Shielding case HSDC38008

Engineered for Complex, Multi-Height PCB Assemblies

The “Shielding case H5DC38008” is a high-reliability deep-cavity Other Shielding enclosure designed to accommodate densely populated circuit zones with components of varying heights—such as stacked memory modules, tall inductors, or multi-layer RF filters. With an internal depth of 12.0 mm and reinforced structural integrity, it provides comprehensive Protective Shielding without requiring custom enclosures. This makes it a cornerstone of robust EMI Shielding Solutions in telecom infrastructure, edge computing, and industrial control systems.

Technical Specifications

• Material: Cold-rolled steel with dual-layer nickel-tin plating for corrosion resistance and low contact impedance
• Dimensions: 42 mm × 36 mm × 12.0 mm — one of the deepest standard off-the-shelf shields
• Shielding Effectiveness: ≥83 dB from 100 MHz to 7 GHz
• Operating Temperature: -40°C to +115°C
• Flange Width: 1.7 mm with laser-trimmed edges for precise solder alignment
• Lid Design: Two-piece removable lid system for selective access during rework
• Compliance: RoHS 3, REACH, FCC Part 15 Class A, IEC 61000-6-2/4

Frequently Asked Questions

Q: How does the two-piece lid improve serviceability?
A: It allows technicians to open only the section needing repair—minimizing thermal stress on adjacent shielded areas.

Q: Will the deep cavity trap heat?
A: Thermal management can be enhanced via optional vented lid inserts (non-conductive EMI mesh available upon request).

Q: Is this suitable for outdoor or high-humidity environments?
A: Yes—the dual-layer plating resists oxidation, and the tight lid seal reduces moisture ingress.

Target Applications

This Other Shielding solution is ideal for:

• 5G small cells shielding multi-band RF front-ends using integrated EMI Shielding Solutions
• Industrial PLCs protecting mixed-signal I/O banks with layered Protective Shielding
• Edge AI accelerators with stacked DRAM and high-power SoCs
• Railway communication modules exposed to wide thermal and EMI swings
• Smart grid gateways managing secure cellular and power-line communication in one zone

Depth Without Compromise

While many deep shields sacrifice rigidity or EMI performance due to lid flex or poor grounding, the H5DC38008 features a stiffened base frame and perimeter grounding tabs that maintain consistent contact—even after repeated thermal cycles. Its depth isn’t just empty space; it’s engineered volume for real-world component diversity.

Within scalable EMI Shielding Solutions, this high-reliability Other Shielding can bridges the gap between standard cans and costly custom enclosures—delivering professional-grade protection where complexity demands it.