electronic packages

Product Overview

Our metal-wall, ceramic-insulator housings are the gold standard for high-performance Optoelectronic Packaging. This construction methodology provides the ultimate combination of rugged mechanical protection and high-fidelity electrical performance. The metal body acts as a durable, hermetic shield and an excellent heat sink, while the integrated alumina ceramic feedthroughs provide superior electrical isolation for high-speed signal and DC bias pins. Engineered to solve the complex interconnection challenges between the semiconductor chip and external circuitry, these packages support data rates from 2.5Gbps up to 400Gbps, making them the ideal choice for the entire spectrum of optical communication applications.

Technical Specifications

Product Images

Features & Advantages

• Unmatched Signal Integrity: Precision-engineered feedthroughs maintain a 50Ω impedance match, minimizing signal reflections and ensuring clean data transmission at very high frequencies.
• Robust Hermetic Protection: The brazed metal-ceramic construction provides a permanent, gas-tight seal, safeguarding sensitive components from environmental degradation.
• Effective Thermal Dissipation: The metal package body provides an efficient pathway for heat to be conducted away from the laser chip to an external heat sink.
• Mechanical Stability: Offers rigid and stable support for optical components and fiber pigtails, critical for maintaining optical alignment over the product's lifetime.
• Broad Portfolio: Our extensive range of standard ceramic packages, from compact TOSA housings to high-pin-count butterfly packages, covers nearly every application.

Application Scenarios

These housings are the building blocks for the internet's infrastructure and other advanced optical systems:

• TOSA/ROSA Modules: For transceivers used in data centers and telecommunication networks (e.g., QSFP28, CFP2).
• Pump Laser Modules: For Erbium-Doped Fiber Amplifiers (EDFAs) in long-haul optical networks.
• Optical Switches: For reconfigurable optical add-drop multiplexers (ROADMs).
• High-Power Lasers: For industrial and medical applications requiring reliable fiber-coupled lasers.

Customer Benefits

• Guaranteed Performance: Build your modules with confidence using packages that are pre-validated for high-speed performance and reliability.
• Reduced Development Risk: Leverage our deep expertise in RF simulation and structural design to get your product to market faster.
• Scalable Manufacturing: Our vertically integrated manufacturing process ensures consistent quality from prototype to high-volume production.
• One-Stop Solution: We provide not only the housing but also matching lids and can support custom substrate design, offering a complete packaging solution.

FAQ (Frequently Asked Questions)