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99.6% Alumina Ceramic Substrate For High-power Laser Diodes

11 month ago
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Product details

99.6% High-purity Polished Grade Alumina Ceramic Substrate

Product Overview

Puwei's 99.6% High-purity Polished Grade Alumina Ceramic Substrate represents the pinnacle of advanced material engineering for high-performance electronic applications. This premium substrate delivers exceptional electrical insulation, thermal management, and mechanical stability, making it ideal for demanding Electronic Packaging and Microelectronics applications.

With its ultra-smooth surface finish and superior material properties, this substrate enables precise circuit patterning and reliable performance in advanced High-Frequency Modules and Power Devices.

Polished Grade Alumina Ceramic Substrate with mirror-like finish

Technical Specifications

Engineered for precision and reliability, our alumina substrate meets the most stringent requirements for advanced electronic applications:

  • Alumina Content (Al₂O₃): 99.6%
  • Volume Resistivity: >10¹⁴ Ω·cm
  • Flexural Strength: 300-400 MPa
  • Mohs Hardness: ~9
  • Thermal Conductivity: 20-30 W/(m·K)
  • Thermal Expansion Coefficient: 6-8 × 10⁻⁶ /°C
  • Surface Roughness (Polished): < 0.5 μm
  • Dielectric Strength: Excellent performance
Close-up view of precision polished alumina substrate

Complete technical datasheets with detailed performance metrics available upon request.

Product Features & Advantages

Material Performance Benefits:

  • Ultra-Smooth Surface Finish: Polished to <0.5 μm roughness for superior Thick Film Printed Circuit applications and precise metallization
  • Exceptional Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm ensures reliable performance as Insulation Elements in high-voltage applications
  • Optimized Thermal Management: Balanced thermal conductivity (20-30 W/(m·K)) with low CTE provides stable performance in Thermoelectric Semiconductor Module applications
  • Mechanical Durability: High flexural strength (300-400 MPa) and Mohs hardness ~9 withstand rigorous assembly processes

Manufacturing Advantages:

  • Precision Polishing Technology: Advanced mechanical-chemical polishing ensures surface quality critical for Hybrid Microcircuits
  • Consistent Quality: Rigorous process controls guarantee batch-to-batch consistency for volume production
  • Cost-Effective Performance: Superior alternative to premium materials for applications where extreme thermal conductivity isn't required

Integration and Processing Guide

Follow these steps for optimal performance in your manufacturing process:

  1. Design Finalization: Complete circuit design and substrate specifications with our engineering support
  2. Surface Preparation: Clean substrate using standard industry practices (ultrasonic cleaning with IPA)
  3. Circuit Deposition: Apply conductive layers via sputtering, evaporation, or screen printing techniques
  4. Pattern Definition: Utilize photolithography and etching for precise circuit patterns
  5. Component Assembly: Mount semiconductor dies and components using epoxy or solder processes
  6. Interconnection: Establish electrical connections with wire bonding
  7. Final Encapsulation: Apply protective coatings and conduct comprehensive testing

Application Scenarios

RF and Microwave Systems:

Essential for manufacturing precision transmission lines and filters in 5G infrastructure and satellite communication systems, particularly for Microwave Components and High-Frequency Modules.

Advanced Semiconductor Packaging:

Used as interposers and package substrates for high-performance Integrated Circuits, CPUs, and GPUs where thermal stability and electrical insulation are critical.

Power Electronics:

Ideal substrate for High Power Microelectronic Components and power devices requiring reliable insulation and thermal management.

Sensor and MEMS Applications:

Perfect platform for Sensor Packaging and micro-electromechanical systems (MEMS) fabrication, leveraging the flawless surface quality.

Hybrid Microelectronics:

Foundation for custom Hybrid Microcircuits in aerospace, medical, and military applications demanding extreme reliability.

Customer Benefits

  • Improved Manufacturing Yield: Superior surface quality reduces defects in lithography and metallization processes
  • Enhanced Product Performance: Enable higher frequency operation and better signal integrity in electronic assemblies
  • Design Flexibility: Support for finer features and complex circuits enables greater miniaturization
  • Extended Product Lifespan: Robust construction resists thermal cycling and mechanical stress for longer service life
  • Technical Partnership: Access Puwei's expertise in advanced ceramic solutions including Alumina Ceramic Substrate technologies

Certifications & Compliance

Puwei Ceramics maintains the highest quality standards with comprehensive certifications:

  • ISO 9001 Certified manufacturing facilities ensuring consistent quality management
  • Full compliance with international RoHS and REACH environmental regulations
  • Certificate Number: GXLH41023Q10642R0S
  • Proprietary technologies for advanced ceramic material production systems

Customization Options

Puwei offers comprehensive OEM and ODM services to meet specific application requirements:

  • Precision Dimensions: Thickness from 0.2mm to 2.00mm with custom planar sizes
  • Large-Format Expertise: Specialization in large-size substrates including 240×280×1mm and 95×400×1mm configurations
  • Complex Features: Custom holes, cutouts, and edge profiles based on customer drawings
  • Surface Finish Options: Polished, as-fired, or ground finishes to match application needs and cost requirements

Production Process & Quality Control

Our manufacturing process ensures consistent high quality through rigorous controls:

  1. Material Preparation: Selection of high-purity (>99.6%) alumina powder with precise binder formulation
  2. Forming Process: Advanced tape casting or dry pressing for uniform density green sheets
  3. High-Temperature Sintering: Controlled firing profiles achieve near-theoretical density
  4. Precision Finishing: Multi-stage lapping and mechanical-chemical polishing for ultra-smooth surfaces
  5. Comprehensive Inspection: 100% quality control for dimensions, surface quality, and performance properties
  6. Certified Packaging: Cleanroom packaging with damage-protection protocols

Customer Testimonials

"The surface quality and dimensional consistency of Puwei's polished alumina substrates have been instrumental in improving our yield for high-frequency antenna modules. Their technical support was invaluable."

- Procurement Director, German Telecommunications Equipment Manufacturer

"We needed custom large-format substrates for laser products. Puwei delivered challenging specifications with excellent documentation and on-time delivery. A true strategic supplier."

- R&D Manager, US Optoelectronics Company
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Main Product: Alumina Ceramic Substrates , Aluminum Nitride Substrates, Metallized Ceramics, AlN Ceramics Disc, DPC Substrate, DBC Ceramic Substrate