Shielding case HS-758222-04W
12 month agoSpacious EMI Protection for Complex Circuit Zones
The “Shielding case H5-758222-04w” is a wide-format Other Shielding solution engineered to cover expansive or multi-component areas on modern PCBs. With generous external dimensions of 35 mm (width) × 45 mm (length) and a height of 9 mm, it offers an internal clearance of approximately 8.2 mm—making it ideal for shielding clusters of ICs, RF modules, power regulators, and mixed-signal circuits. This design positions it as a strategic component within high-performance EMI Shielding Solutions, delivering comprehensive Protective Shielding for telecom infrastructure, automotive radar systems, industrial controllers, and advanced consumer electronics.
Core Specifications
- Material: 0.35 mm tin-nickel alloy with low contact resistance
- External Dimensions: 35 mm × 45 mm × 9 mm
- Internal Clearance: ~8.2 mm—supports multi-device coverage in a single shield
- Shielding Effectiveness: ≥75 dB from 100 MHz to 8 GHz
- Flange Width: 1.8 mm with laser-trimmed edges for uniform grounding
- Lid Type: Secure press-fit lid with perimeter grounding fingers
- Compliance: RoHS 3, REACH, FCC Part 15 Class A/B, IEC 61000-4-3/6/8
Application Flexibility
Unlike narrow-profile shields, the H5-758222-04w addresses the growing need for area-efficient EMI containment over large functional blocks. Its wide footprint reduces the need for multiple smaller shields, simplifying layout, lowering assembly costs, and improving overall shielding continuity.
Ideal Use Cases
- 5G mmWave front-end modules requiring unified Protective Shielding
- Automotive ADAS control units integrated into robust EMI Shielding Solutions
- Industrial PLCs with dense analog-digital circuitry
- High-end audio interfaces sensitive to RF noise
- Smart gateway devices combining Wi-Fi 6E, Bluetooth, and Zigbee radios
Frequently Asked Questions
Q: Can this shield be used in reflow soldering?
A: Yes—it’s designed for standard lead-free reflow profiles up to 260°C.
Q: Is the lid reusable after removal?
A: Yes—the press-fit mechanism allows for multiple removals without compromising RF integrity.
Q: Does it support thermal management?
A: While primarily for EMI control, optional vented lid versions are available for thermal-sensitive designs.
A Strategic Choice for Large-Scale EMI Control
As a premium Other Shielding option, the H5-758222-04w enables engineers to implement efficient, large-area Protective Shielding without sacrificing board real estate or performance. When deployed as part of holistic EMI Shielding Solutions, it ensures signal integrity across complex, multi-radio platforms—making it indispensable in next-generation electronic systems where interference mitigation is critical.
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