Shielding case SL82004l0

Low-Profile EMI Shielding Case for Space-Constrained Electronics

Engineered from the precision “Shielding case SL82004l0” platform, this compact Other Shielding solution delivers high-performance electromagnetic interference (EMI) suppression in ultra-thin form factors. Ideal for modern miniaturized electronics, it combines a sleek profile with robust shielding integrity—making it a cornerstone of advanced EMI Shielding Solutions. Designed to act as discreet yet effective Protective Shielding, it ensures signal purity and component reliability without adding bulk to densely packed PCBs.

Key Features

• Ultra-Low Profile: Height under 5 mm enables integration into slim devices like wearables and mobile modules.
• High-Attenuation Alloy: Nickel-copper composite provides >70 dB shielding effectiveness up to 6 GHz.
• Integrated Conductive Gasket: Ensures seamless electrical continuity at seams and joints without extra components.
• RoHS & REACH Compliant: Environmentally safe materials suitable for global consumer and industrial markets.

Technical Specifications

• Material: Nickel-copper alloy with conductive elastomer edge seal
• Standard Dimensions: 35 mm × 25 mm × 4.8 mm (custom sizes available)
• Shielding Effectiveness: ≥70 dB from 300 MHz to 6 GHz
• Operating Temperature: -40°C to +105°C
• Surface Finish: Matte tin over nickel for solderability and corrosion resistance
• Mounting Method: SMT-compatible perimeter pads or adhesive-backed option
• Compliance: RoHS 3, REACH, IEC 61000-4-3/4-6

Applications

This Other Shielding case is ideal for:

• Smartphones, tablets, and ultra-thin laptops requiring minimal-footprint EMI Shielding Solutions
• Bluetooth/Wi-Fi/5G RF modules where localized Protective Shielding prevents crosstalk
• Wearable health monitors and AR/VR headsets with tight spatial constraints
• IoT edge sensors operating in electromagnetically noisy industrial environments
• Automotive infotainment and telematics units needing compact EMI containment

Frequently Asked Questions

Q: Can this shielding case be reworked after soldering?
A: Yes—it’s designed for reflow compatibility and can be removed and replaced using standard SMT rework tools without damaging the PCB.

Q: Does the low height compromise shielding performance?
A: Not at all. The optimized material composition and seamless gasket design maintain high attenuation even in ultra-slim profiles.

Q: Is adhesive mounting reliable for long-term use?
A: The high-temperature conductive adhesive option is rated for 10+ years in typical operating conditions and maintains EMI continuity.

As electronic devices continue to shrink, this Other Shielding innovation proves that size doesn’t limit protection. It’s a vital element in next-gen EMI Shielding Solutions and delivers dependable Protective Shielding where every millimeter counts.