FR4 CCL Sheet

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Product details

FR4 copper clad laminate is one of the most commonly used basic materials in the electronics industry. As the core substrate of printed circuit boards (PCBs), it directly affects the reliability and functionality of electronic devices. This analysis systematically examines the core value of FR4 copper-clad laminate from three perspectives: characteristics, advantages, and application scope.

Core Characteristics of FR4 Copper Clad Laminates

1. Physical Properties

Substrate Structural Stability:

Fiberglass cloth provides high mechanical strength and temperature resistance, while epoxy resin (containing flame retardants, curing agents, etc.) fills the interstices between the fibers, forming a dense three-dimensional network structure. This ensures that the laminate resists deformation during processing (such as drilling and lamination) and use.

Excellent Thermal Performance:

Glass Transition Temperature (Tg): Conventional FR4 has a Tg of 130°C-150°C, while medium- and high-Tg models can reach 160°C-180°C. Short-term temperature resistance reaches 260°C.

Coefficient of Thermal Expansion (CTE):

Axial (x-y) CTE is approximately 12-14 × 10⁻⁶/°C (similar to copper's CTE of approximately 17 × 10⁻⁶/°C), and vertical (z-axis) CTE is approximately 50-70 × 10⁻⁶/°C, reducing the risk of delamination at high temperatures. Stable electrical performance: Volume resistivity ≥ 10¹⁴Ω·cm, surface resistivity ≥ 10¹²Ω, dielectric constant (Dk) approximately 4.2-4.8 (1GHz), dielectric dissipation factor (Df) approximately 0.009-0.012 (1GHz), suitable for most low-frequency to high-frequency (≤5GHz) circuit applications.

High mechanical strength:

Tensile strength ≥ 300MPa (perpendicular to the fiber direction), flexural strength ≥ 500MPa, impact resistance (notched impact strength) ≥ 30kJ/m², capable of withstanding mechanical stresses such as soldering and plugging during PCB assembly.

Strong environmental resistance:

Water absorption ≤ 0.3% (23°C/50%RH), electrical performance degradation ≤ 10% after wet-heat aging (85°C/85%RH, 1000 hours), adaptable to complex environments such as humid and salt spray.

2. Chemical Properties

Excellent Flame Retardancy:

Bromine- or phosphorus-based flame retardants are added to the epoxy resin, resulting in a self-extinguishing time of ≤10 seconds at a thickness of 0.8mm, meeting safety standards for electronic equipment.

Chemical Corrosion Resistance:

Resistant to common chemicals such as weak acids and bases, mineral oils, and alcohol, with no noticeable performance degradation after long-term exposure (special models are resistant to strong acids and bases).

Core Advantages of FR4 Copper Clad Laminates Sheets

Compared to other PCB substrates, FR4 has become the "standard material" for general electronic devices thanks to its balanced advantages of "high performance, low cost, and easy processing." These advantages are reflected in the following:

1. Outstanding Cost-Effectiveness

FR4's low raw material costs and mature production process result in a low unit cost, making it suitable for cost-sensitive applications such as large-scale consumer electronics and industrial control.

2. Wide Range of Performance Compatibility

FR4's parameters, such as Tg, CTE, and electrical properties, can be customized by adjusting the glass fiber ratio and resin formulation, meeting the needs of various applications, from general consumer electronics to mid-to-high-end industrial equipment.

3. Mature Processing Technology

FR4 Glassfiber Sheet has a strong bond with copper foil and supports the entire PCB manufacturing process, including drilling, plating, etching, and surface treatment, with high yield, making it suitable for rapid prototyping and mass production.

4. Thoroughly Verified Reliability

FR4 has been proven in the electronics industry for decades, and its long-term reliability has been confirmed in numerous cases.

Applications of FR4 Copper Clad Laminates

Due to its unique properties, FR4 is widely used in consumer electronics, industrial control, automotive electronics, communications equipment, and other fields. Specific applications include:

1. Consumer Electronics

Smart Terminals: Mainboards for mobile phones, tablets, and laptops;

Home Appliances: Control panels for air conditioners, refrigerators, and washing machines;

Audio-visual Equipment: Audio amplifier boards and TV T-CON boards (timing control boards).

2. Industrial Control

Industrial PLCs (Programmable Logic Controllers): PCBs for CPU modules and input/output (I/O) modules;

Instruments: Measurement control panels for multimeters and oscilloscopes;

Servos/Inverters: Driver boards and power supply boards.

3. Automotive Electronics

Body Control: PCBs for ECUs (Engine Control Units) and BCMs (Body Control Modules);

In-Vehicle Sensors: Signal conditioning boards for temperature and pressure sensors;

Entertainment Systems: Main control boards for in-car navigation and audio systems.

4. Communications Equipment

Network switches: Ethernet interface boards, power distribution boards;

Base station equipment: Radio frequency (RF) front-end small signal processing boards (low-frequency band ≤ 5 GHz);

Fiber optic communications: Optical module driver boards.

FR4 copper-clad laminate, with its stable performance, affordable cost, and mature manufacturing process, has become a cornerstone material in the electronics manufacturing industry. Although it is being replaced by materials like PTFE and ceramics in extreme scenarios such as high frequencies (>5 GHz) and ultra-high temperatures (>200°C), FR4 remains the most cost-effective choice for over 90% of general-purpose electronic devices. As electronic devices evolve towards miniaturization and increased integration, FR4 continues to expand its application through technological upgrades (such as high Tg and low CTE modifications), and will continue to play a core role in the electronics industry.

In addition, G10 FR4 Glassfiber Sheet is also a commonly used material for PCB. Contact us for more details or click below.

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