Shielding case SC8400216

EMI Containment for High-Speed Data Switching Cores

Modern network switches—handling everything from enterprise LAN traffic to cloud-scale data center fabric—rely on multi-gigabit switching ICs that integrate dozens of SerDes lanes, memory controllers, and packet processors on a single die. These complex chips generate significant internal RF noise while remaining highly susceptible to external interference from nearby power converters, Wi-Fi radios, or adjacent PCB layers. Uncontrolled EMI can manifest as link training failures, latency spikes, or CRC errors, undermining the reliability of entire Communication Systems. The Shielding Can for Network Switch ICs provides a precision-engineered enclosure that isolates the switch ASIC from both radiated and conducted noise. Made from stamped copper alloy with electroless nickel immersion gold (ENIG) finish, it delivers consistent shielding effectiveness above 70 dB from 500 MHz to 12 GHz—covering PCIe, Ethernet, and DDR signaling bands. This localized EMI Protection ensures deterministic performance in high-density networking hardware.

Design Optimized for Signal and Thermal Integrity

• Low-Profile, High-Clearance Cavity: Maintains >0.8 mm clearance over tallest components to avoid capacitive loading on high-speed traces.
• Thermal-Via Integration: Base includes plated through-holes aligned with switch IC hotspots, enabling direct heat transfer to inner-layer ground planes or external Die Casting Heat Sinks.
• EMI-Gasket Compatible Frame: Perimeter designed for conductive elastomer or metal mesh gaskets in sealed chassis applications.
• Automated Assembly Ready: Supports SMT placement and reflow without warping or flux trapping.

Deployment Environments

This shielding can is engineered for use in top-of-rack (ToR) switches, spine-leaf data center interconnects, industrial Ethernet gateways, and 5G user-plane function (UPF) appliances. As network speeds advance toward 800GbE and beyond, signal margins shrink, making electromagnetic discipline non-negotiable. By embedding a high-performance Shielding Can directly over the switching core, designers prevent intra-board crosstalk and ensure compliance with FCC Part 15 and CISPR 32 emissions limits. This approach transforms raw silicon into resilient, field-proven Communication Systems capable of sustaining throughput under real-world EMI stress.

Frequently Asked Questions

Q: Will this shield affect airflow in fan-cooled systems?
A: Its open-base design allows unrestricted vertical airflow; only the top and sides are enclosed.

Q: Can it be used with BGA-packaged switch ICs?
A: Yes—it’s specifically dimensioned for common BGA footprints (e.g., 45mm × 45mm) with underfill clearance.

Q: Does it require additional grounding vias?
A: Recommended—but the frame’s wide grounding tabs minimize inductance even with standard PCB layout practices.

The Shielding Can for Network Switch ICs acts as an invisible firewall—keeping noise out and data flowing, at wire speed, all the time.