Large-sized Silicon Nitride AMB Substrate
9 month ago
Silicon Nitride Ceramic AMB Copper-clad Substrate
Product Overview
Puwei Ceramic's Silicon Nitride Ceramic AMB Copper-clad Substrate represents the pinnacle of advanced ceramic substrate technology for demanding power electronics applications. Utilizing Active Metal Brazing (AMB) technology, we bond high-conductivity copper to premium silicon nitride (Si3N4) ceramic, delivering exceptional performance in high-power, high-reliability applications.
Core Performance Advantages
- Exceptional Mechanical Strength: >800 MPa flexural strength, 3-5x stronger than alumina
- Superior Thermal Shock Resistance: Outperforms traditional ceramic substrates
- Optimal CTE Matching: 3.2 ppm/°C closely matches SiC semiconductors (3.7 ppm/°C)
- High Reliability Bonding: AMB creates stronger bonds than traditional DBC methods
- Robust Thermal Performance: 80-90 W/m·K thermal conductivity with excellent stability
As the ideal foundation for next-generation silicon carbide (SiC) power modules, our Si3N4 Ceramic AMB Substrate offers superior thermal management and mechanical robustness. While we offer comprehensive solutions including Alumina Ceramic Substrates and Aluminum Nitride Substrates, silicon nitride excels in fracture toughness and thermal shock resistance for the most demanding Electronic Packaging applications.
Product Visual Documentation
AMB Silicon Nitride Ceramic Substrate for advanced SiC power applications
Precision copper patterning on high-strength silicon nitride ceramic
Technical performance comparison showing silicon nitride advantages
Technical Specifications
Material Properties
- Base Material: High-purity Silicon Nitride (Si3N4)
- Cladding Material: Oxygen-free high conductivity copper
- Thermal Conductivity: 80-90 W/m·K
- Flexural Strength: >800 MPa
- Thermal Expansion: 3.2 ppm/°C (matches SiC chips)
- Dielectric Strength: >15 kV/mm
- Peel Strength: >80 N/cm
Dimensions & Tolerances
- Ceramic Thickness: 0.25mm-1.0mm standard (0.2mm-2.0mm custom)
- Copper Thickness: 0.1mm-0.8mm
- Maximum Size: 240mm × 280mm
- Surface Flatness: <10μm/cm
- Thick Copper Capability: Supports up to 0.8mm copper for higher current
Product Features & Advantages
Superior Thermal Shock Resistance
Outperforms Alumina Ceramic Substrates and Aluminum Nitride Ceramics in applications with rapid temperature cycling. Silicon nitride's unique microstructure prevents crack propagation, making it ideal for harsh thermal environments in Power Devices and automotive applications.
Optimal CTE Matching with SiC
With thermal expansion coefficient of 3.2 ppm/°C closely matching SiC semiconductors (3.7 ppm/°C), our substrates minimize thermal stress at interfaces. This compatibility extends product lifetime and enhances reliability in high-power Integrated Circuits and Microelectronics Packaging.
Exceptional Mechanical Strength
Flexural strength exceeding 800 MPa provides 3-5x greater mechanical robustness compared to alumina substrates. This superior strength withstands mechanical stress, vibration, and thermal cycling in demanding applications such as electric vehicle power trains and industrial motor drives.
High Reliability AMB Bonding
Active Metal Brazing creates chemical bonds rather than mechanical ones, resulting in superior thermal cycling performance and long-term reliability. This advanced bonding technology outperforms traditional DBC Ceramic Substrate methods for Metallized Ceramics applications.
AMB Technology Excellence
The Active Metal Brazing process utilizes reactive braze alloys containing active elements to create strong chemical bonds between silicon nitride ceramic and copper layers. This advanced manufacturing technology ensures superior thermal cycling performance, mechanical reliability, and long-term stability compared to conventional bonding methods, making it ideal for demanding High-Power Microelectronic Components.
Implementation and Integration Guide
- Application Analysis
Assess if silicon nitride is needed versus alternatives based on thermal, mechanical, and reliability requirements for your specific Electronic Packaging application.
- Thermal Simulation
Utilize material property data for performance modeling and thermal management optimization in your power electronics design.
- Substrate Design
Provide circuit layout and specifications, leveraging our expertise in Metallized Ceramics for optimal performance.
- Prototype Fabrication
Test samples for validation under actual operating conditions to verify performance and reliability.
- Assembly Optimization
Adapt assembly processes for silicon nitride characteristics, ensuring proper thermal management and mechanical integrity.
- Quality Validation
Perform comprehensive testing and qualification to meet industry standards and application requirements.
- Volume Production
Scale to mass production with our rigorous quality assurance systems and manufacturing expertise.
Application Scenarios
Electric Vehicle Power Trains
Inverters, DC-DC converters, and onboard chargers requiring robust thermal management and mechanical reliability under vibration and thermal cycling conditions. Ideal for next-generation Power Devices in automotive applications.
Renewable Energy Systems
Solar and wind power converters demanding long-term reliability and excellent thermal shock resistance in outdoor environments with wide temperature variations.
Industrial Motor Drives
High-power drives for manufacturing equipment requiring exceptional mechanical strength and thermal cycling performance in harsh industrial environments.
Rail Transportation
Power systems for trains and infrastructure where reliability under vibration, mechanical stress, and temperature extremes is paramount for safety and performance.
Aerospace & Defense Systems
Critical power electronics systems requiring the highest levels of reliability, mechanical robustness, and performance under extreme conditions for mission-critical operations.
Customer Benefits and Value Proposition
- Enhanced Reliability: Reduced field failures in demanding conditions through superior mechanical and thermal performance
- Extended Product Life: Longer operational lifetime with excellent thermal cycling capability and mechanical durability
- Compact Designs: Thinner substrates with higher strength enable smaller, more power-dense modules
- Lower Total Cost: Reduced failures and extended service life offset initial investment for better total cost of ownership
- Competitive Advantage: Superior performance versus conventional substrates enables next-generation power electronics
- Technical Partnership: Access to Puwei's expertise in advanced Electronic Ceramic Products and application engineering
Production Process and Quality Assurance
- Raw Material Preparation
Selection of high-purity silicon nitride powder with verified thermal and mechanical properties for consistent performance.
- Forming Process
Precise shaping of ceramic green bodies using advanced forming techniques to achieve required dimensions and density.
- Sintering
High-temperature sintering under controlled atmosphere to develop the optimal microstructure for strength and thermal properties.
- Precision Machining
Grinding and polishing to achieve exact thickness, flatness, and surface quality specifications.
- Surface Preparation
Meticulous cleaning and surface activation to ensure perfect bonding interface for AMB process.
- Active Metal Brazing
High-temperature vacuum brazing with active metal alloys to create strong metallurgical bonds between ceramic and copper.
- Pattern Definition
Photolithography and etching for precise copper circuit patterns with fine feature resolution.
- Surface Finishing
Application of protective and solderable finishes to ensure reliable assembly and long-term performance.
- Quality Assurance
100% inspection and performance testing to verify thermal, electrical, and mechanical properties.
- Secure Packaging
Careful packaging to prevent damage during shipping and ensure product integrity upon arrival.
Quality Certifications and Compliance
Puwei Ceramic maintains the highest quality standards through comprehensive international certifications ensuring reliable, professional-grade components for global markets:
- ISO 9001:2015 Quality Management System
- IATF 16949:2016 Automotive Standard
- Ceramic Heat Sink Surface Copyright
- Material Production System Copyright
- UL 94 V-0 Flammability Rating
- RoHS and REACH Environmental Compliance
Customization Options and OEM/ODM Services
We offer comprehensive customization services to meet your specific technical requirements and application challenges in advanced Microelectronics Packaging and power electronics.
Technical Expertise
Our expertise in Metallized Ceramics enables us to provide innovative solutions that perfectly match your technical requirements and cost targets for advanced Electronic Packaging applications. We specialize in creating optimized silicon nitride substrates for the most demanding environments where thermal management, mechanical reliability, and long-term performance are critical.
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