Tungsten Copper Alloy

Customizable Tungsten-Copper (WCu) Alloy Sheets

Our Tungsten-Copper (WCu) alloy sheets are a high-performance Heat Sink Material designed for thermal spreaders, bases, and lids in advanced Electronics Packaging. We offer fully customizable sheets where the material properties, thickness, and dimensions are tailored to meet the specific thermal and mechanical requirements of your application, ensuring optimal heat dissipation and structural integrity.

Technical Specifications

Product Images and Videos

Product Features and Advantages

Uniform Thermal Spreading

The homogeneous microstructure of our WCu sheets ensures uniform and efficient heat spreading, eliminating hot spots and protecting sensitive semiconductor devices.

CTE-Matched for Reliability

We customize the W/Cu ratio to provide a CTE that closely matches that of ceramic substrates (e.g., AlN, Al₂O₃) or chips, making our sheets ideal for direct bonding in high-reliability Ceramic Packages.

Excellent Flatness and Finish

Our sheets are manufactured with superior flatness and surface finish, ensuring an optimal thermal interface when assembled, which is critical for effective Optoelectronic Packaging.

Application Scenarios

• RF & Microwave: Lids and bases for hermetic packages.
• Power Electronics: Base plates and thermal spreaders for IGBT and GaN modules.
• Integrated Circuits: Heat sinks for high-power CPUs, GPUs, and ASICs.
• Optoelectronics: Submounts for laser diode arrays and LEDs.

Benefits for Customers

• Improved Thermal Performance: Effectively manage heat in compact and high-power density designs.
• Enhanced Product Reliability: Reduce the risk of thermal stress-related failures, leading to a longer product lifecycle.
• Simplified Integration: High-quality, flat sheets are easy to integrate into your existing assembly processes.

Certifications and Compliance

All our products are manufactured in our ISO 9001:2015 certified facility, guaranteeing the highest level of quality and process control.

Customization Options

We provide sheets tailored to your needs:

• Custom Composition: To achieve your target CTE and thermal conductivity.
• Custom Sizes: Any length and width combination within our manufacturing limits.
• Custom Thickness: With tight tolerance control.
• Surface Plating: Available with Ni or Ni/Au plating for solderability.

Production Process and Quality Control

Our process involves powder blending, pressing, sintering, and infiltration, followed by precision rolling and surface grinding to achieve the desired thickness and finish. Every sheet is inspected for dimensional accuracy, flatness, and material defects.

Customer Testimonials and Reviews

"The custom WCu sheets we ordered were perfect for our power module base plates. The CTE match was exact, and the thermal performance exceeded our expectations. Excellent quality and service." - Packaging Engineer, Power Semiconductor Company

FAQ

Q1: Can you machine features into the sheets?

A1: Yes, in addition to supplying flat sheets, we can perform secondary CNC machining to add features such as holes, pockets, and steps according to your drawings.

Q2: What is the benefit of using a WCu sheet over a pure copper sheet?

A2: While pure copper has higher thermal conductivity, its CTE is very high (~17 x 10⁻⁶/K). A WCu sheet provides a much lower, customizable CTE that prevents high mechanical stress when bonded to ceramics or semiconductors, which is a common cause of failure with copper.