Insulating Electronic Ceramics
3 year ago
High-Performance Metallized Ceramic Substrates for Advanced Electronic Applications
Product Overview
Our metallized Ceramic Substrates are the foundation for next-generation microelectronics. By applying high-purity metallic thin films to advanced ceramic materials like Alumina ($Al_2O_3$) and Aluminum Nitride (AlN), we create high-performance interconnect platforms. These substrates provide a superior solution for applications demanding excellent thermal management, high-frequency electrical performance, and exceptional reliability. From complex RF modules to High-power Laser Packaging, our substrates offer a robust and stable base for mounting and connecting sensitive semiconductor devices, enabling higher power densities and miniaturization.
Technical Specifications: Material Properties
| Parameter | Alumina (99.6% $Al_2O_3$) | Aluminum Nitride (AlN) |
|---|---|---|
| Thermal Conductivity (W/m·K) | ~27 | >170 |
| CTE (ppm/K, RT-400°C) | 7.0 | 4.6 (Closely matches Silicon) |
| Dielectric Constant (@1MHz) | 9.9 | 8.7 |
| Bending Strength (MPa) | ≥592 | ≥400 |
| Surface Roughness (Polished) | ≤0.05 µm | ≤0.05 µm |
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Features & Advantages
- Superior Thermal Management: Aluminum Nitride (AlN) offers exceptional thermal conductivity (>170 W/m·K), efficiently spreading and dissipating heat from high-power devices like GaN transistors and laser diodes.
- Excellent High-Frequency Performance: Low dielectric loss and a smooth surface finish make our substrates ideal for RF and microwave applications, minimizing signal loss.
- Precision Thin-Film Technology: We utilize an advanced LIFT OFF process with a Ti/Pt/Au metallization system to achieve ultra-fine line widths and spaces down to 15µm, enabling high-density circuit designs.
- Integrated Passive Components: We can embed high-precision Tantalum Nitride (TaN) thin-film resistors directly onto the substrate and pre-deposit AuSn solder for simplified assembly.
- High Reliability: Our metallization is robust and demonstrates excellent adhesion, passing reliability tests at 320°C for 3 minutes in air without peeling or blistering.
How It's Made: The LIFT OFF Process
- Substrate Preparation: A high-quality ceramic wafer is cleaned and prepared.
- Photoresist Coating: A layer of photoresist is evenly applied via spin-coating.
- Patterning: The desired circuit pattern is exposed onto the resist using UV light and a photomask.
- Development: The exposed photoresist is washed away, creating a stencil of the circuit.
- Metal Sputtering: A multi-layer metal stack (e.g., Titanium/Platinum/Gold) is deposited over the entire surface.
- Lift Off: The remaining photoresist is dissolved, lifting off the unwanted metal and leaving only the precise circuit traces behind.
Application Scenarios
Our metallized ceramic substrates are critical components in:
- RF and Microwave Power Amplifiers
- Optical Communication Sub-Assemblies (TOSA/ROSA)
- High-Power LED Modules
- Automotive Power Electronics
- Medical and Aerospace Sensing Modules
Customization Options
We are not just a supplier; we are a development partner. Our capabilities include:
- Complex Shapes: Precision laser machining for custom outlines, cavities, and through-holes.
- Multi-layer Designs: Combining thin-film surface layers with thick-film internal layers and tungsten-filled vias for complex 3D routing.
- Side Metallization: Creating conductive pathways on the edges of the substrate for castellated mounting.
FAQ (Frequently Asked Questions)
Q1: When should I choose Aluminum Nitride (AlN) over Alumina ($Al_2O_3$)?
A1: Choose AlN when thermal management is your primary concern. With a thermal conductivity over 6 times higher than Alumina, AlN is the ideal choice for high-power density applications to keep your components cool and reliable. Alumina is an excellent, cost-effective choice for general-purpose and high-frequency applications where heat is less of a concern.
Q2: What is the benefit of pre-deposited AuSn solder?
A2: Pre-depositing AuSn (Gold-Tin) solder onto the substrate pads greatly simplifies your chip-mounting process. It eliminates the need for solder paste or preforms, ensures a precise and repeatable solder volume, and creates a high-reliability, flux-free solder joint, which is critical for hermetic Optoelectronic Packaging.
Q3: What is the typical lead time for custom substrates?
A3: Lead times vary depending on the complexity of the design, material choice, and order volume. Please contact our sales team with your design files (e.g., DXF, Gerber) for an accurate quote and lead time estimate.
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Main Product:
Tungsten Heavy Alloys,
Heat Sink,
Electronic Packaging,
Rhenium Alloys ,
Tantalum Alloys,
Nickel Based Braze Alloy
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