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Shielding case HS3301207

12 month ago
33 0
Product details

Maximized Coverage with Minimal Vertical Footprint

The “Shielding case H53301207” is a low-profile, wide-area Other Shielding enclosure engineered to protect expansive circuit regions—such as multi-rail power delivery networks or distributed sensor arrays—without increasing device thickness. At just 4.8 mm in height but spanning 50 mm × 32 mm, it delivers uniform Protective Shielding across large PCB zones while maintaining compatibility with ultra-slim form factors. This balance makes it a strategic component in space-conscious EMI Shielding Solutions for consumer, medical, and IoT electronics.

Target Applications

This Other Shielding solution is widely used in:

  • Ultra-thin tablets and e-readers shielding entire PMIC clusters via seamless EMI Shielding Solutions
  • Wearable health monitors requiring broad analog front-end coverage with discreet Protective Shielding
  • Smart home hubs integrating Wi-Fi 6, Bluetooth LE, and Zigbee radios in tight layouts
  • Portable diagnostic devices where internal height is limited by ergonomic design
  • Foldable displays managing EMI across hinge-adjacent flex zones

Technical Specifications

  • Material: Thin-gauge (0.25 mm) tin-copper alloy steel with high conductivity and flatness control
  • Dimensions: 50 mm × 32 mm × 4.8 mm — one of the widest low-height standard shields
  • Shielding Effectiveness: ≥76 dB from 100 MHz to 6 GHz
  • Operating Temperature: -40°C to +90°C
  • Flange Width: 1.5 mm with micro-dimpled surface for enhanced solder adhesion
  • Lid Design: Single-piece snap-on lid with perimeter embossments to reduce RF leakage
  • Compliance: RoHS 3, REACH, FCC Part 15 Class B, IEC 61000-4-3

Frequently Asked Questions

Q: Can such a wide shield warp during reflow?
A: No—precision stress-relief annealing and internal stiffening ribs maintain planarity even at peak reflow temperatures.

Q: Does the low height limit internal component clearance?
A: It’s designed for circuits with components ≤4.0 mm tall—ideal for passives, QFNs, and small ICs.

Q: How does it compare to using multiple small shields?
A: A single wide shield eliminates inter-shield gaps that act as slot antennas, offering more consistent EMI suppression.

Coverage That Fits Flat Designs

In modern slim devices, stacking multiple small shields creates uneven topography and potential EMI leakage paths. The H53301207 solves this by providing monolithic coverage over large functional blocks—reducing part count, simplifying layout, and improving electromagnetic integrity.

As part of holistic EMI Shielding Solutions, this low-profile Other Shielding can ensures that even the flattest devices don’t sacrifice signal purity for thinness.

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Wenzhou Hesheng Electronic Co., Ltd.
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2 year


Main Product: Heatspreader, Shielding Cover, Die Casting Heat Sink, Extrusion Heatsink , Shielding Frame, Mini USB Connectors