Shielding case H33301116

Optimized for Dense Layouts Without Sacrificing Shielding Integrity

The “Shielding case H33301116” is a compact yet high-performance Other Shielding enclosure engineered for modern PCBs where space is at a premium but EMI control cannot be compromised. With dimensions of 33 mm × 30 mm × 5.8 mm, it offers generous internal volume while maintaining a low profile—ideal for shielding complex ICs such as multi-band RF transceivers, PMICs, or AI co-processors. Its precision-formed walls and uniform plating ensure consistent Protective Shielding, making it a reliable element in advanced EMI Shielding Solutions for mobile, automotive, and edge computing applications.

Ideal Application Scenarios

This Other Shielding solution excels in:

• Smartphones and tablets shielding 5G/Wi-Fi 6E combo modules using integrated EMI Shielding Solutions
• Automotive telematics units requiring robust Protective Shielding near GNSS and V2X radios
• Miniature industrial sensors operating in electrically noisy factory environments
• Drone flight controllers managing IMU, GPS, and telemetry in tight spaces
• Wearable AR glasses with stacked optical and wireless subsystems

Technical Specifications

• Material: 0.28 mm tin-copper alloy steel with low insertion loss and high surface conductivity
• Dimensions: 33 mm × 30 mm × 5.8 mm — optimized aspect ratio for mixed-height components
• Shielding Effectiveness: ≥79 dB from 100 MHz to 8 GHz
• Operating Temperature: -40°C to +95°C
• Flange Width: 1.3 mm with micro-chamfered edges to prevent solder wicking
• Lid Design: Snap-fit lid with perimeter embossments for enhanced RF continuity
• Compliance: RoHS 3, REACH, FCC Part 15 Class B, IEC 61000-4-3

Frequently Asked Questions

Q: How does it handle nearby high-speed traces?
A: The smooth interior surface minimizes parasitic coupling, and the flange design avoids encroaching on adjacent routing layers.

Q: Is the lid easy to remove for debugging?
A: Yes—it features a slight overhang for tool access while maintaining secure retention during operation.

Q: Can it be used in lead-free reflow processes?
A: Fully compatible—material and plating are rated for peak temperatures up to 260°C.

Small Footprint, Big Impact

In today’s electronics, EMI hotspots are often clustered in zones too small for traditional shields but too critical to leave unprotected. The H33301116 fills this gap by delivering enterprise-grade shielding performance in a footprint that fits seamlessly into high-density layouts—without requiring layout redesigns or custom tooling.

As part of intelligent EMI Shielding Solutions, this compact Other Shielding can proves that effective electromagnetic containment doesn’t require extra space—just smarter engineering.