicles. The "SiC + AMB" combination supports advanced 800V architectures, reducing charging times by 30-40% while improving overall system efficiency and reliability.

Renewable Energy Systems

In photovoltaic inverters and wind power converters, AMB substrates enhance power conversion efficiency and system reliability. Their exceptional thermal management capabilities ensure stable performance in large-scale solar farms and wind turbine applications, complementing our expertise in microwave applications and power electronics.

Energy Storage Solutions

For battery management systems and DC-AC converters in energy storage applications, AMB substrates provide the thermal stability and electrical isolation required for safe, efficient operation. Their robust construction withstands the demanding conditions of grid-scale energy storage installations.

Industrial Power Electronics

High-power motor drives, UPS systems, and industrial converters benefit from AMB's superior thermal performance and mechanical durability. The substrates' reliability reduces maintenance requirements and downtime in critical manufacturing and infrastructure applications.

Rail Transportation

In railway propulsion systems and power converters, AMB substrates deliver reliable performance under extreme environmental conditions. Their thermal shock resistance ensures consistent operation across varying climates, from desert heat to arctic cold.

Hydrogen Energy Systems

AMB substrates serve in fuel cell power controllers and electrolysis systems, where high temperature stability and humidity resistance are crucial. They ensure reliable performance in the demanding environments of hydrogen production and fuel cell applications.

Business Value & ROI

Performance & Reliability Benefits

Extended Product Lifespan: Reduced thermal stress lowers failure rates by 40-60%, significantly cutting maintenance costs and warranty claims
Higher System Efficiency: Improved heat dissipation enables 20-30% higher power density designs, allowing for more compact and efficient systems
Enhanced Reliability: Superior thermal cycling performance (>5,000 cycles) ensures long-term operational stability in demanding applications
Reduced Thermal Resistance: 30-50% lower thermal impedance compared to conventional substrates improves overall system efficiency

Economic Advantages

Lower Total Cost of Ownership: Extended operational lifespan and reduced failure rates decrease overall system costs by 25-35%
Reduced Cooling Requirements: Superior thermal performance minimizes or eliminates need for complex cooling systems, lowering BOM costs
Faster Time-to-Market: Comprehensive technical support and rapid prototyping capabilities accelerate development cycles
Design Flexibility: Customizable solutions enable optimized designs without expensive tooling changes or redesigns

Advanced Manufacturing Process

Material Preparation & Formulation
High-purity ceramic powders (Si₃N₄, AlN, Al₂O₃) are precisely formulated and pressed into substrates, then sintered at high temperatures to achieve optimal density and mechanical properties.
Active Metal Paste Application
Specialized solder paste containing active elements (Ti, Zr) is screen-printed onto the ceramic surface with precise control of thickness and distribution.
Copper Foil Integration
Oxygen-free copper foil is carefully aligned and placed over the active metal paste, ensuring uniform contact and optimal bonding conditions.
Vacuum Brazing Process
The assembly undergoes controlled heating to approximately 800°C in a vacuum furnace, where the active metal solder melts and forms a permanent chemical bond between ceramic and copper.
Precision Etching & Patterning
Advanced photolithography and chemical etching processes create precise circuit patterns on the copper layer, achieving micron-level accuracy for complex layouts.
Comprehensive Quality Assurance
Each substrate undergoes rigorous visual inspection, electrical testing, thermal performance validation, and mechanical strength verification to ensure compliance with specifications.